Electronic device having heat-dissipating structure for socket

• US 20060104026A1
• Filed: 07/01/2005
• Published: 05/18/2006
• Est. Priority Date: 11/18/2004
• Status: Active Grant

• Current Assignee: Delta Electronics Incorporated
• Original Assignee: Delta Electronics Incorporated
• Inventors: Chen, Yin-Yuan, Chang, Ren-Chun, Yu, Chen-Yu
• Granted Patent: US 7,215,542 B2
• Time in Patent Office: Days
• US Class Current: 361/694
• CPC Class Codes: H05K 7/20909 Forced ventilation, e.g. on heat dissipaters coupled to components

Abstract

An electronic device having a heat-dissipating structure for a socket is disclosed. The electronic device comprises a case, a plurality of electronic components disposed in the case, an airflow inlet disposed at a first side of the case, a socket disposed at a second side of the case, wherein the second side is opposite to the first side and the electronic components are disposed between the first side and the second side, and an airflow directing plate disposed between the case and the electronic components and forming an airflow channel with the case for directing a portion of air at the airflow inlet to the socket through the airflow channel so as to dissipate heat of the socket. Through the design of the present invention, the heat of the socket of the electronic device can be dissipated efficiently to conform to the safety standard of the socket temperature.

Claims

1. An electronic device having a heat-dissipating structure for a socket, comprising:

a case;

a plurality of electronic components disposed in said case;

an airflow inlet disposed at a first side of said case;

a socket disposed at a second side of said case, wherein said second side is opposite to said first side and said electronic components are disposed between said first side and said second side; and

an airflow directing plate disposed between said case and said electronic components and forming an airflow channel with said case for directing a portion of air at said airflow inlet to said socket through said airflow channel so as to dissipate heat of said socket.

2. The electronic device having a heat-dissipating structure for a socket according to claim 1 wherein said electronic device is a power supply.

3. The electronic device having a heat-dissipating structure for a socket according to claim 1 further comprising a fan for dissipating heat of said electronic components.

4. The electronic device having a heat-dissipating structure for a socket according to claim 3 wherein said fan is disposed at said first side of said case.

5. The electronic device having a heat-dissipating structure for a socket according to claim 3 wherein said fan is disposed at said second side of said case.

6. The electronic device having a heat-dissipating structure for a socket according to claim 1 wherein said airflow directing plate is made of an insulating material.

7. The electronic device having a heat-dissipating structure for a socket according to claim 1 wherein said airflow directing plate is formed by bending an insulating piece disposed on the top of said case downwardly.

8. The electronic device having a heat-dissipating structure for a socket according to claim 1 wherein said airflow directing plate further comprises a second portion disposed between said electronic components and said socket for isolating heat generated by said electronic components.

9. The electronic device having a heat-dissipating structure for a socket according to claim 1 wherein said airflow directing plate further comprises a horizontal portion at the bottom thereof for forming said airflow channel that is separated from said electronic components.

10. The electronic device having a heat-dissipating structure for a socket according to claim 1 wherein said airflow directing plate is formed from a non heat-generating or low heat-generating component.

11. The electronic apparatus according to claim 10 wherein said non heat-generating or low heat-generating component is a PCB or large capacitor.

12. An electronic device having a heat-dissipating structure for a socket, comprising:

a case;

a plurality of electronic components disposed in said case;

an airflow inlet disposed at a first side of said case;

a socket disposed at a second side of said case, wherein said second side is opposite to said first side and said electronic components are disposed between said first side and said second side; and

an insulating piece for insulating said electronic components and said case, wherein a specific distance exists between said insulating piece and said case to form an airflow channel therebetween for directing a portion of air at said airflow inlet to said socket through said airflow channel so as to dissipate heat of said socket.

13. The electronic device having a heat-dissipating structure for a socket according to claim 12 wherein said electronic device is a power supply.

14. The electronic device having a heat-dissipating structure for a socket according to claim 12 further comprising a fan for dissipating heat of said electronic components.

15. The electronic device having a heat-dissipating structure for a socket according to claim 14 wherein said fan is disposed at said first side of said case.

16. The electronic device having a heat-dissipating structure for a socket according to claim 14 wherein said fan is disposed at said second side of said case.

17. The electronic device having a heat-dissipating structure for a socket according to claim 12 wherein said insulating piece is formed by bending an insulating piece disposed on the top of said case downwardly.

18. The electronic device having a heat-dissipating structure for a socket according to claim 12 wherein said insulating piece further comprises a second portion disposed between said electronic components and said socket for isolating heat generated by said electronic components.

19. The electronic device having a heat-dissipating structure for a socket according to claim 12 wherein said insulating piece further comprises a horizontal portion at the bottom thereof for forming said airflow channel that is separated from said electronic components.