Ink-jet printing of coupling agents for trace or circuit deposition templating

• US 20060093732A1
• Filed: 10/29/2004
• Published: 05/04/2006
• Est. Priority Date: 10/29/2004
• Status: Abandoned Application

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Harding, Philip, Hellekson, Ronald A., Schut, David, Thirukkovalur, Niranjan
• Application Number:
  US10/976,461
• Publication Number:
  US 20060093732A1
• Time in Patent Office: Days
• US Class Current: 427/58
• CPC Class Codes: C23C 18/1608 from pretreatment step, i.e. selective pre-treatment
• CPC Class Codes: C23C 18/1653 Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
• CPC Class Codes: C23C 18/1893 with use of organic or inorganic compounds other than metals, first
• CPC Class Codes: C23C 18/2086 with use of organic or inorganic compounds other than metals, first
• CPC Class Codes: C23C 18/405 Formaldehyde
• CPC Class Codes: H05K 2203/013 Inkjet printing, e.g. for printing insulating material or resist using ink-jet printing to form a conductive pattern H05K3/125
• CPC Class Codes: H05K 3/182 characterised by the patterning method
• CPC Class Codes: H05K 3/389 by the use of a coupling agent, e.g. silane

Abstract

Systems and methods for forming templates for trace or circuit deposition are described. Specifically, a method of forming a template for trace or circuit deposition can comprise steps of jetting an ink-jettable composition onto a substrate in a predetermined pattern, wherein the ink-jettable composition includes a liquid vehicle and at least one coupling agent dispersed therein. The substrate can include functional groups interactive with the coupling agent, wherein upon contact between the coupling agent and the substrate after the jetting step, the coupling agent becomes attached or attracted to the substrate. The method can also include the step of contacting the coupling agent with a metal-containing composition such that a metal of the metal-containing composition becomes attached or attracted to the coupling agent.

Claims

1. A method of forming a template for trace or circuit deposition, comprising steps of:

a) jetting an ink-jettable composition onto a substrate in a predetermined pattern, said ink-jettable composition including a liquid vehicle and at least one coupling agent dispersed therein, said substrate including functional groups interactive with said coupling agent, wherein upon contact between the coupling agent and the substrate after jetting, the coupling agent becomes attached or attracted to the substrate; and

b) contacting the coupling agent with a metal-containing composition such that a metal of the metal-containing composition becomes attached or attracted to the coupling agent.

2. A method as in claim 1, wherein the coupling agent is a silane coupling agent.

3. A method as in claim 2, wherein the silane coupling agent is selected from the group consisting of an amine-containing silane coupling agent, a thiol-containing silane coupling agent, and a carboxylic acid-containing silane coupling agent.

4. A method as in claim 1, wherein the coupling agent is an organic coupling agent.

5. A method as in claim 4, wherein the organic coupling agent is selected from the group consisting of an amine-containing organic coupling agent, a thiol-containing organic coupling agent, and a carboxylic acid-containing organic coupling agent.

6. A method as in claim 1, wherein the substrate comprises a material selected from the group consisting of ceramics, organic polymers, inorganic polymers, cellulose, silicon, and mixtures thereof.

7. A method as in claim 6, wherein the substrate comprises an inorganic polymer, said inorganic polymer being glass.

8. A method as in claim 1, wherein the substrate comprises the organic polymer, said organic polymer being selected from the group consisting of polyethylenes, polypropylenes, polyesters, polyethylene naphthalates, polyethylene terephthalates, polyimides, polycarbonates, acrylics, and copolymers thereof.

9. A method as in claim 1, wherein the contacting step occurs after the jetting step.

10. A method as in claim 1, wherein metal-containing composition includes metallic nanoparticles suspended in a liquid in the form of a liquid suspension, and the contacting step is by contacting the liquid suspension with the coupling agent attached to the substrate.

11. A method as in claim 10, wherein the substrate having the coupling agent attached thereto is dipped in the liquid suspension.

12. A method as in claim 10, wherein the liquid suspension includes from 1 wt % to 15 wt % of the metallic nanoparticles.

13. A method as in claim 1, wherein metal-containing composition is a liquid solution.

14. A method as in claim 1, wherein the metal is in the form of metallic nanoparticles.

15. A method as in claim 14, wherein the metallic nanoparticles are selected from the group consisting of copper, gold, palladium, nickel, silver, rhodium, platinum, Co—

Fe—

B, Co—

Ni—

P, Co—

Ni—

Fe—

B, Ni—

Co, particulate blends thereof, and alloys thereof.

16. A method as in claim 1, wherein the metal is in the form of a metal salt.

17. A method as in claim 16, wherein the metal salt is selected from the group consisting of CuSO₄, PdCl₂, AgNO₃, HfAuCl₄, and combinations thereof.

18. A method as in claim 1, wherein the metal is in the form of an organometallic complex.

19. A method as in claim 18, wherein the organometallic complex is selected from the group consisting of silver salts of organic acids (C₃-C₁₈), metallic coordination complexes of diketones, and combinations thereof.

20. A method as in claim 1, wherein, upon jetting, the coupling agent becomes attached or attracted to the substrate by covalent attachment.

21. A method as in claim 1, wherein the ink-jettable composition further comprises a colorant.

22. A method as in claim 1, wherein the contacting step occurs after the jetting step.

23. A method as in claim 1, wherein the contacting step occurs prior to the jetting step.

24. A method of forming an electrically conductive pathway, comprising steps of:

a) forming a template as in claim 1;

and

b) depositing a trace metal on the template to form the conductive pathway.

25. A method as in claim 24, wherein the depositing step is by electroless deposition.

26. A method as in claim 24, wherein the depositing step is by soldering.

27. A method as in claim 24, wherein conductive pathway is thickened by a step of electroplating.

28. A method as in claim 24, wherein the electrically conductive pathway is in the form of a circuit.

29. A system for forming a template for trace or circuit deposition, comprising:

a) ink-jet architecture containing an ink-jettable composition, said ink-jet architecture configured to jet the ink-jettable composition in a predetermined pattern, said ink-jettable composition including;

i) a liquid vehicle, and

ii) a coupling agent dispersed therein;

b) a substrate suitable for carrying circuitry and configured to receive the predetermined pattern, said substrate including functional groups interactive with said coupling agent, wherein upon contact between the coupling agent and the substrate upon receiving the predetermined pattern, the coupling agents become attached or attracted to the substrate; and

c) a metal-containing composition including a metal interactive with the coupling agent, wherein upon contact between the metal-containing composition, the coupling agent, and the substrate, the metal of the metal-containing composition becomes attached or attracted to the substrate through the coupling agent.

30. A system as in claim 29, wherein the coupling agent is a silane coupling agent.

31. A system as in claim 30, wherein the silane coupling agent is selected from the group consisting of an amine-containing silane coupling agent, a thiol-containing silane coupling agent, and a carboxylic acid-containing silane coupling agent.

32. A system as in claim 29, wherein the coupling agent is an organic coupling agent.

33. A system as in claim 32, wherein the organic coupling agent is selected from the group consisting of an amine-containing organic coupling agent, a thiol-containing organic coupling agent, and a carboxylic acid-containing organic coupling agent.

34. A system as in claim 29, wherein the substrate comprises a material selected from the group consisting of ceramics, organic polymers, inorganic polymers, cellulose, silicon, and mixtures thereof.

35. A system as in claim 29, wherein the substrate comprises the organic polymer, said organic polymer being selected from the group consisting of polyethylenes, polypropylenes, polyesters, polyethylene naphthalates, polyethylene terephthalates, polyimides, terephthalates, polyimides, and copolymers thereof.

36. A method as in claim 29, wherein the metal-containing composition includes metallic nanoparticles suspended in a liquid in the form a liquid suspension.

37. A system as in claim 36, wherein the liquid suspension includes from 1 wt % to 15 wt % of the metallic nanoparticles.

38. A system as in claim 29, wherein metal-containing composition is a liquid solution.

39. A system as in claim 29, wherein the metal is in the form of metallic nanoparticles.

40. A system as in claim 39, wherein the metallic nanoparticles are selected from the group consisting of copper, gold, palladium, nickel, silver, rhodium, platinum, Co—

Fe—

B, Co—

Ni—

P, Co—

Ni—

Fe—

B, Ni—

Co, particulate blends thereof, and alloys thereof.

41. A system as in claim 29, wherein the metal is in the form of a metal salt.

42. A system as in claim 41, wherein the metal salt is selected from the group consisting of CuSO₄, PdCl₂, AgNO₃, HAuCl₄, and combinations thereof.

43. A system as in claim 29, wherein the metal is in the form of an organometallic complex.

44. A system as in claim 43, wherein the organometallic complex is selected from the group consisting of silver salts of organic acids (C₃-C₁₈), metallic coordination complexes of diketones, and combinations thereof.

45. A system as in claim 29, wherein the ink-jettable composition further comprises a colorant.

46. A system as in claim 29, wherein the ink-jettable composition and the metal-containing composition are separate compositions configured for being contacted on or at the substrate.

47. A system as in claim 29, wherein the ink-jettable composition and the metal-containing composition are admixed in the ink-jet architecture.

48. A system for forming trace or circuit, comprising:

a) the system for forming a template of claim 29;

and

b) a trace metal configured for deposition on the template.