Composite current collector

• US 20060105243A1
• Filed: 08/29/2002
• Published: 05/18/2006
• Est. Priority Date: 08/29/2002
• Status: Abandoned Application

• Current Assignee: TOYO Kohan Company Limited (Toyo Seikan Group Holdings, Ltd.)
• Original Assignee: TOYO Kohan Company Limited (Toyo Seikan Group Holdings, Ltd.)
• Inventors: Takagi, Kenichi, Doi, Hiroshi, Okamura, Takaaki, Hirakawa, Shinsuke
• Application Number:
  US10/525,837
• Publication Number:
  US 20060105243A1
• Time in Patent Office: Days
• US Class Current: 429/234
• CPC Class Codes: H01M 10/0525 Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
• CPC Class Codes: H01M 4/131 Electrodes based on mixed oxides or hydroxides, or on mixtures of oxides or hydroxides, e.g. LiCoOx
• CPC Class Codes: H01M 4/133 Electrodes based on carbonaceous material, e.g. graphite-intercalation compounds or CFx
• CPC Class Codes: H01M 4/525 of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
• CPC Class Codes: H01M 4/64 Carriers or collectors
• CPC Class Codes: H01M 4/667 in the form of layers, e.g. coatings
• CPC Class Codes: H01M 4/668 Composites of electroconductive material and synthetic resins
• CPC Class Codes: H01M 4/70 characterised by shape or form
• CPC Class Codes: Y02E 60/10 Energy storage using batteries

Abstract

A current collector effective for reductions in weight and thickness. The current collector produced by forming a conductive layer having a surface electric resistance not higher than 1.3 Ω/cm on the surface of a resin film and then forming an electrolytic plating layer having a thickness of at least 0.3 μm per one side, characterized in that the surface electric resistance is not higher than 40 m Ω/cm after electrolytic plating and following expression is satisfied; Y1+Y2+Y3≦0.8×((X1+X2+X3)×Y3/X3) where, X1: thickness of resin film (μm), X2: thickness of conductive layer (μm), X3: thickness of plating layer (μm), Y1: weight of resin film (mg/cm²), Y2: weight of conductive layer (mg/cm²), and Y3: weight of plating layer (mg/cm²).

Claims

1. A composite current collector in which, after forming on a surface of a resin film a conductive treatment layer whose surface electric resistance is not higher than 1.3 Ω

/cm by performing a conductive treatment, a plating layer whose thickness is at least 0.3 μ

m per one face is formed by an electrolytic plating treatment,

characterized in that the surface electric resistance after the electrolytic plating is not higher than 40 mΩ

/cm, and additionally following expression is satisfied;

Y1+Y2+Y3≦

0.8×

((X1+X2+X3)×

Y3/X3)

where

X1;

thickness of resin film (μ

m)

X2;

thickness of conductive treatment layer (μ

m)

X3;

thickness of plating layer (μ

m)

Y1;

weight of resin film (mg/cm²)

Y2;

weight of conductive treatment layer (mg/cm²)

Y3;

weight of plating layer (mg/cm²).

2. A composite current collector set forth in claim 1, characterized in that a tensile strength is at least 0.8 kg/cm.

3. A composite current collector set forth in claim 1, wherein the conductive treatment layer is a conductive painted film formed by applying a conductive paint and curing it.

4. A composite current collector set forth in claim 1, wherein the conductive treatment layer is a very thin metal thin film formed by a vapor deposition or a sputtering of a metal.

5. A composite current collector set forth in claim 3, wherein the conductive painted film is made by blending a conductive agent comprising one or at least two of Cu, Ag, Ni and conductive carbon to a resin.

6. A composite current collector set forth in claim 4, wherein the very thin metal thin film comprises one or at least two of Cu, Ag, Ni and Al.

7. A composite current collector set forth in claim 1, wherein the plating layer is one whose main component is Cu, Ni or Al.

8. A composite current collector set forth in claim 1, wherein the resin film is wavy or one in whose surface there has been formed an irregularities pattern.

14. A composite current collector set forth in claim 2, wherein the resin film is wavy or one in whose surface there has been formed an irregularities pattern.

9. A composite current collector in which conductive treatment layers are formed on both faces of a resin film having many through-holes, characterized in that, after forming a plating layer on the conductive treatment layer by an electrolytic plating treatment, a surface electric resistance is not higher than 40 mΩ

/cm, a tensile strength higher than 0.8 kg/cm and a front/back current-carrying resistance not higher than 100 mΩ

, and additionally following expression (2) is satisfied;

Y1+Y2+Y3≦

0.8×

(X1+X2+X3)×

Y3/X3 

 

(2)

where

X1;

thickness of resin film (μ

m),

X2;

thickness of conductive treatment layer (μ

m),

X3;

thickness of plating layer (μ

m),

Y1;

weight of resin film (mg/cm²),

Y2;

weight of conductive treatment layer (mg/cm²)

Y3;

weight of plating layer (mg/cm²).

10. A composite current collector set forth in claim 9, characterized in that the through-hole is filled by the conductive treatment layer.

11. A composite current collector set forth in claim 9, characterized in that the conductive treatment layer is formed also in a section of the through-hole, and additionally a plating layer is formed in an upper layer of the conductive treatment layer.

12. A composite current collector set forth in claim 9, wherein the plating layer is one whose main component is Cu, Ni or Al.

13. A composite current collector set forth in claim 9, wherein the resin film is wavy or one in whose surface there has been formed an irregularities pattern.

15. A composite current collector set forth in claim 11, wherein the plating layer is one whose main component is Cu, Ni or Al.