RFID tag in a printed circuit board

• US 20060109119A1
• Filed: 11/19/2004
• Published: 05/25/2006
• Est. Priority Date: 11/19/2004
• Status: Abandoned Application

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Burr, Jeremy, Hall, John
• Application Number:
  US10/993,652
• Publication Number:
  US 20060109119A1
• Time in Patent Office: Days
• US Class Current: 340/572.100
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07758 arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
• CPC Class Codes: G08B 13/2417 having a radio frequency identification chip
• CPC Class Codes: H05K 1/0266 Marks, test patterns or identification means
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 2201/10098 Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas

Abstract

A radio frequency identification (RFID) tag circuit or RFID tag may be fabricated on a printed circuit board (PCB) and/or on a printed circuit panel from which PCB'"'"'s are made. In some embodiments the RFID tag may be created early in the fabrication process and become operational before the PCB has been finished.

Claims

1. An apparatus comprising

a printed circuit panel comprising

a radio frequency identification (RFID) tag circuit fabricated on the printed circuit panel;

and

an RFID antenna disposed on the printed circuit panel and electrically coupled to the RFID tag circuit.

2. The apparatus of claim 1, wherein:

the printed circuit panel is a multi-layer printed circuit panel;

the panel further comprises a second circuit; and

the RFID tag circuit is disposed on at least one particular layer of the multi-layer printed circuit panel that enables the RFID tag circuit to be operational before completion of the second circuit.

3. The apparatus of claim 1, wherein the RFID tag circuit is disposed external to a printed circuit board manufacturing area on the printed circuit panel.

4. The apparatus of claim 1, wherein the RFID tag circuit is disposed internal to a printed circuit board area on the printed circuit panel.

5. The apparatus of claim 1, wherein the RFID tag circuit comprises circuit elements printed onto the printed circuit panel.

6. The apparatus of claim 1, further comprising other circuitry electrically coupled to the RFID tag circuit.

7. The apparatus of claim 6, wherein the other circuitry is adapted to perform at least one of reading from a memory in the RFID tag circuit and writing into the memory in the RFID tag circuit.

12. The method of claim 11, further comprising operating the RFID tags again subsequent to said separating.

8. A method, comprising:

performing fabrication operations on a printed circuit panel to produce a radio frequency identification (RFID) tag and another circuit in each of multiple printed circuit board areas of the panel, the fabrication operations being sufficient to make the RFID tag operational and insufficient to make the other circuit operational.

9. The method of claim 8, further comprising operating the RFID tag subsequent to said performing the fabrication operations.

10. The method of claim 9, further comprising performing, subsequent to said operating, additional fabrication operations on the other circuit.

11. The method of claim 10, further comprising separating the printed circuit panel into individual printed circuit boards subsequent to said performing additional fabrication operations.

13. The method of claim 8, wherein said performing the fabrication operations comprises fabricating circuit elements on the PCB using semiconductive ink printing technology.

14. An apparatus comprising

a multi-layer printed circuit board (PCB) comprising:

a radio frequency identification (RFID) tag circuit fabricated on a layer of the multi-layer PCB; and

an RFID antenna coupled to the RFID tag circuit.

15. The apparatus of claim 14, wherein the RFID antenna comprises a conductive trace disposed on a same layer of the PCB as the RFID tag.

16. The apparatus of claim 14, wherein the RFID antenna comprises a conductive trace disposed on different layer of the PCB as the RFID tag.

17. The apparatus of claim 14, wherein the fabricated RFID tag circuit comprises a circuit created with semi-conductive ink printing technology.

18. The apparatus of claim 14, wherein the layer is an inner layer of the PCB.

19. A system, comprising

an electronic device comprising:

a power supply;

a printed circuit board (PCB) coupled to the power supply and comprising a radio frequency identification (RFID) tag circuit fabricated on the PCB and an RFID antenna coupled to the RFID tag circuit.

20. The system of claim 19, wherein the RFID antenna comprises a conductive trace disposed on the PCB.

21. The system of claim 19, wherein the RFID tag circuit comprises a circuit created with semi-conductive ink printing technology.