Electronic component and method for manufacturing the same

• US 20060103027A1
• Filed: 10/10/2005
• Published: 05/18/2006
• Est. Priority Date: 11/18/2004
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Saimen, Munehide
• Granted Patent: US 7,535,108 B2
• Time in Patent Office: Days
• US Class Current: 257/773
• CPC Class Codes: H01L 23/49833 the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0281 Reinforcement details thereof
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 2201/09145 Edge details
• CPC Class Codes: H05K 2201/2009 Reinforced areas, e.g. for a specific part of a flexible printed circuit
• CPC Class Codes: H05K 2203/0228 Cutting, sawing, milling or shearing
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: H05K 3/225 Correcting or repairing of printed circuits H05K1/0292, H05K3/222, H05K3/288, H05K3/4685 take precedence

Abstract

A method for manufacturing an electronic component includes: cutting a wiring substrate along a line intersecting with an outline of a reinforcing member, the wiring substrate including a base substrate, a wiring pattern provided to a first surface of the base substrate, and the reinforcing member provided to a second surface of the base substrate; and attaching a reinforcing sticker to the base substrate after cutting the wiring substrate so as to cover at least a part of a crack produced in the base substrate in cutting the wiring substrate.

Claims

1. A method for manufacturing an electronic component, comprising:

cutting a wiring substrate along a line intersecting with an outline of a reinforcing member, the wiring substrate including a base substrate, a wiring pattern provided to a first surface of the base substrate, and the reinforcing member provided to a second surface of the base substrate; and

attaching a reinforcing sticker to the base substrate after cutting the wiring substrate so as to cover at least a part of a crack produced in the base substrate in cutting the wiring substrate.

5. The method for manufacturing an electronic component according to claim 1,

wherein a distance from an intersection of the line and the outline of the reinforcing member to the wiring pattern being longer than a sum of a thickness of the base substrate and a thickness of the reinforcing member.

6. The method for manufacturing an electronic component according to claim 1, further comprising:

pressing a region defined by the line and an edge of the reinforcing member from the second surface side, the edge intersecting with the line, the line intersecting with a wiring being in the region in which the base substrate and the reinforcing member are overlapped, the wiring being included in the wiring pattern.

2. A method for manufacturing an electronic component, comprising:

cutting a wiring substrate along a line intersecting with an outline of a reinforcing member, the wiring substrate including a base substrate, a wiring pattern provided to a first surface of the base substrate, and the reinforcing member provided to a second surface of the base substrate; and

attaching a reinforcing sticker to the base substrate after cutting the wiring substrate so as to cover from a region in which the base substrate and the reinforcing member are overlapped to a region excluding the region in which the base substrate and the reinforcing member are overlapped.

3. A method for manufacturing an electronic component, comprising:

cutting a wiring substrate along a line intersecting with an outline of a reinforcing member, the wiring substrate including a base substrate, a wiring pattern provided to a first surface of the base substrate, and the reinforcing member provided to a second surface of the base substrate; and

removing a region from the base substrate, the region including a crack produced in cutting the wiring substrate.

4. A method for manufacturing an electronic component, comprising:

cutting a wiring substrate along a line intersecting with an outline of a reinforcing member, the wiring substrate including a base substrate, a wiring pattern provided to a first surface of the base substrate, and the reinforcing member provided to a second surface of the base substrate; and

removing a part of a region from the base substrate, the region overlapping with an end part of the reinforcing member.

7. An electronic component, comprising:

a base substrate including a crack;

a wiring pattern provided to a first surface of the base substrate;

a reinforcing member provided to a second surface of the base substrate; and

a reinforcing sticker attached to the base substrate so as to cover at least a part of the crack.

8. An electronic component, comprising:

a base substrate including a crack;

a wiring pattern provided to a first surface of the base substrate;

a reinforcing member provided to a second surface of the base substrate; and

a reinforcing sticker attached to the base substrate so as to cover from a region in which the base substrate and the reinforcing member are overlapped to a region excluding the region in which the base substrate and the reinforcing member are overlapped.

9. An electronic component, comprising:

a base substrate;

a wiring pattern provided to a first surface of the base substrate;

a reinforcing member provided to a second surface of the base substrate; and

a notch formed to the base substrate, the notch exposing a corner part of the reinforcing member.