Microelectromechanical (MEM) device including a spring release bridge and method of making the same

• US 20060096377A1
• Filed: 11/09/2004
• Published: 05/11/2006
• Est. Priority Date: 11/09/2004
• Status: Active Grant

• Current Assignee: North Star Innovations Inc. (Wi-LAN Inc.)
• Original Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Inventors: Gogoi, Bishnu Prasanna
• Granted Patent: US 7,273,762 B2
• Time in Patent Office: Days
• US Class Current: 73/514.16
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2203/0109 Bridges
• CPC Class Codes: B81C 1/00936 Releasing the movable structure without liquid etchant
• CPC Class Codes: B81C 2201/0109 Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 2015/0814 for translational movement of the mass, e.g. shuttle type

Abstract

A microelectromechanical (MEM) device includes a substrate, a suspension spring, a structure, and a release bridge. The suspension spring is coupled to, and suspended above, the substrate. The structure is coupled to the suspension spring and is resiliently suspended thereby above the substrate. The release bridge is coupled to the suspension spring. During sensor manufacture, the suspension spring and structure are suspended above the substrate by undergoing a release process. The release bridge is sized such that, during the release process, the structure and the suspension spring are released substantially simultaneously.

Claims

14. A method of forming an inertial sensor on a substrate, comprising the steps of:

forming a sacrificial layer on a surface of the substrate;

forming an active layer over at least a portion of the sacrificial layer;

forming at least an anchor region and a suspension region in the active layer, the suspension region having formed therein at least a structure, a suspension spring, and a release bridge, the suspension spring coupled between the anchor region and the structure, and the release bridge coupled to the suspension spring; and

removing at least a portion of the sacrificial layer to thereby release the structure, the release bridge, and the suspension spring from the substrate,

wherein the release bridge is sized such that the structure and the suspension spring are released substantially simultaneously during sacrificial layer removal.

15. The method of claim 14, further comprising:

forming a plurality of etch openings in the active layer; and

exposing the sacrificial layer to a first etchant via the etch openings, whereby at least a portion of the sacrificial layer is removed.

16. The method of claim 15, wherein at least the structure and release bridge are not released when the sacrificial layer is exposed to the first etchant, whereby the suspension spring is also not released.

17. The method of claim 16, further comprising:

exposing the sacrificial layer to a second etchant to thereby release the structure and release bridge substantially simultaneously, whereby the suspension spring and structure are released substantially simultaneously.

18. The method of claim 15, further comprising:

depositing a backfill material in at least selected ones of the etch openings;

exposing at least the deposited backfill material to a first etchant to thereby remove at least a substantial portion of the backfill material; and

exposing the sacrificial layer to a second etchant, whereby at least a portion of the sacrificial layer is removed to thereby release the structure, the release bridge, and the suspension spring.

19. The method of claim 18, wherein the backfill material comprises phosphosilicate glass.

20. The method of claim 18, wherein:

the first etchant is an aqueous etchant; and

the second etchant is a vapor etchant.

21. The method of claim 20, wherein the aqueous etchant comprises aqueous hydrofluoric acid (HF)

22. The method of claim 20, wherein the vapor etchant comprises HF vapor.

23. The method of claim 14, wherein:

the suspension spring has at least first and second ends; and

the release bridge is formed at least proximate the suspension spring first end, and a second release bridge is formed at least proximate the suspension spring second end.

24. The method of claim 14, wherein the suspension region further includes:

a second suspension spring coupled between the anchor region and the structure; and

a second release bridge coupled between the anchor region and the second suspension spring.

25. The method of claim 24, wherein:

each suspension spring has at least a first end and a second end; and

a release bridge is formed at least proximate each of the first and second ends of each suspension spring.

26. The method of claim 14, wherein:

the structure, release bridge, and suspension spring are released by undercutting the sacrificial layer; and

the release bridge is sized substantially equivalent to a largest undercut needed to release at least the structure.

29. The MEM device of claim 25, wherein:

the suspension spring has at least a first end and a second end; and

the release bridge is formed at least proximate the suspension spring first end and a second release bridge is formed at least proximate the suspension spring second end.

27. A microelectromechanical (MEM) device, comprising:

a substrate;

a suspension spring coupled to, and suspended above, the substrate;

a structure coupled to the suspension spring and resiliently suspended thereby above the substrate; and

a release bridge coupled to the suspension spring,

wherein;

the suspension spring and structure are suspended above the substrate by undergoing a release process, and

the release bridge is sized such that, during the release process, the structure and the suspension spring are released substantially simultaneously.

1. A method of forming a microelectromechanical (MEM) device on a substrate including at least an active layer, and a sacrificial layer disposed at least partially therebetween, the method comprising the steps of:

forming at least an anchor region and a suspension region in the active layer, the suspension region having formed therein at least a structure, a suspension spring, and a release bridge, the suspension spring coupled between the anchor region and the structure, the release bridge coupled to the suspension spring; and

removing at least a portion of the sacrificial layer to thereby release the structure, the release bridge, and the suspension spring from the substrate,

wherein the release bridge is sized such that the structure and the suspension spring are released substantially simultaneously during sacrificial layer removal.

2. The method of claim 1, further comprising:

forming a plurality of etch openings in the active layer; and

exposing the sacrificial layer to a first etchant via the etch openings, whereby at least a portion of the sacrificial layer is removed.

3. The method of claim 2, wherein at least the structure and release bridge are not released when the sacrificial layer is exposed to the first etchant, whereby the suspension spring is also not released.

4. The method of claim 3, further comprising:

exposing the sacrificial layer to a second etchant to thereby release the structure and release bridge substantially simultaneously, whereby the suspension spring and structure are released substantially simultaneously.

5. The method of claim 2, further comprising:

depositing a backfill material in at least selected ones of the etch openings;

exposing at least the deposited backfill material to a first etchant to thereby remove at least a substantial portion of the backfill material; and

exposing the sacrificial layer to a second etchant, whereby at least a portion of the sacrificial layer is removed to thereby release the structure, the release bridge, and the suspension spring.

6. The method of claim 5, wherein the backfill material comprises phosphosilicate glass.

7. The method of claim 5, wherein:

the first etchant is an aqueous etchant; and

the second etchant is a vapor etchant.

8. The method of claim 7, wherein the aqueous etchant comprises aqueous hydrofluoric acid (HF).

9. The method of claim 7, wherein the vapor etchant comprises HF vapor.

10. The method of claim 1, wherein:

the suspension spring has at least first and second ends; and

the release bridge is formed at least proximate the suspension spring first end, and a second release bridge is formed at least proximate the suspension spring second end.

11. The method of claim 1, wherein the suspension region further includes:

a second suspension spring coupled between the anchor region and the structure; and

a second release bridge coupled between the anchor region and the second suspension spring.

12. The method of claim 11, wherein:

each suspension spring has at least a first end and a second end; and

a release bridge is formed at least proximate each of the first and second ends of each suspension spring.

13. The method of claim 1, wherein:

the structure, release bridge, and suspension spring are released by undercutting the sacrificial layer; and

the release bridge is sized substantially equivalent to a largest undercut needed to release at least the structure.

28. The MEM device of claim 27, further comprising:

a plurality of moving electrodes coupled to the structure and suspended thereby above the substrate; and

a plurality of fixed electrodes coupled to the substrate, each moving electrode disposed proximate at least one of the moving electrodes.

30. The MEM device of claim 28, wherein:

each suspension spring has at least a first end and a second end; and

a release bridge is formed at least proximate each of the first and second ends of each suspension spring.

31. The MEM device of claim 27, wherein:

the structure, release bridge, and suspension spring are released by an undercut process; and

the release bridge is sized substantially equivalent to a largest undercut needed to release at least the structure.

28-1. The MEM device of claim 27, further comprising:

a second suspension spring coupled to, and suspended above, the substrate, the second suspension spring coupled to the structure,

wherein a second release bridge is coupled to the second suspension spring.