Creating layers in thin-film structures
First Claim
1. A method of creating a layer of electrically insulating material in a thin-film structure, the method comprising the steps of coating a substrate in one pass with an ink having a major, fugitive component and at least one minor, non-fugitive component and treating the ink to expel said major component to leave said layer of electrically insulating material, wherein said layer of electrically insulating material has a thickness in the range 0.5 to 10 micrometres, and said ink contains non-fugitive colloidal ceramic nanoparticles having a size in the range 10 to 100 nanometres.
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Abstract
A layer of a material is created in a thin-film structure by coating a substrate (14) in one pass with an ink having a major, fugitive component (13) and at least one minor, non-fugitive component (12) and treating the ink to expel the major component (13) to leave the layer (15) of material. The layer (15) may bean electrically insulating layer having a thickness in the range 0.5 to 10 micrometres, with the ink containing non-fugitive colloidal ceramic nanoparticles having a size in the range 10 to 100 nanometres. The layer (15) may be a process control. layer, such as an etch stop layer or barrier layer. The layer (15) may be an optically emissive layer or a layer of predetermined electrical conductivity.
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Citations
62 Claims
- 1. A method of creating a layer of electrically insulating material in a thin-film structure, the method comprising the steps of coating a substrate in one pass with an ink having a major, fugitive component and at least one minor, non-fugitive component and treating the ink to expel said major component to leave said layer of electrically insulating material, wherein said layer of electrically insulating material has a thickness in the range 0.5 to 10 micrometres, and said ink contains non-fugitive colloidal ceramic nanoparticles having a size in the range 10 to 100 nanometres.
- 6. A method of creating a process control layer of a material in a thin-film structure, the method comprising the steps of coating a substrate in one pass with an ink having a major, fugitive component and at least one minor, non-fugitive component and treating the ink to expel said major component to leave said layer of material.
- 15. A method of creating an optically emissive layer of material in a thin-film structure, the method comprising the steps of coating a substrate in one pass with an ink having a major, fugitive component and at least one minor, non-fugitive component and treating the ink to expel said major component to leave said optically emissive layer of material.
- 21. A method of creating a layer of a material of predetermined electrical conductivity in a thin-film structure, the method comprising the steps of coating a substrate in one pass with an ink having a major, fugitive component and at least one minor, non-fugitive component and treating the ink to expel said major component to leave said layer of material, wherein said minor, non-fugitive component comprises one or more soluble ceramic precursor.
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56. (canceled)
Specification