Apparatus and method for dynamic diagnostic testing of integrated circuits

• US 20060103378A1
• Filed: 11/12/2004
• Published: 05/18/2006
• Est. Priority Date: 11/12/2004
• Status: Abandoned Application

• Current Assignee: DCG Systems Incorporated (Thermo Fisher Scientific Incorporated)
• Original Assignee: DCG Systems Incorporated (Thermo Fisher Scientific Incorporated)
• Inventors: Kasapi, Steven, Pakdaman, Nader, Goldberger, Itzik
• Application Number:
  US10/986,480
• Publication Number:
  US 20060103378A1
• Time in Patent Office: Days
• US Class Current: 324/228
• CPC Class Codes: G01R 31/2831 Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates G01R31/318511 takes precedence; testing during manufacture H01L22/00
• CPC Class Codes: G01R 31/2884 using dedicated test connectors, test elements or test circuits on the IC under test G01R31/2855 takes precedence
• CPC Class Codes: G01R 31/311 of integrated circuits G01R31/31728 takes precedence

Abstract

Systems and methods consistent with principles of the present invention allow contactless measuring of various kinds of electrical activity within an integrated circuit. The invention can be used for high-bandwidth, at speed testing of various devices on a wafer during the various stages of device processing, or on packaged parts at the end of the manufacturing cycle. Power is applied to the test circuit using conventional mechanical probes or other means, such as CW laser light applied to a photoreceiver provided on the test circuit. The electrical test signal is introduced into the test circuit by stimulating the circuit using a contactless method, such as by directing the output of one or more modelocked lasers onto high-speed receivers on the circuit, or by using a high-speed pulsed diode laser. The electrical activity within the circuit in response to the test signal is sensed by a receiver element, such as a time-resolved photon counting detector, a static emission camera system, or by an active laser probing system. The collected information is used for a variety of purposes, including manufacturing process monitoring, new process qualification, and model verification.

Claims

1. A method for measuring electrical characteristics of an integrated circuit, the integrated circuit comprising predetermined patterns of active electronic elements disposed on a surface of a semiconductor wafer, the method comprising:

injecting a test signal into the integrated circuit by stimulating a predetermined area of the integrated circuit;

supplying power to at least one of the active electronic elements of the integrated circuit;

detecting an electrical activity within the integrated circuit in response to the injected test signal, wherein the responsive electrical activity comprises switching of at least one of the active electronic elements of the integrated circuit; and

determining the characteristics of the integrated circuit based on the detected electrical activity.

2. The method of claim 1, wherein the electrical activity in the integrated circuit is detected in an electrically non-loading manner.

3. The method of claim 1, wherein the test signal is injected without establishing a mechanical contact with the predetermined stimulated area of the integrated circuit.

4. The method of claim 1, wherein the predetermined area of the integrated circuit is stimulated by directing an energy-carrying beam onto the predetermined area.

5. The method of claim 4, wherein the predetermined area is receptive to the energy-carrying beam to produce the test signal.

6. The method of claim 1, further comprising conditioning the injected test signal.

7. The method of claim 1, further comprising, prior to the injecting, locating the integrated circuit on the semiconductor wafer.

8. The method of claim 7, wherein the locating comprises obtaining an image of at least a portion of the semiconductor wafer and performing an optical pattern recognition analysis of the obtained image.

9. The method of claim 1, further comprising, prior to the injecting, positioning the integrated circuit in a predetermined position to enable the injecting and the detecting.

10. The method of claim 1, wherein the supplying takes place before the injecting.

11. The method of claim 1, wherein the supplying comprises irradiating a photoreceiver disposed within the integrated circuit with an energy beam.

12. The method of claim 1, wherein the supplying comprises positioning of a mechanical probe such that is engages at least one conducting pad disposed within the integrated circuit.

13. The method of claim 1, wherein the injecting is performed after deposition of a metal layer of the integrated circuit.

14. The method of claim 1, further comprising performing parametric measurements on the integrated circuit, wherein the characteristics of the integrated circuit are determined based, at least in part, on results of the parametric measurements.

15. The method of claim 1, wherein the detecting comprises performing a non-time-resolved detection of photons emitted by the integrated circuit.

16. The method of claim 1, wherein the detecting comprises performing a time-resolved detection of photons emitted by the integrated circuit.

17. The method of claim 1, wherein the detecting comprises performing a laser beam probing of the integrated circuit.

18. The method of claim 1, wherein the detecting comprises performing a mechanical probing of the integrated circuit.

19. The method of claim 1, wherein the detecting comprises performing a electron-beam probing of the integrated circuit.

20. The method of claim 1, further comprising generating a timebase signal for synchronizing the injecting and the detecting.

21. The method of claim 20, wherein the timebase signal is based on the timing of the injected test signal.

22. The method of claim 1, wherein the injecting comprises directing a beam of electromagnetic energy onto the predetermined area of the integrated circuit.

23. The method of claim 22, further comprising optically coupling the beam of electromagnetic energy to the predetermined area of the integrated circuit.

24. The method of claim 23, wherein the coupling is performed using a scan lens.

25. The method of claim 23, wherein the coupling is performed using an objective lens.

26. The method of claim 23, wherein the coupling comprises adjusting position of the integrated circuit.

27. The method of claim 22, wherein the electromagnetic energy beam is a light beam.

28. The method of claim 22, wherein the electromagnetic energy beam is a laser beam.

29. The method of claim 22, wherein the electromagnetic energy beam is a pulsed light beam.

30. The method of claim 1, wherein the injecting comprises directing a beam of charged particles onto the predetermined area of the integrated circuit.

31. The method of claim 30, wherein the particle beam is an electron beam.

32. The method of claim 1, further comprising navigating the wafer for locating the integrated circuit on the wafer.

33. The method of claim 1, wherein the detecting is performed in a time-resolved manner.

34. The method of claim 1, wherein the detecting comprises registering emissions from the integrated circuit using a hot-electron emission detector.

35. The method of claim 1, further comprising amplifying photon emissions from the integrated circuit.

36. The method of claim 1, wherein the detecting comprises registering photon emissions from the integrated circuit in a non-time-resolved manner.

37. The method of claim 1, wherein the detecting comprises registering photon emissions from the integrated circuit using a non-imaging photon detector.

38. The method of claim 1, wherein the detecting comprises registering photon emissions from the integrated circuit using a photodiode.

39. The method of claim 1, wherein the detecting comprises registering photon emissions from the integrated circuit using a photomutiplier tube.

40. The method of claim 1, wherein the detecting comprises registering photon emissions from the integrated circuit using an imaging photon detector.

41. The method of claim 1, wherein the detecting comprises registering photon emissions from the integrated circuit using a charge-coupled device (CCD) detector.

42. The method of claim 41, further comprising cooling the charge-coupled device (CCD) detector.

43. The method of claim 1, wherein the detecting comprises registering photon emissions from the integrated circuit using a mercury-cadmium-telluride (MCT) detector.

44. The method of claim 43, further comprising cooling the mercury-cadmium-telluride (MCT) detector.

45. The method of claim 1, wherein the detecting comprises probing the integrated circuit using a laser-based waveform probe.

46. The method of claim 1, wherein the detecting comprises probing the integrated circuit using an electron beam probe.

47. The method of claim 1, wherein the detecting comprises laser-probing of an electro-optic crystal placed in the proximity of the integrated circuit to determine the electrical potential in the proximity of the electro-optic crystal.

48. The method of claim 1, wherein the detecting is performed using a detector, the method further comprising capacitively coupling the detector to the integrated circuit.

49. The method of claim 1, further comprising positioning of the integrated circuit in a predetermined orientation relative to the detector.

50. The method of claim 1, further comprising positioning of the integrated circuit in a predetermined orientation relative to the stimulating energy source.

51. The method of claim 50, further comprising generating a positioning signal determining the positioning of the integrated circuit.

52. The method of claim 50, further comprising acquiring an image of at least a portion of the semiconductor wafer, wherein the positioning is performed based on the acquired image.

53. The method of claim 1, wherein the injecting is performed using a stimulating energy source, the method further comprising optically coupling the integrated circuit to the stimulating energy source.

54. The method of claim 53, wherein the coupling is performed using a focusing lens.

55. The method of claim 53, wherein the coupling is performed using an optical fiber.

56. The method of claim 1, wherein the detecting is performed using a detector, the method further comprising optically coupling the integrated circuit to the detector.

57. A method for measuring electrical characteristics of an integrated circuit, the integrated circuit comprising predetermined patterns of active electronic elements disposed on a surface of a semiconductor wafer, the method comprising:

step of injecting a test signal into the integrated circuit by stimulating a predetermined area of the integrated circuit;

step of supplying power to at least one of the active electronic elements of the integrated circuit;

step of detecting an electrical activity within the integrated circuit in response to the injected test signal, wherein the responsive electrical activity comprises switching of at least one of the active electronic elements of the integrated circuit; and

step of determining the characteristics of the integrated circuit based on the detected electrical activity.

58. A method for measuring electrical characteristics of an integrated circuit, the integrated circuit comprising predetermined patterns of active electronic elements disposed on a surface of a semiconductor wafer, the method comprising:

irradiating the integrated circuit with an energy beam, the irradiating causing creation of a test signal in the integrated circuit;

supplying power to at least one of the active electronic elements of the integrated circuit;

registering energy emission from the integrated circuit with a detector, the registered energy emission being indicative of an electrical activity within the integrated circuit caused by the injected test signal, wherein the responsive electrical activity comprises switching of at least one of the active electronic elements of the integrated circuit; and

determining the characteristics of the integrated circuit based on the registered energy emission.

59. A method of claim 58, wherein frequency characteristics of the energy beam are different from frequency characteristics of the energy emission.

60. A method of claim 58, wherein the detector is substantially insensitive in a frequency range of the energy beam.

61. A method of claim 58, further comprising filtering the energy emission with a filter blocking energy having frequency of the energy beam.

62. A method of claim 58, wherein the energy beam is a photon beam and wherein the energy emission is a photon emission.