Contacting of an electrode with a substance in vacuum

• US 20060102465A1
• Filed: 02/26/2004
• Published: 05/18/2006
• Est. Priority Date: 03/25/2003
• Status: Abandoned Application

• Current Assignee: Bekaert Vds
• Original Assignee: Bekaert Vds
• Inventors: De Bosscher, Wilmert, Blondeel, Anja
• Application Number:
  US10/550,507
• Publication Number:
  US 20060102465A1
• Time in Patent Office: Days
• US Class Current: 204/192.100
• CPC Class Codes: C23C 14/3407 Cathode assembly for sputtering apparatus, e.g. Target
• CPC Class Codes: C23C 14/564 Means for minimising impurities in the coating chamber such as dust, moisture, residual gases

Abstract

A method for improving the sputter deposition process is provided. The method comprises the following steps: a) providing a vacuum; b) providing an electrode (10, 34, 34′, 44, 44′) in the provided vacuum ; c) providing a substrate in said vacuum, said substrate having no contact with said electrodes (10, 34, 34′, 44, 44′) providing a device (22, 22′, 24, 24′, 26, 26′, 28, 28′, 30, 36, 36′, 48, 48′) in the vacuum. The device is in relative motion to the electrode and is in contact with the electrode over a contact zone. The device removes solid material from the electrode or applies solid material to the electrode. The method is carried out by means of a simple mechanism. There is no need for complicated electronics or sophisticated control algorithms. The method is carried out in vacuum, i.e. there is no need to break the vacuum, so that the machine downtime is reduced.

Claims

1. A method to improve the sputter deposition process, said method comprising the following steps:

a) providing a vacuum;

b) providing an electrode in said vacuum;

c) providing a substrate in said vacuum, said substrate having no contact with said electrode;

d) providing a device in said vacuum;

said device being in relative motion to said electrode and being in mechanical contact with said electrode over a contact zone;

said device removing material from said electrode or said device applying material to said electrode, said material being in a solid state.

2. The method according to claim 1, wherein said device has a hardness, which is greater than, or equal to the hardness of the electrode or part thereof in order to remove material from said electrode.

3. The method according to claim 1, wherein said device has a hardness, which is smaller than, or equal to the hardness of the electrode or part thereof in order to apply material to said electrode.

4. The method according to claim 1, wherein said electrode is a cathode.

5. The method according to claim 4, wherein said cathode is a rotatable cylindrical target.

6. The method according to claim 1, wherein said electrode is an anode.

7. The method according to claim 6, wherein said anode is a vacuum chamber wall or shield.

8. The method according to claim 6, wherein said anode is a rotatable cylindrical tube.

9. The method according to claim 6, wherein said anode is a rotatable brush.

10. The method according to claim 4, wherein said target has an end zone that is not sputtered and wherein said contact zone overlaps with said end zone.

11. The method according to claim 4, wherein said target has a zone of race track return and wherein said contact zone overlaps with said zone of race track return.

12. The method according to claim 4, wherein said target has an erosion zone and wherein said contact zone overlaps with said erosion zone.

13. The method according to claim 12, wherein said target is an ITO target.

14. A method according to claim 1, wherein said device is intermittently in relative motion to said electrode and said device is intermittently in contact with said electrode.

15. A method according to claim 1, wherein said device is continuously in relative motion to said electrode and said device is intermittently in contact with said electrode.

16. A method according to claim 1, wherein said device is intermittently in relative motion to said electrode and said device is continuously in contact with said electrode.

17. A method according to claim 1, wherein said device is continuously in relative motion to said electrode and said device is continuously in contact with said electrode.