Electronic part and method for manufacturing the same

• US 20060108699A1
• Filed: 10/10/2005
• Published: 05/25/2006
• Est. Priority Date: 11/24/2004
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Saimen, Munehide
• Granted Patent: US 7,348,679 B2
• Time in Patent Office: Days
• US Class Current: 257/784
• CPC Class Codes: H01L 23/49572 consisting of thin flexible metallic tape with or without a film carrier H01L23/49503 - H01L23/49568 and H01L23/49575 - H01L23/49579 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 2201/09236 Parallel layout layout of balanced signal pairs H05K1/0245; superposed layout H05K2201/09672
• CPC Class Codes: H05K 2201/09727 Varying width along a single conductor; Conductors or pads having different widths
• CPC Class Codes: H05K 2201/10681 Tape Carrier Package [TCP]; Flexible sheet connector
• CPC Class Codes: H05K 2201/2009 Reinforced areas, e.g. for a specific part of a flexible printed circuit
• CPC Class Codes: H05K 2203/0228 Cutting, sawing, milling or shearing
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence

Abstract

A method for manufacturing an electronic part, including: cutting a wiring substrate, which contains a base substrate, a wiring pattern provided on a first surface of the base substrate, and a reinforcing member provided on a second surface of the base substrate, along a line intersecting with an outer circumference of the reinforcing member; wherein a wire, out of a plurality of wires composing the wiring pattern, arranged closest to an intersecting point of the outer circumference of the reinforcing member and the line has a widest width.

Claims

1. A method for manufacturing an electronic part, comprising:

cutting a wiring substrate along a line intersecting with an outer circumference of a reinforcing member, the wiring substrate including a base substrate, a wiring pattern provided on a first surface of the base substrate, and the reinforcing member provided on a second surface of the base substrate,;

wherein a wire, out of a plurality of wires composing the wiring pattern, arranged closest to an intersecting point of the outer circumference of the reinforcing member and the line has a widest width.

4. The method for manufacturing the electronic part according to claim 1, wherein a distance from the intersecting point to the wiring pattern is greater than a total thickness of the base substrate and the reinforcing member.

5. The method for manufacturing the electronic part according to claim 1, wherein the process of cutting the wiring substrate includes pressing a region surrounded by sides of the reinforcing member intersecting with the lines and the lines from a side of the second surface.

2. A method for manufacturing an electronic part, comprising:

cutting a wiring substrate along a line intersecting with an outer circumference of a reinforcing member, the wiring substrate including a base substrate, a wiring pattern provided on a first surface of the base substrate, and the reinforcing member provided on a second surface of the base substrate,;

wherein a wire, out of a plurality of wires composing the wiring pattern, arranged closest to an intersecting point of the outer circumference of the reinforcing member and the line is a wire diverged from a wire that passes through a region overlapping with the reinforcing member.

3. A method for manufacturing an electronic part, comprising:

cutting a wiring substrate along a line intersecting with an outer circumference of a reinforcing, the wiring substrate including a base substrate, a wiring pattern provided on a first surface of the base substrate, and the reinforcing member provided on a second surface of the base substrate member and which has a semiconductor chip mounted thereon;

wherein a wire, out of a plurality of wires composing the wiring pattern, arranged closest to an intersecting point of the outer circumference of the reinforcing member and the line is a wire not electrically connected to the semiconductor chip.

6. An electronic part, comprising:

a base substrate having a crack;

a wiring pattern provided on a first surface of the base substrate; and

a reinforcing member provided on a second surface of the base substrate;

wherein the wiring pattern includes a plurality of wires passing through a region overlapping with the reinforcing member; and

wherein an outermost wire of the wires is a wire having a widest width.

7. An electronic part, comprising:

a base substrate having a crack;

a wiring pattern provided on a first surface of the base substrate; and

a reinforcing member provided on a second surface of the base substrate;

wherein the wiring pattern includes a plurality of wires passing through a region overlapping with the reinforcing member; and

wherein an outermost wire of the wires is a wire diverged from the rest of the wires.

8. An electronic part, comprising:

a wiring substrate having a base substrate having a crack, a wiring pattern provided on a first surface of the base substrate, and a reinforcing member provided on a second surface of the base substrate;

a semiconductor chip mounted on the wiring substrate; and

a plurality of wires passing through a region overlapping with the reinforcing member;

wherein an outermost wire of the wires is a wire not electrically connected to the semiconductor chip.