Method of creating an RFID tag with substantially protected rigid electronic component

• US 20060092026A1
• Filed: 11/02/2004
• Published: 05/04/2006
• Est. Priority Date: 11/02/2004
• Status: Abandoned Application

• Current Assignee: ZIH Corp. (Zebra Technologies Corporation)
• Original Assignee: ZIH Corp. (Zebra Technologies Corporation)
• Inventors: Lawrence, Daniel P., Rigney, Jennifer, Gibson, Daniel
• Application Number:
  US10/979,875
• Publication Number:
  US 20060092026A1
• Time in Patent Office: Days
• US Class Current: 340/572.7
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H05K 1/183 Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

An electronic assembly and method for making the same includes a flexible substrate and a protective layer arranged adjacent to one side of the substrate. The protective layer has a first thickness and defines at least one hole. A first electrical component has a second thickness that is less than or equal to the first thickness. The first electrical component is received in the hole in the protective layer.

Claims

1. An electronic assembly comprising:

a flexible substrate;

a protective layer that is arranged adjacent to one side of said substrate, that has a first thickness and that defines at least one hole; and

a first electrical component that has a second thickness that is less than or equal to said first thickness and that is received in said hole in said protective layer.

2. The electronic assembly of claim 1 wherein said electronic structure further includes a second electrical component that is at least one of attached to and/or printed on said substrate, wherein said first electrical component is attached to said second electrical component.

3. The electronic assembly of claim 2 further comprising conductive adhesive that attaches said first electrical component to said second electrical component.

4. The electronic assembly of claim 2 wherein said protective layer includes double-sided tape.

5. The electronic assembly of claim 1 wherein said protective layer includes pressure sensitive adhesive and a release liner.

6. The electronic assembly of claim 1 further comprising a graphics layer at least one of attached to and/or printed on an opposite side of said substrate.

7. The electronic assembly of claim 1 wherein said flexible substrate comprises a printing web.

8. A system comprising the electronic assembly of claim 5 and further comprising an object, wherein said release liner is removed from said electronic assembly and said pressure sensitive adhesive is used to attach said electronic assembly to said object.

9. The electronic assembly of claim 2 wherein said second electrical component includes an antenna and said first electrical component includes an RFID integrated circuit.

10. The electric assembly of claim 1 wherein said first electrical component includes an integrated circuit.

11. The electrical assembly of claim 1 wherein said flexible substrate is a printing web and further comprising a plurality of said first components that are received in a plurality of said holes and wherein said printing web is rolled after said first electrical components and said protective layer are attached to said printing web.

12. An electronic assembly, comprising:

a printing web;

first electrical components printed on said printing web;

a protective layer that is attached to at least one of said printing web and said first electrical components and that defines holes therein; and

second rigid electrical components that are attached to said first electrical components in said holes;

wherein said protective layer has a first thickness that is greater than or equal to a second thickness of said second rigid electrical component.

13. The electronic assembly of claim 12 further comprising conductive adhesive that attaches said first electrical components to said second electrical components.

14. The electronic assembly of claim 12 wherein said protective layer includes double-sided tape.

15. The electronic assembly of claim 12 wherein said protective layer includes pressure sensitive adhesive and a release liner.

16. The electronic assembly of claim 12 further comprising graphics at least one of attached to and/or printed on an opposite side of said printing web.

17. The electronic assembly of claim 12 wherein said second electrical components include antennas and said first electrical components include RFID integrated circuits.

18. The electric assembly of claim 12 wherein said first electrical component includes an integrated circuit.

19. The electrical assembly of claim 12 wherein said printing web is rolled after said first and second electrical components and said protective layer are attached to said printing web.

20. A method of attaching an integrated circuit to a printing web, comprising:

providing a continuous printing web defining a substrate;

forming holes in a protective layer that has a first thickness;

attaching said protective layer to said substrate; and

attaching first electrical components having a second thickness to said substrate in said holes, wherein said first thickness is greater than or equal to said second thickness.

21. The method of claim 20 further comprising at least one of attaching and/or printing second electrical components on said substrate.

22. The method of claim 21 wherein attaching said first electrical components includes attaching said first electrical components to said second electrical components.

23. The method of claim 21 further comprising using conductive adhesive to attach said first electrical components to said second electrical components.

24. The method of claim 21 wherein said second electrical components comprise an antenna.

25. The method of claim 20 wherein attaching said protective layer comprises attaching a pressure sensitive adhesive to said substrate and a release liner to said pressure sensitive adhesive.