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Electronic device having heat-dissipating structure for socket

  • US 20060104026A1
  • Filed: 07/01/2005
  • Published: 05/18/2006
  • Est. Priority Date: 11/18/2004
  • Status: Active Grant
First Claim
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1. An electronic device having a heat-dissipating structure for a socket, comprising:

  • a case;

    a plurality of electronic components disposed in said case;

    an airflow inlet disposed at a first side of said case;

    a socket disposed at a second side of said case, wherein said second side is opposite to said first side and said electronic components are disposed between said first side and said second side; and

    an airflow directing plate disposed between said case and said electronic components and forming an airflow channel with said case for directing a portion of air at said airflow inlet to said socket through said airflow channel so as to dissipate heat of said socket.

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