Communication module

• US 20060098396A1
• Filed: 10/24/2005
• Published: 05/11/2006
• Est. Priority Date: 10/26/2004
• Status: Abandoned Application

• Current Assignee: Delta Electronics Incorporated
• Original Assignee: Delta Electronics Incorporated
• Inventors: Shih, Cheng-Yen
• Application Number:
  US11/256,088
• Publication Number:
  US 20060098396A1
• Time in Patent Office: Days
• US Class Current: 361/679.4
• CPC Class Codes: H04B 1/38 Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/117 Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/183 Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 2201/2018 Presence of a frame in a printed circuit or printed circuit assembly
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence

Abstract

A communication module. The communication module comprises at least one supporting structure, at least one first electronic component, and at least one connecting pad. The supporting structure comprises a first surface and a hollow portion. The first electronic component is disposed in the hollow portion. The connecting pad is disposed on the first surface and electrically connected to the first electronic component.

Claims

1. A communication module comprising:

at least one supporting structure comprising a first surface and at least one hollow portion;

at least one first electronic component disposed in the hollow portion; and

at least one connecting pad disposed on the first surface and electrically connected to the first electronic component.

2. The communication module as claimed in claim 1, wherein the connecting pad and the first electronic component are disposed on the same side of the supporting structure.

3. The communication module as claimed in claim 1, wherein the connecting pad is disposed on the supporting structure at a position higher than the first electronic component.

4. The communication module as claimed in claim 1, wherein the connecting pad is a spherical pad, a wave solder pad, a flip-clip pad, a surface mounting pad, or a die-bonding pad.

5. The communication module as claimed in claim 1, wherein the first electronic component includes at least one active component, at least one passive component, or both.

6. The communication module as claimed in claim 5, wherein the active component includes Bluetooth chips or memory chips.

7. The communication module as claimed in claim 5, wherein the passive component includes oscillators, crystals, filters, unbalanced to balanced converters, inductors, capacitors, or resistors.

8. The communication module as claimed in claim 1, further comprising at least one circuit line, embedded in the supporting structure and connecting the connecting pad and the first electronic component.

9. The communication module as claimed in claim 8, wherein the circuit line comprises at least one passive component.

10. The communication module as claimed in claim 1, further comprising a filling material for covering the first electronic component.

11. The communication module as claimed in claim 10, wherein the filling material is glue, sealant, packaging materials, paint, plastic, or a combination thereof.

12. The communication module as claimed in claim 1, further comprising a second electronic component, disposed in the hollow portion or on a second surface of the supporting structure.

13. The communication module as claimed in claim 1, further comprising a shielding layer embedded in or disposed on the supporting structure.

14. The communication module as claimed in claim 1, wherein the supporting structure is a ceramic, a low dielectric constant material, a glass fiber, an organic compound, or a combination thereof.

15. The communication module as claimed in claim 1, wherein the supporting structure further comprises:

a first substrate surrounding the hollow portion and comprising the first surface; and

a second substrate disposed under the first substrate, wherein a bottom surface of the hollow portion is a partial surface of the second substrate.

16. The communication module as claimed in claim 15, wherein the first substrate and the second substrate are formed by the same materials or the different materials.

17. The communication module as claimed in claim 1, wherein the communication module is a Bluetooth module.

18. The communication module as claimed in claim 1, wherein the connecting pad electrically connects the first electronic component to the other devices.

19. The communication module as claimed in claim 1, further comprising:

at least one second electronic component, disposed on the first surface, covering the hollow portion, and connected to the connecting pad; and

at least one connecting structure, disposed on a second surface of the supporting structure and connected to the first electronic component and the second electronic component.

20. The communication module as claimed in claim 19, wherein the connecting structure is a pin, a spherical pad, a wave solder pad, a flip-clip pad, a connecting line, a surface mounting pad, or a die-bonding pad.