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Method of making light emitting device with silicon-containing encapsulant

  • US 20060105481A1
  • Filed: 10/17/2005
  • Published: 05/18/2006
  • Est. Priority Date: 11/18/2004
  • Status: Active Grant
First Claim
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1. A method of making a light emitting device, the method comprising the steps of:

  • providing a light emitting diode; and

    forming an encapsulant in contact with the light emitting diode, wherein forming the encapsulant comprises;

    contacting the light emitting diode with a photopolymerizable composition comprising a silicon-containing resin and a metal-containing catalyst, wherein the silicon-containing resin comprises silicon-bonded hydrogen and aliphatic unsaturation; and

    applying actinic radiation having a wavelength of 700 nm or less to initiate hydrosilylation within the silicon-containing resin.

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