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Method for removing a residue from a substrate using supercritical carbon dioxide processing

  • US 20060102204A1
  • Filed: 11/12/2004
  • Published: 05/18/2006
  • Est. Priority Date: 11/12/2004
  • Status: Abandoned Application
First Claim
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1. A method of cleaning a substrate in a film removal system, the method comprising:

  • providing a substrate containing a micro-feature having a residue thereon; and

    treating the substrate with a supercritical carbon dioxide cleaning solution containing a peroxide to remove the residue from the micro-feature, where the temperature of the carbon dioxide cleaning solution is maintained between about 35°

    C. and about 80°

    C.

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