Semiconductor package with conductive molding compound and manufacturing method thereof
First Claim
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1. A method of manufacturing a semiconductor package, comprising the steps of:
- (A) providing a substrate having an insulating substrate, substrate pads on the insulating substrate, and ball pads electrically connected to the substrate pads;
(B) forming through holes by piercing the substrate and filling the through holes with conductive lines formed of a first conductive material;
(C) mounting a semiconductor chip on the substrate, and electrically connecting chip pads on the semiconductor chip to the substrate pads via connecting means;
(D) applying an insulation coating layer onto the chip pads, the substrate pads, and the connecting means;
(E) sealing the semiconductor chip, the connecting means, and the conductive lines with a conductive molding compound containing a second conductive material to electrically connect a first end of each conductive line to the conductive molding compound; and
(F) forming solder balls on the ball pads and a second end of each conductive line for external electrical connections.
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Abstract
The present invention relates to a semiconductor package having a conductive molding compound to prevent static charge accumulation. By using a conductive molding compound heat conductivity is also increased and heat generated by the semiconductor chip is more effectively dissipated externally. Additionally, the conductive compound blocks electromagnetic waves making possible an optimal semiconductor package satisfying the electromagnetic compatibility (EMC) and increasing the reliability of the semiconductor chip especially when processing high-speed signals.
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Citations
46 Claims
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1. A method of manufacturing a semiconductor package, comprising the steps of:
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(A) providing a substrate having an insulating substrate, substrate pads on the insulating substrate, and ball pads electrically connected to the substrate pads;
(B) forming through holes by piercing the substrate and filling the through holes with conductive lines formed of a first conductive material;
(C) mounting a semiconductor chip on the substrate, and electrically connecting chip pads on the semiconductor chip to the substrate pads via connecting means;
(D) applying an insulation coating layer onto the chip pads, the substrate pads, and the connecting means;
(E) sealing the semiconductor chip, the connecting means, and the conductive lines with a conductive molding compound containing a second conductive material to electrically connect a first end of each conductive line to the conductive molding compound; and
(F) forming solder balls on the ball pads and a second end of each conductive line for external electrical connections. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A semiconductor package comprising:
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a substrate having an insulating substrate, substrate pads formed on the insulating substrate, and ball pads electrically connected to the substrate pads;
a semiconductor chip having chip pads, attached to the substrate;
connecting means electrically connecting the substrate pads to the chip pads;
a sealant adapted to seal the semiconductor chip and the connecting means; and
conductive balls formed on the ball pads, wherein the chip pads, the substrate pads, and the connecting means are coated with an insulation coating layer, and the sealant is a conductive molding compound containing a third conductive material, and the conductive molding compound is electrically connected to the conductive balls via conductive lines formed of a fourth conductive material. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21)
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22. An integrated circuit package comprising:
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an integrated circuit;
a circuit substrate, the integrated circuit having a first surface portion attached to a first surface of the circuit substrate, the circuit substrate having at least one conductive path coupling the first surface thereof and a second surface thereof; and
a conductive sealant enclosing remaining portions of the integrated circuit and portions of the first surface of the circuit substrate surrounding the integrated circuit, the conductive sealant being electrically coupled to the conductive path. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29)
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30. An integrated circuit package including a sealant surrounding an integrated circuit, the package comprising:
a conductive element mixed into the sealant to make the sealant conductive. - View Dependent Claims (31, 32, 33, 34, 35, 36, 37)
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38. A method of forming an integrated circuit package comprising:
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enclosing an integrated circuit within an electrically conductive sealant; and
electrically isolating the integrated circuit relative to the sealant. - View Dependent Claims (39, 40, 41, 42, 43, 44, 45, 46)
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Specification