Probe arrays and method for making
First Claim
1. A method for fabricating a microprobe array, comprising:
- fabricating at least a portion of each of a plurality of probes on a temporary substrate;
transferring the probes from the temporary substrate to a permanent substrate.
1 Assignment
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Accused Products
Abstract
Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.
91 Citations
56 Claims
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1. A method for fabricating a microprobe array, comprising:
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fabricating at least a portion of each of a plurality of probes on a temporary substrate;
transferring the probes from the temporary substrate to a permanent substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48)
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- 35. The method of claim 35 wherein permanent substrates are attached to the large substrate via a bonding material that is made to flow and then resolidify.
- 49. The method of claim 49, wherein the distal ends of the probes comprise tips for contacting a surface to be probed.
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52. A method for bonding a first electric component to a second electric component, comprising:
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forming a plurality of solder bumps on a first electric component, wherein the solder bumps are surrounded, at least in part by rings of a retention material;
bringing the solder bumps on the first component into contact with bonding locations on a second electric component;
heating the solder to cause melting and cooling the solder to bond the first and second components together, wherein the separation between the first and second components is larger than would have been achieved in similar circumstances in the absence of the columns of retention material. - View Dependent Claims (53, 54, 55)
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56. A method for bonding a first electric component to a second electric component, comprising:
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forming a plurality of solder bumps on a first electric component, wherein the solder bumps are surrounded, at least in part by rings of a retention material;
reflowing the solder material such that the height of the reflowed solder is greater than it would be in absence of the retention material;
bringing the solder bumps on the first component into contact with bonding locations on a second electric component; and
heating the solder to cause melting and cooling the solder to bond the first and second components together.
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Specification