Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same

• US 20060097385A1
• Filed: 10/25/2004
• Published: 05/11/2006
• Est. Priority Date: 10/25/2004
• Status: Abandoned Application

• Current Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Negley, Gerald H.
• Application Number:
  US10/972,910
• Publication Number:
  US 20060097385A1
• Time in Patent Office: Days
• US Class Current: 257/722
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 characterized by the materials
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H05K 1/053 the metal substrate being covered by an inorganic insulating layer

Abstract

A mounting substrate for a semiconductor light emitting device includes a solid metal block having first and second opposing metal faces. The first metal face includes a cavity that is configured to mount at least one semiconductor light emitting device therein, and to reflect light that is emitted by at least one semiconductor light emitting device that is mounted therein away from the cavity. The second metal face includes heat sink fins therein. One or more semiconductor light emitting devices are mounted in the cavity. Reflective coatings, conductive traces, insulating layers, pedestals, through holes, lenses, flexible films, optical elements, phosphor, integrated circuits and/or optical coupling media also may be provided in the package. Related packaging methods also may be provided.

Claims

1. A mounting substrate for a semiconductor light emitting device comprising:

a solid metal block including first and second opposing metal faces;

the first metal face including therein a cavity that is configured to mount at least one semiconductor light emitting device therein and to reflect light that is emitted by at least one semiconductor light emitting device that is mounted therein away from the cavity; and

the second metal face including therein a plurality of heat sink fins.

2. A mounting substrate according to claim 1 further comprising a reflective coating in the cavity.

3. A mounting substrate according to claim 1 further comprising first and second conductive traces in the cavity that are configured to connect to at least one semiconductor light emitting device that is mounted in the cavity.

4. A mounting substrate according to claim 1 further comprising:

an insulating layer on the first metal face; and

a conductive layer on the insulating layer that is patterned to provide a reflective coating in the cavity and first and second conductive traces in the cavity that are configured to connect to at least one semiconductor light emitting device that is mounted in the cavity.

5. A mounting substrate according to claim 4 wherein the solid metal block comprises a solid aluminum block and wherein the insulating layer comprises aluminum oxide.

6. A mounting substrate according to claim 4 wherein the solid metal block comprises a solid steel block and wherein the insulating layer comprises ceramic.

7. A mounting substrate according to claim 1 wherein the first metal face further includes a pedestal therein and wherein the cavity is in the pedestal.

8. A mounting substrate according to claim 3 wherein the solid metal block includes a through hole therein that extends from the first face to the second face and wherein the through hole includes a conductive via therein that is electrically connected to the first or second conductive traces.

9. A mounting substrate according to claim 1 in combination with at least one semiconductor light emitting device that is mounted in the cavity.

10. A mounting substrate according to claim 9 in further combination with a lens that extends across the cavity.

11. A mounting substrate according to claim 7 in combination with at least one semiconductor light emitting device that is mounted in the cavity in the pedestal.

12. A mounting substrate according to claim 11 in further combination with a lens that extends across the pedestal and across the cavity.

13. A mounting substrate according to claim 9 in further combination with a flexible film that includes an optical element therein on the first metal face, wherein the optical element extends across the cavity.

14. A mounting substrate according to claim 11 in further combination with a flexible film that includes an optical element therein on the first metal face, wherein the optical element extends across the pedestal and across the cavity.

15. A mounting substrate according to claim 13 wherein the optical element comprises a lens.

16. A mounting substrate according to claim 14 wherein the optical element comprises a lens.

17. A mounting substrate according to claim 10 in further combination with a coating comprising phosphor on the lens.

18. A mounting substrate according to claim 12 in further combination with a coating comprising phosphor on the lens.

19. A mounting substrate according to claim 13 in further combination with a coating comprising phosphor on the optical element.

20. A mounting substrate according to claim 14 in further combination with a coating comprising phosphor on the optical element.

21. A mounting substrate according to claim 10 wherein the lens includes phosphor dispersed therein.

22. A mounting substrate according to claim 12 wherein the lens includes phosphor dispersed therein.

23. A mounting substrate according to claim 13 wherein the optical element includes phosphor dispersed therein.

24. A mounting substrate according to claim 14 wherein the optical element includes phosphor dispersed therein.

25. A mounting substrate according to claim 9 in further combination with a coating comprising phosphor on the at least one semiconductor light emitting device.

26. A mounting substrate according to claim 11 in further combination with a coating comprising phosphor on the at least one semiconductor light emitting device.

27. A mounting substrate according to claim 3 further comprising an integrated circuit on the solid metal block that is electrically connected to the first and second traces.

28. A mounting substrate according to claim 3 further comprising a semiconductor light emitting device driver integrated circuit on the solid metal block that is electrically connected to the first and second traces.

29. A mounting substrate according to claim 9 wherein the at least one semiconductor light emitting device comprises at least one light emitting diode.

30. A mounting substrate according to claim 9 in combination with an optical coupling media in the cavity at least partially surrounding the light emitting device.

31. A mounting substrate for semiconductor light emitting devices comprising:

a solid metal block including first and second opposing metal faces;

the first metal face including therein a plurality of cavities, a respective one of which is configured to mount at least one semiconductor light emitting device therein and to reflect light that is emitted by the at least one semiconductor light emitting device that is mounted therein away from the respective cavity; and

the second metal face including therein a plurality of heat sink fins.

32. A mounting substrate according to claim 31 further comprising a reflective coating in the plurality of cavities.

33. A mounting substrate according to claim 31 further comprising first and second conductive traces on the first face that extend into the plurality of cavities and are configured to connect to at least one semiconductor light emitting device that is mounted in the respective cavity.

34. A mounting substrate according to claim 31 further comprising:

an insulating layer on the first metal face; and

a conductive layer on the insulating layer that is patterned to provide a reflective coating in the plurality of cavities and first and second conductive traces on the first face that extend into the plurality of cavities and are configured to connect to at least one semiconductor light emitting device that is mounted in the cavity.

35. A mounting substrate according to claim 34 wherein the solid metal block comprises a solid aluminum block and wherein the insulating layer comprises aluminum oxide.

36. A mounting substrate according to claim 34 wherein the solid metal block comprises a solid steel block and wherein the insulating layer comprises ceramic.

37. A mounting substrate according to claim 31 wherein the first metal face further includes a plurality of pedestals therein and wherein a respective one of the plurality of cavities is in a respective one of the plurality of pedestals.

38. A mounting substrate according to claim 33 wherein the solid metal block includes a through hole therein that extends from the first face to the second face and wherein the through hole includes a conductive via therein that is electrically connected to the first or second conductive traces.

39. A mounting substrate according to claim 31 in combination with at least one semiconductor light emitting device that is mounted in a respective cavity.

40. A mounting substrate according to claim 39 in further combination with a plurality of lenses, a respective one of which extends across a respective one of the cavities.

41. A mounting substrate according to claim 37 in combination with at least one semiconductor light emitting device that is mounted in a respective cavity in a respective pedestal.

42. A mounting substrate according to claim 41 in further combination with a plurality of lenses, a respective one of which extends across a respective one of the pedestals and across a respective one of the cavities.

43. A mounting substrate according to claim 39 in further combination with a flexible film that includes a plurality of optical elements therein on the first metal face, wherein a respective optical element extends across a respective cavity.

44. A mounting substrate according to claim 41 in further combination with a flexible film that includes a plurality of optical elements therein on the first metal face, wherein a respective optical element extends across a respective pedestal and across a respective cavity.

45. A mounting substrate according to claim 43 wherein the optical element comprises a lens.

46. A mounting substrate according to claim 44 wherein the optical element comprises a lens.

47. A mounting substrate according to claim 40 in further combination with a coating comprising phosphor on the lenses.

48. A mounting substrate according to claim 42 in further combination with a coating comprising phosphor on the lenses.

49. A mounting substrate according to claim 43 in further combination with a coating comprising phosphor on the optical elements.

50. A mounting substrate according to claim 44 in further combination with a coating comprising phosphor on the optical elements.

51. A mounting substrate according to claim 40 wherein the lenses include phosphor dispersed therein.

52. A mounting substrate according to claim 42 wherein the lenses include phosphor dispersed therein.

53. A mounting substrate according to claim 43 wherein the optical elements include phosphor dispersed therein.

54. A mounting substrate according to claim 44 wherein the optical elements include phosphor dispersed therein.

55. A mounting substrate according to claim 39 in further combination with a coating comprising phosphor on the semiconductor light emitting device.

56. A mounting substrate according to claim 41 in further combination with a coating comprising phosphor on the semiconductor light emitting device.

57. A mounting substrate according to claim 33 further comprising an integrated circuit on the solid metal block that is electrically connected to the first and second traces.

58. A mounting substrate according to claim 33 further comprising a semiconductor light emitting device driver integrated circuit on the solid metal block that is electrically connected to the first and second traces.

59. A mounting substrate according to claim 39 wherein the semiconductor light emitting devices comprise light emitting diodes.

60. A mounting substrate according to claim 39 in combination with an optical coupling media in the cavities at least partially surrounding the light emitting devices.

61. A mounting substrate according to claim 31 wherein the plurality of cavities are uniformly and/or nonuniformly spaced apart from one another in the first face.

62. A semiconductor light emitting device packaging method comprising:

fabricating a solid metal block including first and second opposing metal faces, the first metal face including therein a plurality of cavities, a respective one of which is configured to mount at least one semiconductor light emitting device therein and to reflect light that is emitted by the at least one semiconductor light emitting device that is mounted therein away from the respective cavity, and the second metal face including therein a plurality of heat sink fins;

forming an insulating layer on the first metal face;

forming a conductive layer on the insulating layer that is patterned to provide a reflective coating in the plurality of cavities and first and second conductive traces on the first face that extend into the plurality of cavities and are configured to connect to a plurality of semiconductor light emitting devices that are mounted in the cavities; and

mounting at least one semiconductor light emitting device in a respective cavity, and electrically connected to the first and second conductive traces in the respective cavity.

63. A method according to claim 62 wherein mounting is preceded by:

fabricating a reflective coating in the plurality of cavities.

64. A method according to claim 62 wherein the first metal face further includes a plurality of pedestals therein and wherein a respective one of the plurality of cavities is in a respective one of the plurality of pedestals.

65. A method according to claim 62 wherein the solid metal block includes a through hole therein that extends from the first face to the second face, the method further comprising:

forming a conductive via in the through hole that is electrically connected to the first or second conductive traces.

66. A method according to claim 62 wherein mounting is followed by:

placing a respective lens across a respective one of the cavities.

67. A method according to claim 64 wherein mounting is followed by:

placing a respective lens across a respective one of the pedestals and across a respective one of the cavities.

68. A method according to claim 62 wherein mounting is followed by:

placing a flexible film that includes a plurality of optical elements therein on the first metal face, wherein a respective optical element extends across a respective cavity.

69. A method according to claim 64 wherein mounting is followed by:

placing a flexible film that includes a plurality of optical elements therein on the first metal face, wherein a respective optical element extends across a respective pedestal and across a respective cavity.

70. A method according to claim 66 further comprising:

coating the lenses with phosphor.

71. A method according to claim 67 further comprising:

coating the lenses with phosphor.

72. A method according to claim 68 further comprising:

coating the optical element with phosphor.

73. A method according to claim 69 further comprising:

coating the optical element with phosphor.

74. A method according to claim 62 further comprising:

coating the semiconductor light emitting devices with phosphor.

75. A method according to claim 62 further comprising:

electrically connecting an integrated circuit to the first and second traces.

76. A method according to claim 62 further comprising:

electrically connecting a semiconductor light emitting device driver integrated circuit to the first and second traces.

77. A method according to claim 62 further comprising:

placing an optical coupling media in the cavities at least partially surrounding the light emitting devices.

78. A semiconductor light emitting device package comprising:

a solid metal block including first and second opposing metal faces, the first metal face including therein a plurality of cavities, a respective one of which is configured to mount at least one semiconductor light emitting device therein and to reflect light that is emitted by the at least one semiconductor light emitting device that is mounted therein away from the respective cavity, and the second metal face including therein a plurality of heat sink fins;

an insulating layer on the first metal face;

at least one semiconductor light emitting device in a respective cavity; and

a conductive layer on the insulating layer that is patterned to provide a reflective coating in the plurality of cavities and first and second conductive traces on the first face that extend into the plurality of cavities and that electrically connect to the at least one semiconductor light emitting device in the respective cavity.

79. A package according to claim 78 further comprising:

a reflective coating in the plurality of cavities.

80. A package according to claim 78 wherein the first metal face further includes a plurality of pedestals therein and wherein a respective one of the plurality of cavities is in a respective one of the plurality of pedestals.

81. A package according to claim 78 wherein the solid metal block includes a through hole therein that extends from the first face to the second face, the package further comprising:

a conductive via in the through hole that is electrically connected to the first or second conductive traces.

82. A package according to claim 78 further comprising:

a plurality of lenses, a respective one of which extends across a respective one of the cavities.

83. A package according to claim 80 further comprising:

a plurality of lenses, a respective one of which extends across a respective one of the pedestals and across a respective one of the cavities.

84. A package according to claim 78 further comprising:

a flexible film that includes a plurality of optical elements therein on the first metal face, wherein a respective optical element extends across a respective cavity.

85. A package according to claim 80 further comprising:

a flexible film that includes a plurality of optical elements therein on the first metal face, wherein a respective optical element extends across a respective pedestal and across a respective cavity.

86. A package according to claim 78 further comprising:

an integrated circuit on the solid metal block that is electrically connected to the first and second traces.

87. A package according to claim 78 further comprising:

a semiconductor light emitting device driver integrated circuit on the solid metal block that is electrically connected to the first and second traces.

88. A package according to claim 78 further comprising:

an optical coupling media in the cavities at least partially surrounding the light emitting devices.