Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
First Claim
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1. A device comprising:
- a conductive layer formed on a first substrate;
an opening line formed in the conductive layer to make the conductive layer part of an antenna structure;
an integrated circuit chip placed over at least a portion the opening line and is electrically interconnected to the conductive layer.
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Abstract
An RFID device. The device comprises a conductive layer formed on a first substrate. An opening line (or two or more opening lines) is formed in the conductive layer to make the conductive layer a part of an antenna structure. An integrated circuit chip is placed over at least a portion the opening line and coupled to the conductive layer. The integrated circuit chip is electrically connected to the conductive layer.
147 Citations
23 Claims
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1. A device comprising:
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a conductive layer formed on a first substrate;
an opening line formed in the conductive layer to make the conductive layer part of an antenna structure;
an integrated circuit chip placed over at least a portion the opening line and is electrically interconnected to the conductive layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method comprising:
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creating an opening line in a conductive layer formed on a first substrate, the opening line enabling the conductive layer to act as a part of an antenna for an RFID device; and
coupling a RFID integrated circuit chip to the conductive layer, wherein the RFID integrated circuit chip is placed over a portion of the opening line and is electrically interconnected to the conductive layer. - View Dependent Claims (14, 15, 16, 17, 18)
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19. A method comprising:
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assembling an RFID tag, the RFID tag having an RFID integrated circuit chip coupled thereto;
providing a conductive layer having an opening line formed therein, the opening line enabling the conductive layer to function as a part of an antenna for an RFID device;
coupling the RFID tag to the conductive layer wherein the RFID integrated circuit chip is placed over a portion of the opening line, the RFID tag and the conductive layer forming the RFID device; and
placing the conductive layer having the RFID tag coupled thereto to an item. - View Dependent Claims (20, 21, 22, 23)
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Specification