Thermal management system and method for electronic equipment mounted on coldplates
First Claim
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1. A thermal management system for electronic components, comprising:
- a highly conductive housing having a mounting surface for mounting one or more electronic components;
a plastic coldplate disposed within the highly conductive housing; and
a highly conductive material disposed within the plastic coldplate and thermally coupled to the mounting surface, the highly conductive material operable to spread the heat throughout a volume of the plastic coldplate.
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Abstract
According to an embodiment of the present invention, a thermal management system for electronic components includes a plastic coldplate having a mounting surface for mounting one or more electronic components, one or more passageways configured to have a fluid flow therethrough disposed within the plastic coldplate, and a highly conductive material disposed within the plastic coldplate and thermally coupled to the mounting surface. The highly conductive material is operable to transfer heat from the mounting surface to the fluid flow.
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Citations
14 Claims
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1. A thermal management system for electronic components, comprising:
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a highly conductive housing having a mounting surface for mounting one or more electronic components;
a plastic coldplate disposed within the highly conductive housing; and
a highly conductive material disposed within the plastic coldplate and thermally coupled to the mounting surface, the highly conductive material operable to spread the heat throughout a volume of the plastic coldplate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A thermal management method for electronic components, comprising:
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mounting one or more electronic components on a mounting surface of a highly conductive housing;
disposing a plastic coldplate within the highly conductive housing;
disposing a highly conductive material within the plastic coldplate; and
thermally coupling the highly conductive material to the mounting surface to spread the heat throughout a volume of the plastic coldplate. - View Dependent Claims (10, 11, 12, 13, 14)
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Specification