Post etch cleaning composition for use with substrates having aluminum

• US 20060094612A1
• Filed: 11/04/2004
• Published: 05/04/2006
• Est. Priority Date: 11/04/2004
• Status: Abandoned Application

• Current Assignee: EKC Technology K.K.
• Original Assignee: EKC Technology K.K.
• Inventors: Kimura, Mayumi
• Application Number:
  US10/980,247
• Publication Number:
  US 20060094612A1
• Time in Patent Office: Days
• US Class Current: 510/175
• CPC Class Codes: C11D 2111/22 Electronic devices, e.g. PCBs or semiconductors
• CPC Class Codes: C11D 3/0073 Anticorrosion compositions
• CPC Class Codes: C11D 3/2086 Hydroxy carboxylic acids-salts thereof
• CPC Class Codes: C11D 3/30 Amines; Substituted amines ; Quaternized amines
• CPC Class Codes: C11D 3/43 Solvents
• CPC Class Codes: C11D 7/265 Carboxylic acids or salts thereof
• CPC Class Codes: C11D 7/266 Esters or carbonates
• CPC Class Codes: C11D 7/3209 Amines or imines with one to four nitrogen atoms; Quaternized amines
• CPC Class Codes: C11D 7/3218 Alkanolamines or alkanolimines
• CPC Class Codes: C11D 7/5004 Organic solvents
• CPC Class Codes: G03F 7/425 containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
• CPC Class Codes: G03F 7/426 containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides

Abstract

A composition used for removing a photoresist, polymeric material, or residue from a substrate contains a corrosion inhibitor that is a derivative of gallic acid that is soluble in water-miscible organic solvents, water, at least one organic amine, and two or more water-miscible organic solvents. The composition may further contain a surfactant. Use of this composition reduces resist reattachment, reduces corrosion, and improves peelability.

Claims

14. A composition used for removing a photoresist or other polymeric material or residue from a substrate comprising a corrosion inhibitor that is a derivative of gallic acid that is soluble in water-miscible organic solvents, water, at least one organic amine, two or more water-miscible organic solvents, and a surfactant.

1. A composition used for removing a photoresist, polymeric material, or residue from a substrate comprising a corrosion inhibitor that is a derivative of gallic acid that is soluble in water-miscible organic solvents, water, at least one organic amine, and two or more water-miscible organic solvents.

2. The composition of claim 1, wherein the corrosion inhibitor is propyl gallate.

3. The composition of claim 1, wherein the corrosion inhibitor comprises from about 0.01 to about 10% by weight propyl gallate.

4. The composition of claim 1, wherein the corrosion inhibitor comprises from about 2 to about 6% by weight propyl gallate.

5. The composition of claim 1, wherein the at least one organic amine is an alkanolamine.

6. The composition of claim 1, wherein the at least one organic amine is a monoamine, diamine, or triamine having hydroxyl groups with 1-5 carbon atoms.

7. The composition of claim 1, wherein the at least one organic amine is selected from the group consisting of monoethanolamine, diglycolamine, and isopropanolamine.

8. The composition of claim 1, wherein the at least one organic amine ranges from about 2.5 to about 40% by weight.

9. The composition of claim 1, wherein at least one of the two or more water-miscible organic solvents is selected from the group consisting of glycol ethers, sulfoxides, amides, pyrrolidones, lactones, and derivatives of oxycarboxylic acids.

10. The composition of claim 1, wherein the two or more water-miscible organic solvents comprise a mixture of glycol ethers and sulfoxides.

11. The composition of claim 1, wherein the two or more water-miscible organic solvents comprise a mixture of diethylene glycol monobutyl ether and dimethyl sulfoxide.

12. The composition of claim 1, wherein the two or more water-miscible organic solvents comprise a mixture of from about 5 to about 70% by weight diethylene glycol monobutyl ether and from about 5 to about 70% by weight dimethyl sulfoxide.

13. The composition of claim 1, wherein the water is from about 5 to about 90% by weight.

15. The composition of claim 14, wherein the surfactant is selected from the group consisting of cationic surfactants, anionic surfactants, nonionic surfactants, and betaine.

16. The composition of claim 14, wherein the surfactant is a nonionic surfactant.

17. The composition of claim 14, wherein the surfactant is a nonionic surfactant of from about 0.01 to about 2% by weight.

18. The composition of claims 14, wherein the surfactant is miscible with water and water-soluble organic solvents.

19. The composition of claim 1, further comprising a hydroxylamine compound.

20. The composition of claim 1, further comprising hydroxylamine.

21. The composition described in claim 1, characterized by the fact that the composition contains no component that is gelled even if water is evaporated during use.

22. The composition described in claim 2, characterized by the fact that the composition contains no component that is gelled even if water is evaporated during use.

23. The composition described in claim 14, characterized by the fact that the composition contains no component that is gelled even if water is evaporated during use.

24. The composition described in claims 15, characterized by the fact that the composition contains no component that is gelled even if water is evaporated during use.

25. The composition described in claim 1, characterized by the fact that the substances used for this composition contain no component that can be gelled even if water is evaporated during use.

26. A method for removing photoresist or other polymeric material or residue from a substrate comprising contacting the composition of claim 1 with the substrate.

27. The method of claim 21, further comprising a water rinsing operation without using an intermediate rinsing operation.

25-1. The composition described in claim 14, characterized by the fact that the substances used for this composition contain no component that can be gelled even if water is evaporated during use.