Sensor device

• US 20060097331A1
• Filed: 12/06/2005
• Published: 05/11/2006
• Est. Priority Date: 12/06/2004
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Sakai, Minekazu, Hattori, Koji, Abe, Ryuichiro, Yoneyama, Takao, Yamauchi, Shigenori
• Granted Patent: US 7,327,004 B2
• Time in Patent Office: Days
• US Class Current: 257/414
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: B81C 1/00238 Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
• CPC Class Codes: G01C 19/5719 using planar vibrating masses driven in a translation vibration along an axis
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Abstract

A sensor device includes a sensor chip having a movable portion on one surface, a circuit chip laminated with the sensor chip to be opposite to the movable portion of the sensor chip, and a bump located between the sensor chip and the circuit chip. In the sensor device, the sensor chip and the circuit chip are electrically connected through the bump, and the movable portion of the sensor chip is separated from the circuit chip by a space using the bump. Accordingly, it can effectively restrict parasitic capacity of an electric connecting portion between both the chips from being changed by an impact. For example, the sensor device can be used as an angular velocity sensor device having a vibrator as the movable portion.

Claims

1. A sensor device comprising:

a sensor chip having a movable portion on one surface;

a circuit chip laminated with the sensor chip to be opposite to the movable portion of the sensor chip; and

a bump located between the sensor chip and the circuit chip,

wherein the sensor chip and the circuit chip are electrically connected through the bump, and the movable portion of the sensor chip is separated from the circuit chip by a space using the bump.

2. The sensor device according to claim 1, further comprising

an adhesive member having an electric insulating property, wherein:

the adhesive member is arranged between the sensor chip and the circuit chip, for bonding both the sensor chip and the circuit chip; and

the adhesive member is separated from the movable portion of the sensor chip.

3. The sensor device according to claim 2, wherein the adhesive member is arranged around the bump and seals the bump.

4. The sensor device according to claim 2, wherein:

the adhesive member is arranged to surround the movable portion between the sensor chip and the circuit chip; and

the movable portion positioned at an inner peripheral side of the adhesive member is sealed by the adhesive member.

5. The sensor device according to claim 2, wherein the adhesive member is constructed with an adhesive film.

6. The sensor device according to claim 5, wherein:

the adhesive film has a first portion opposite to the movable portion and a second portion positioned outside from the first portion; and

the first portion of the adhesive film is made thinner than the second portion of the adhesive film to form a concave portion recessed from a surface on a side the movable portion.

7. The sensor device according to claim 5, wherein the adhesive film has a convex portion protruding in a direction separating from the movable portion.

8. The sensor device according to claim 2, wherein the adhesive member is constructed with a film formed by a printing.

9. The sensor device according to claim 2, wherein the adhesive member is provided to form a seal portion for sealing the movable portion around the movable portion, the sensor device further comprising

a coating member which covers the seal portion.

10. The sensor device according to claim 1, wherein the bump includes a plurality of bump parts which are arranged in point-symmetry with respect to a center of the sensor chip.

11. The sensor device according to claim 1, wherein the bump includes a plurality of bump parts which are separately arranged around the movable portion.

12. The sensor device according to claim 11, further comprising

an adhesive member having an electric insulating property, wherein:

the adhesive member is arranged between the sensor chip and the circuit chip, for bonding both the sensor chip and the circuit chip; and

the adhesive member is arranged around the movable portion of the sensor chip.

13. The sensor device according to claim 12, wherein the bump parts are located in an area where the adhesive member is arranged.

14. The sensor device according to claim 12, wherein the adhesive member is located outside of the bump parts to surround the bump parts.

15. The sensor device according to claim 12, wherein:

the adhesive member includes a plurality of adhesive parts which are arranged around the movable portion; and

the adhesive parts are arranged to surround the bump parts, respectively.

16. The sensor device according to claim 12, wherein:

the adhesive member includes a plurality of adhesive parts which are arranged around the movable portion; and

the adhesive parts are arranged at positions different from the bump parts, respectively.

17. The sensor device according to claim 1, further comprising

a package having a space in which the circuit chip and the sensor chip are located;

and

an additional bump through which the circuit chip is electrically connected to an electrical portion of the package.