Semiconductor apparatus

• US 20060102991A1
• Filed: 11/10/2005
• Published: 05/18/2006
• Est. Priority Date: 11/12/2004
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: Sakano, Kensho
• Granted Patent: US 7,462,928 B2
• Time in Patent Office: Days
• US Class Current: 257/678
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/45169 Platinum (Pt) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12035 Zener diode
• CPC Class Codes: H01L 2924/12036 PN diode
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/0216 Coatings H01L31/041 takes precedence
• CPC Class Codes: H01L 31/0232 Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

A semiconductor apparatus according to the present invention comprises a support member that has a recessed portion, one pair of positive and negative conductive wiring members that are provided on the support member, a semiconductor device that is electrically connected to the conductive wiring members and is disposed in the recessed portion, and a coating member that seals at least the semiconductor device. Side walls of the recessed portion has a first side wall 105 that surrounds the semiconductor device 103, and the second side wall 106 that protrudes from the first side wall. At least a first wall surface 106a in the bottom side of the recessed portion in wall surfaces of the second side wall 106 is coated with a metallic material. Consequently, a highly reliable semiconductor apparatus with improved light-outgoing efficiency is provided.

Claims

1. A semiconductor apparatus comprising a semiconductor device;

a support member having a recessed portion that mounts the semiconductor device therein and has a protrusion on a side surface of the recessed portion; and

a coating member that seals the semiconductor device in the recessed portion, wherein

at least a wall surface of the protrusion facing the bottom side of the recessed portion is coated with a metallic material.

2. The semiconductor apparatus according to claim 1, wherein the protrusion protrudes in the opening side of the recessed portion.

8. The semiconductor apparatus according to claim 1, wherein the coating member is composed of a material including at least one selected from the group consisting of silicone resin and epoxy resin.

9. The semiconductor apparatus according to claim 1, wherein the support member is composed of ceramic.

10. The semiconductor apparatus according to claim 1, wherein the metallic material contains at least one element selected from the group consisting of tungsten (W), molybdenum (Mo), manganese (Mn) and tantalum (Ta).

3. A semiconductor apparatus comprising a semiconductor device;

a support member having a recessed portion that mounts the semiconductor device therein, and has a first side wall (105) in the bottom side and a second side wall (106) protruding in the opening side; and

a coating member that seals the semiconductor device in the recessed portion, wherein

at least a first wall surface (106a) in the bottom side of the recessed portion in wall surfaces of the second side wall (106) is coated with a metallic material.

4. The semiconductor apparatus according to claim 3, wherein a tangent plane at the top surface of the metallic material disposed on the side wall of the recessed portion intersects the second side wall (106).

5. The semiconductor apparatus according to claim 3, wherein the metallic material extends from the first side wall (105) to the second side wall (106).

6. The semiconductor apparatus according to claim 3, wherein the metallic material is formed in a convex shape on the wall surface (105a) of the first side wall (105), and is disposed in a concave shape at the corner defined by the first wall surface (106a) and the wall surface (105a).

7. The semiconductor apparatus according to claim 3, wherein the metallic material extends on the second side wall (106) from the first wall surface (106a) toward an adjacent wall surface.

11. The semiconductor apparatus according to claim 3, wherein a tangent plane at the top surface of the metallic material disposed on the side wall of the recessed portion contacts, but does not intersect, the second side wall (106).