White light emitting diode package and method of manufacturing the same

• US 20060097621A1
• Filed: 06/06/2005
• Published: 05/11/2006
• Est. Priority Date: 11/05/2004
• Status: Abandoned Application

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Yoon, Chul Soo, Chung, Yun Seup, Park, Il Woo
• Application Number:
  US11/145,817
• Publication Number:
  US 20060097621A1
• Time in Patent Office: Days
• US Class Current: 313/485
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H05B 33/10 Apparatus or processes specially adapted to the manufacture of electroluminescent light sources

Abstract

A method of manufacturing a white light emitting diode package comprises the steps of mounting a light emitting diode on a package substrate having at least one lead frame, preparing phosphor paste having a viscosity of 500˜10,000 cps by mixing phosphor powders and a transparent polymer resin, dispensing liquid droplets of the phosphor paste on an upper surface of the light emitting diode such that the phosphor paste is applied onto the upper surface and side surfaces of the light emitting diode, and curing the phosphor paste applied onto the light emitting diode.

Claims

1. A method of manufacturing a white light emitting diode package, comprising the steps of:

mounting a light emitting diode on a package substrate having at least one lead frame;

preparing phosphor paste having a viscosity of 500˜

10,000 cps by mixing phosphor powders and a transparent polymer resin;

dispensing liquid droplets of the phosphor paste on an upper surface of the light emitting diode such that the phosphor paste is applied onto the upper surface and side surfaces of the light emitting diode; and

curing the phosphor paste applied onto the light emitting diode.

2. The method as set forth in claim 1, wherein the phosphor paste has a weight ratio of the paste powders to the transparent polymer resin in the range of 0.5˜

10.

3. The method as set forth in claim 1, wherein the liquid droplet of the phosphor paste has a volume of 0.012˜

0.5 μ

l.

4. The method as set forth in claim 1, wherein the transparent polymer resin is a curable polymer resin.

5. The method as set forth in claim 4, wherein the curable polymer resin is one of a silicon-based polymer resin and an epoxy-based polymer resin.

6. The method as set forth in claim 1, further comprising the step of electrically connecting the light emitting diode or the light emitting diode chip to the lead frame by use of wires, after the step of curing the phosphor paste.

7. The method as set forth in claim 1, wherein the light emitting diode is a flip chip light emitting diode.

8. The method as set forth in claim 1, wherein the package substrate further comprises a cap structure enclosing the light emitting diode on an upper surface of the package substrate, and the method further comprises the step of forming a transparent molding portion inside the cap structure by use of the transparent resin after the step of curing the phosphor paste.

9. A white light emitting diode package manufactured by a method as set forth in claim 1.

10. A white light emitting diode package manufactured by a method as set forth in claim 2.

11. A white light emitting diode package manufactured by a method as set forth in claim 3.

12. A white light emitting diode package manufactured by a method as set forth in claim 4.

13. A white light emitting diode package manufactured by a method as set forth in claim 5.

14. A white light emitting diode package manufactured by a method as set forth in claim 6.

15. A white light emitting diode package manufactured by a method as set forth in claim 7.

16. A white light emitting diode package manufactured by a method as set forth in claim 8.