Wafer-level sealed microdevice having trench isolation and methods for making the same

• US 20060105503A1
• Filed: 12/29/2005
• Published: 05/18/2006
• Est. Priority Date: 07/31/2003
• Status: Active Grant

• Current Assignee: Continental Automotive Systems, Inc. (Continental AG)
• Original Assignee: Temic Automotive of North America, Incorporated (Continental AG)
• Inventors: Ding, Xiaoyi, Schuster, John P.
• Granted Patent: US 7,378,294 B2
• Time in Patent Office: Days
• US Class Current: 438/125
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 2203/0118 Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
• CPC Class Codes: G06F 16/954 Navigation, e.g. using categorised browsing
• CPC Class Codes: G06N 5/00 Computing arrangements using knowledge-based models
• CPC Class Codes: H01L 2924/16235 Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip

Abstract

A microdevice (20) having a hermetically sealed cavity (22) to house a microstructure (26). The microdevice (20) comprises a substrate (30), a cap (40), an isolation layer (70), at least one conductive island (60), and an isolation trench (50). The substrate (30) has a top side (32) with a plurality of conductive traces (36) formed thereon. The conductive traces (36) provide electrical connection to the microstructure (26). The cap (40) has a base portion (42) and a sidewall (44). The sidewall (44) extends outwardly from the base portion (42) to define a recess (46) in the cap (40). The isolation layer (70) is attached between the sidewall (44) of the cap (40) and the plurality of conductive traces (36). The conductive island (60) is attached to at least one of the plurality of conductive traces (36). The isolation trench (50) is positioned between the cap (40) and the conductive island (60) and may be unfilled or at least partially filled with an electrically isolating material. There is also a method of making the same microdevice.

Claims

1. A method of making a microdevice having a hermetically sealed cavity, the method comprising the steps of:

providing a substrate having a top side and a bottom side;

forming a conductive trace on the top side of the substrate, the conductive trace having a first end and a second end;

forming an isolation layer over at least a portion of the top side of the substrate and the conductive trace;

forming a gap in the substrate;

attaching a microstructure to the first end of the conductive trace so that at least a substantial portion of the microstructure is positioned above the gap;

providing a silicon cap and a silicon island, the silicon cap being separated from the silicon island by an isolation trench;

attaching the silicon cap to the isolation layer formed on the top side of the substrate such that the silicon cap houses the microstructure and forms the hermetically sealed cavity; and

attaching the silicon island to the second end of the conductive trace.

2. The method of claim 1 wherein the method further comprises the steps of:

forming a single crystalline silicon getter layer in a recess of the silicon cap; and

activating the getter layer such that the getter layer is capable of adsorbing vapor and gas species generated during the step of attaching the silicon cap to the isolation layer.

3. The method of claim 1 wherein the step of attaching the silicon cap to the isolation layer comprises anodic bonding the silicon cap to the isolation layer.

4. The method of claim 1 wherein the substrate and the isolation layer are made of glass.

5. The method of claim 1 wherein the step of forming an isolation layer over at least the portion of the top side of the substrate further comprises the steps of:

depositing a glass layer on the top side of the substrate; and

planarizing and polishing an outer surface of the glass layer.

6. The method of claim 1 wherein the isolation trench separating the silicon cap from the silicon island is at least partially filled with glass.

7. The method of claim 1 further comprising the step of forming metallic pads on each silicon island.

8. A method of making a microdevice having a hermetically sealed cavity, the method comprising the steps of:

providing a substrate having a top side and a bottom side;

forming a conductive trace on the top side of the substrate;

forming an isolation layer over at least a portion of the top side of the substrate and the conductive trace;

forming a first contact window and a second contact window in the isolation layer;

forming metal traces over the first and second contact windows to allow electrical connection to the conductive trace under the isolation layer;

forming a gap on top side of the substrate;

attaching a microstructure to the top side of the substrate above the gap and connecting the microstructure to the metal traces that are over the contact windows;

providing a silicon cap and a silicon island, the silicon cap being separated from the silicon island by an isolation trench;

attaching the silicon cap to the isolation layer formed on the top side of the substrate such that the silicon cap houses the microstructure and forms the hermetically sealed cavity; and

attaching the silicon island to the conductive trace through the second contact window.

9. The method of claim 8 wherein the method further comprises the steps of:

forming a single crystalline silicon getter layer in a recess of the silicon cap; and

activating the getter layer such that the getter layer is capable of adsorbing vapor and gas species generated during the step of attaching the silicon cap to the isolation layer.

10. The method of claim 8 wherein the step of attaching the silicon cap to the isolation layer comprises anodic bonding the silicon cap to the isolation layer.

11. The method of claim 8 wherein the substrate and the isolation layer are made of glass.

12. The method of claim 8 wherein the step of forming an isolation layer over at least the portion of the top side of the substrate further comprises the steps of:

depositing a glass layer on the top side of the substrate; and

planarizing and polishing an outer surface of the glass layer.

13. The method of claim 8 wherein the isolation trench separating the silicon cap from the silicon island is at least partially filled with glass.

14. The method of claim 8 further comprising the step of forming metallic pads on each silicon island.

15. The method of claim 8 wherein the step of attaching a microstructure to the conductive trace through the first contact window comprises forming at least a first metal contact over the first contact window so that the first metal contact is connected with the conductive trace and then attaching the microstructure to the first metal contact.

16. The method of claim 15 wherein the step of attaching the silicon island to the conductive trace through the second contact window comprises forming at least a second metal contact over the second contact window so that the second metal contact is connected with the conductive trace and then attaching the silicon island to the second metal contact.

17. A method of making a microdevice having a hermetically sealed cavity, the method comprising the steps of:

providing a substrate having a top side and a bottom side;

forming a conductive trace on the top side of the substrate, the conductive trace having a first end and a second end;

forming a gap on the top side of the substrate;

attaching a microstructure to the first end of the conductive trace so that at least a substantial portion of the microstructure is positioned above the gap;

providing a silicon cap having a base portion and a sidewall, the sidewall extending outwardly from the base portion to define a recess in the cap;

providing a silicon island having a height greater than the sidewall of the silicon cap, the silicon island being separated from the silicon cap by an isolation trench;

providing a frit glass layer between an end portion of the sidewall of the silicon cap and at least a portion of the conductive trace; and

attaching the silicon cap and the silicon island to the substrate such that the silicon cap houses the microstructure and forms the hermetically sealed cavity.

18. The method of claim 17 wherein the step of attaching the silicon cap and silicon island to the substrate is done in a vacuum, under a high DC voltage and an elevated temperature, appropriate for an anodic bond to form between the silicon island and the substrate, and at the elevated temperature appropriate for a frit glass bond to form between the silicon cap and the substrate.