Heat-dissipating method and structure of backlight module of display device

• US 20060104067A1
• Filed: 01/18/2005
• Published: 05/18/2006
• Est. Priority Date: 11/12/2004
• Status: Abandoned Application

• Current Assignee: Coretronic Corporation
• Original Assignee: Coretronic Corporation
• Inventors: Hwang, Ping-Feng, Pan, Bor-Jyh
• Application Number:
  US11/036,040
• Publication Number:
  US 20060104067A1
• Time in Patent Office: Days
• US Class Current: 362/373
• CPC Class Codes: G02F 1/1336 Illuminating devices
• CPC Class Codes: G02F 1/133628 with cooling means

Abstract

The present invention discloses a heat-dissipating method and structure for a backlight module of a display device, which can improve the heat-dissipating ability of the backlight module of a display device. Via shifting the disposing direction of the liquid crystal panel, the present invention enables the control-drive element and the related circuit boards, which are disposed on the rear face of the backlight module, to keep away from the heat-concentrated region so that the disposing positions of the control-drive element and the circuit boards will not overlap the heat-concentrated region of the backlight module; thus, the heat-dissipating ability can be improved. In the preferred embodiment of the present invention, a heat-dissipating component, such as a set of heat-dissipating fins, is installed in the heat-concentrated region in order to increase the heat-dissipating area thereof; thus, the heat-dissipating ability can be further improved, and the heat distribution is to be uniform.

Claims

1. A heat-dissipating method for a backlight module of a display device, for improving the heat-dissipating problem resulted from at least one circuit board installed near the top side of the rear face of said backlight module and hindering the heat-dissipation of said backlight module, wherein said display device comprises a liquid crystal panel, said method comprising:

shifting the disposing direction of said liquid crystal panel, for enabling said circuit board to be moved to the region near the bottom side of said backlight module so that the region near said top side of said backlight module is emptied; and

installing a heat-dissipating component in the region near said top side, for increasing the heat-dissipating area and improving the heat-dissipating ability.

2. The heat-dissipating method according to claim 1, wherein said heat-dissipating component is a set of heat-dissipating fins.

3. The heat-dissipating method according to claim 2, wherein said set of heat-dissipating fins is fabricated via stamping the metallic housing of said backlight module to form a plurality of heat-dissipating fins and through-holes.

4. The heat-dissipating method according to claim 2, wherein said set of heat-dissipating fins is extended to the top surface of said backlight module.

5. A heat-dissipating structure for a backlight module of a display device, for improving the heat-dissipating problem resulted from at least one circuit board installed near the top side of the rear face of said backlight module and hindering the heat-dissipation of said backlight module, comprising:

a heat-concentrated region where the heat is apt to concentrate, wherein said heat-concentrated region is positioned near said top side of the rear face of said backlight module, and no circuit board is installed in said heat-concentrated region; and

a heat-dissipating component, installed in said heat-concentrated region in order to increase the heat-dissipating area thereof.

6. The heat-dissipating structure according to claim 5, wherein said heat-dissipating component is a set of heat-dissipating fins.

7. The heat-dissipating structure according to claim 6, wherein said set of heat-dissipating fins is fabricated via stamping the metallic housing of said backlight module to form a plurality of heat-dissipating fins and through-holes.

8. The heat-dissipating structure according to claim 6, wherein said set of heat-dissipating fins is extended to the top surface of said backlight module.

9. The heat-dissipating structure according to claim 6, wherein said backlight module further comprises a control-drive element for connecting said circuit board and being installed in the region near the bottom side of said rear face of said backlight module.

10. A backlight module for a display device, for providing a backlight for a liquid crystal panel, comprising at least a light source, a housing, and at least a control-drive element;

characterized in;

a heat-concentrated region being positioned near the top side of the rear face of said backlight module, wherein the heat is apt to concentrate on said heat-concentrated region and no said control-drive element is installed in said heat-concentrated region; and

said control-drive element being installed near the bottom side of the rear face of said backlight module in order to drive said light source.

11. The backlight module according to claim 10, further comprising a heat-dissipating component installed in said heat-concentrated region, wherein the heat is apt to concentrate on said heat-concentrated region and the circuit boards of said liquid crystal panel and other systems keep away from said heat-concentrated region.

12. The backlight module according to claim 11, wherein said heat-dissipating component is a set of heat-dissipating fins.

13. The backlight module according to claim 12, wherein said set of heat-dissipating fins is fabricated via stamping the metallic housing of said backlight module to form a plurality of heat-dissipating fins and a plurality of through-holes penetrating through the metallic housing.

14. The backlight module according to claim 12, wherein said set of heat-dissipating fins is extended to the top surface of said backlight module.

15. The backlight module according to claim 10, wherein said light source is a tube lamp or a plate lamp.

16. The backlight module according to claim 10, wherein the input power wires of said light source are integrated into a set of output power wires at a single position.