Light emitting diode component

• US 20060097245A1
• Filed: 12/20/2005
• Published: 05/11/2006
• Est. Priority Date: 08/30/2002
• Status: Active Grant

• Current Assignee: Savant Technologies, LLC (Savant Systems, LLC)
• Original Assignee: GE Lighting Solutions LLC (Savant Systems, LLC)
• Inventors: Stimac, Tomislav J., Stadelman, Larry R., Radkov, Emil V., Reginelli, James, Mrakovich, Matthew, Aanegola, Srinath K.
• Granted Patent: US 7,800,121 B2
• Time in Patent Office: Days
• US Class Current: 257/26
• CPC Class Codes: F21K 9/68 Details of reflectors forming part of the light source
• CPC Class Codes: F21V 23/00 Arrangement of electric circuit elements in or on lighting devices characterised by cooling arrangements F21V29/508
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body

Abstract

In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

Claims

1. A lighting package comprising:

at least one light emitting die;

a printed circuit board supporting the at least one light emitting die;

a light-transmissive cover disposed over the at least one light emitting die; and

at least one phosphor composition comprising at least one phosphor compound disposed on or inside of the light transmissive cover, the at least one phosphor composition outputting converted light responsive to irradiation by the at least one light emitting die.

2. The lighting package as set forth in claim 1, wherein the at least one phosphor composition comprises:

at least two different phosphor compositions each comprising at least one phosphor compound disposed on or inside of the light transmissive cover, the different phosphor compositions producing converted light at about the same color point but with different color rendering index (CRI) values.

3. The lighting package as set forth in claim 2, wherein the color points of the converted light of the at least two different constituent phosphor compositions lie within about 0.020 units of each other in both x and y color coordinates on the 1931 CIE chromaticity diagram.

4. The lighting package as set forth in claim 2, wherein the converted light of the different phosphor compositions blended with bleed-through light produced by the at least one light emitting die lies on or substantially on the black body locus of the 1931 CIE chromaticity diagram.

5. The lighting package as set forth in claim 4, wherein the converted light of the different phosphor compositions blended with bleed-through light produced by the at least one light emitting die is white light or substantially white light with a color temperature of less than about 4500 K.

6. The lighting package as set forth in claim 4, wherein the converted light of the different phosphor compositions blended with bleed-through light produced by the at least one light emitting die is white light with a color rendering index (CRI) of 90 or greater.

7. The lighting package as set forth in claim 4, wherein the bleed-through light produced by the at least one light emitting die has a negligible contribution to the visible spectrum of the converted light of the different phosphor compositions blended with bleed-through light produced by the at least one light emitting die.

8. The lighting package as set forth in claim 4, wherein the bleed-through light produced by the at least one light emitting die is blue or bluish light.

9. The lighting package as set forth in claim 1, wherein the at least one light-emitting die emits ultraviolet light, and the lighting package further comprises:

an ultraviolet-reflective coating on the light-transmissive cover; and

an ultraviolet-reflective coating on the printed circuit board.

10. The lighting package as set forth in claim 1, wherein the at least one light emitting die emits radiation having a peak emission in a range of 200-500 nm that is absorbed by the phosphor and the converted light combined with said radiation having a peak emission in the range of 200-500 nm is white light.

11. The lighting package as set forth in claim 1, wherein the at least one phosphor composition includes at least two phosphor compounds selected from the group consisting of:

(Ba,Sr,Ca)₅(PO₄)₃Cl;

Eu²⁺,

Sr₄Al₁₄O₂₅;

Eu²⁺,

(Ca,Sr,Ba)₂Si<sub>1−

c</sub>O<sub>4−

2c</sub>;

Eu²⁺ where 0≦

c<

0.25, and

3.5MgO*0.5MgF₂*GeO₂;

Mn⁴⁺.

12. The lighting package as set forth in claim 1, wherein the at least one phosphor composition includes at least one phosphor compound selected from a group consisting of:

(Mg,Ca,Sr,Ba,Zn)₅(PO₄)₃Cl;

Eu²⁺

(Ca,Sr,Ba)₂Si<sub>1−

c</sub>O<sub>4−

2c</sub>;

Eu²⁺ where 0≦

c<

0.25

(Ba,Sr,Ca)₅(PO₄)₃(Cl,F,Br,OH);

Sb³⁺,Mn²⁺

(Mg,Ca,Sr,Ba,Zn)₅(PO₄)₃(F,Cl,Br,OH);

Eu²⁺,Mn²⁺

(Ba,Sr,Ca)BPO₅;

Eu²⁺,Mn²⁺

(Sr,Ca)₁₀(PO₄)₆*nB₂O₃;

Eu²⁺

Sr₂Si₃O₈*2SrCl₂;

Eu²⁺

Sr₄Al₁₄O₂₅;

Eu²⁺

(Ca,Sr,Ba)MgAl₁₀O₁₇;

Eu²⁺,Mn⁺

Ba₃MgSi₂O₈;

Eu²⁺

BaAl₈O₁₃;

Eu²⁺

2SrO*0.84P₂O₅*0.16B₂O₃;

Eu²⁺;

(Ba,Sr,Ca)Al₂O₄;

Eu²⁺

(Y,Gd,Lu,Sc,La)BO₃;

Ce³⁺,Tb³⁺

Ca₈Mg(SiO₄)₄Cl₂;

Eu²⁺,Mn²⁺

(Ba,Sr,Ca)₂(Mg,Zn)Si₂O₇;

Eu²⁺

(Sr,Ca,Ba)(Al,Ga,In)₂S₄;

Eu²⁺

(Y,Gd,Tb,La,Sm,Pr,Lu)₃(Al,Ga)<sub>5−

f</sub>O<sub>12−

3/f</sub>;

Ce³⁺ (wherein 0≦

f≦

0.5)

(Lu,Y,Sc)<sub>2−

g</sub>(Ca,Mg)_1+gLi_hMg<sub>2−

b</sub>(Si,Ge)<sub>3−

h</sub>P_hO<sub>12−

g</sub>;

Ce³⁺ (wherein 0≦

g≦

0.5, 0≦

h≦

0.5)

(Ca,Sr)₈(Mg,Zn)(SiO₄)₄Cl₂;

Eu²⁺,Mn²⁺

Na₂Gd₂B₂O₇;

Ce³⁺,Tb³⁺

(Sr,Ca,Ba,Mg,Zn)₂P₂O₇;

Eu²⁺,Mn²⁺

(Ca,Sr,Ba,Mg, Zn)₁₀(PO₄)₆(F,Cl,Br,OH)₂;

Eu²⁺,Mn²⁺

(Gd,Y,Lu,La)₂O₃;

Eu³⁺,Bi³⁺

(Gd,Y,Lu,La)₂O₂S;

Eu³⁺,Bi³⁺

(Gd,Y,Lu,La)VO₄;

Eu³⁺,Bi³⁺

SrY₂S₄;

Eu²⁺

CaLa₂S₄;

Ce³⁺

(Ca,Sr)S;

Eu²⁺

(Ba,Sr,Ca)MgP₂O₇;

Eu²⁺,Mn⁺

(Y,Lu)₂WO₆;

Eu³⁺,Mo⁶⁺

(Ba,Sr,Ca)_uSi_v(N,O)_w;

Eu²⁺

(Lu,Ca,Li,Mg,Y)alpha-SiAlON doped with Eu²⁺ and/or Ce³⁺

(Y,Lu,Gd)<sub>2−

t</sub>Ca_tSi₄N_6+tC<sub>1−

t</sub>;

Ce³⁺ (wherein 0≦

t≦

0.5)

3.5MgO*0.5MgF₂*GeO₂;

Mn⁴⁺

A₂[MF₆];

Mn⁴⁺, where A=Li, Na, K, Rb or Cs and M=Ge, Si, Sn, Ti or Zr

Ca<sub>1−

d−

e</sub>Ce_dEu_eAl<sub>1−

d</sub>(Mg,Zn)_dSiN₃.

13. The lighting package as set forth in claim 1, wherein the at least one phosphor composition comprises:

a green phosphor composition including phosphor compounds Sr₄Al₁₄O₂₅;

Eu²⁺ and (Ca,Sr,Ba)MgAl₁₀O₁₇;

Eu²⁺,Mn²⁺.

14. The lighting package as set forth in claim 1, wherein the at least one phosphor composition is selectively disposed on the light-transmissive cover to define a selected depiction.

15. The lighting package as set forth in claim 14, wherein the at least one phosphor composition includes at least two different phosphor compositions disposed on different regions on the light-transmissive cover to define the selected depiction.

16. The lighting package as set forth in claim 1, wherein the at least one phosphor composition comprises:

a first phosphor composition disposed in a first spatial region on or inside of the light transmissive cover; and

a second phosphor composition different from the first phosphor composition by at least one phosphor compound, the second phosphor composition being disposed in a second spatial region on or inside of the light transmissive cover that is different from the first spatial region.

17. The lighting package as set forth in claim 16, wherein the first and second phosphor compositions produce converted light at about the same color point but with different color rendering index (CRI) values.

18. The lighting apparatus as set forth in claim 16, wherein the first and second spatial regions are first and second phosphor composition layers disposed on the light transmissive cover.

29. The lighting package as set forth in claim 1, wherein the printed circuit board includes edge terminals adapted for connection with a DIN-type rail lighting fixture.

19. A lighting package comprising:

at least one light emitting die;

a printed circuit board supporting the at least one light emitting die;

a light-transmissive cover disposed over the at least one light emitting die; and

an encapsulant substantially filling an interior volume defined by the light-transmissive cover and the printed circuit board.

20. The lighting package as set forth in claim 19, wherein at least one phosphor composition is dispersed in the encapsulant that substantially fills the interior volume.

21. The lighting package as set forth in claim 19, further comprising:

light-scattering particles or particulates dispersed in the encapsulant.

22. The lighting package as set forth in claim 19, wherein the encapsulant is an optical gel.

23. The lighting package as set forth in claim 19, wherein the encapsulant is silicone.

24. A lighting package comprising:

at least one light emitting die;

a printed circuit board supporting the at least one light emitting die;

a light-transmissive cover disposed over the at least one light emitting die; and

electrical power-conditioning circuitry disposed on the printed circuit board and configured to condition received input power to energize the supported at least one light emitting die.

25. The lighting package as set forth in claim 24, wherein the power-conditioning circuitry includes at least one of a group consisting of:

voltage stabilizing circuitry, current-limiting circuitry, rectifying circuitry, and a zener diode.

26. The lighting package as set forth in claim 24, wherein the light-transmissive cover is dome-shaped, and the lighting package further comprises:

an anti-shatter coating disposed on the light-transmissive dome-shaped cover.

27. The lighting package as set forth in claim 24, wherein the light-transmissive cover comprises a plurality of light-transmissive covers disposed over the printed circuit board, each covering at least one light emitting die.

28. The lighting package as set forth in claim 27, wherein the printed circuit board is a flexible printed circuit board.