Transponder incorporated into an electronic device

• US 20060109129A1
• Filed: 11/22/2004
• Published: 05/25/2006
• Est. Priority Date: 11/22/2004
• Status: Active Grant

• Current Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Original Assignee: Alien Technology Corporation
• Inventors: Carrender, Curt
• Granted Patent: US 7,385,284 B2
• Time in Patent Office: Days
• US Class Current: 340/572.700
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/07788 the antenna being of the capacitive type
• CPC Class Codes: G08B 13/2417 having a radio frequency identification chip
• CPC Class Codes: G08B 13/2437 Tag layered structure, processes for making layered tags
• CPC Class Codes: G08B 13/2445 Tag integrated into item to be protected, e.g. source tagging
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 2224/7665 Means for transporting the components to be connected
• CPC Class Codes: H01L 2224/82039 using a laser
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01075 Rhenium [Re]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15155 the shape of the recess being other than a cuboid
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate

Abstract

An electronic device. The device comprises a metalization layer and an integrated circuit chip incorporated into the device wherein the integrated circuit chip is capacitively coupled to the metalization layer. The device comprises a first substrate having the metalization layer formed on the substrate, a cap layer covering at least the entire metalization layer and at least a portion of the first substrate not covered by the metalization layer. The integrated circuit chip is coupled to the first substrate, and is placed in proximity and in non-physical contact with the metalization layer. A conductive layer is attached to the integrated circuit chip. The conductive layer has at least a portion placed in a non-physical contact with the metalization layer. The integrated circuit chip is capacitively coupled to the metalization layer through the conductive layer and the metalization layer.

Claims

1. A device comprising:

a first substrate having a metalization layer formed on the first substrate, a cap layer covering at least all of the metalization layer, at least a portion of the first substrate is not covered by the metalization layer;

an integrated circuit chip coupled to the first substrate, the integrated circuit chip being placed in proximity and in non-physical contact with the metalization layer; and

a conductive layer attached to the integrated circuit chip, the conductive layer having at least a portion placed in a non-physical contact with the metalization layer, wherein the integrated circuit chip is capacitively coupled to the metalization layer through the conductive layer and the metalization layer.

2. The device of claim 1 wherein the integrated circuit chip is a Radio Frequency Identification (RFID) chip.

3. The device of claim 1 wherein the conductive layer extends from the integrated circuit chip.

4. The device of claim 1 wherein the conductive layer touches a portion of the metalization layer.

5. The device of claim 1 wherein the integrated circuit chip is an RFID chip and the metalization layer functions as an antenna for an RFID transponder.

6. The device of claim 1 wherein the integrated circuit chip further comprising:

one or more contact pads, the conductive layer is coupled to the contact pads and extended therefrom.

7. The device of claim 1 wherein the integrated circuit chip is deposited in a second substrate having a receptor configured to receive the integrated circuit chip and wherein the second substrate is adhered to the first substrate.

8. The device of claim 7 wherein the integrated circuit chip is deposited in the second substrate using a fluidic-self-assembly (FSA) process.

9. The device of claim 7 wherein the integrated circuit chip is recessed below a surface of the second substrate.

10. The device of claim 7 wherein the integrated circuit chip is configured with a predetermined shape and size and the receptor is configured with a complimentary shape and size to the integrated circuit chip.

11. The device of claim 7 wherein the second substrate has a portion that overlaps an area that comprises the metalization layer.

12. The device of claim 7 wherein the conductive layer is formed on the second substrate and placed in partial contact with the metalization layer.

13. The device of claim 1 wherein the conductive layer having a configuration selected from a group consisting of loop, circular, straight, curved, folded, and dipole.

14. The device of claim 1 wherein the conductive layer provides an extension for the integrated circuit chip to capacitively couple to the metalization layer.

15. The device of claim 1 wherein the conductive layer is formed placed partially on the first substrate.

16. The device of claim 1 further comprising:

a non-conductive layer formed on top of the substrate, wherein the metalization layer is formed on top of the non-conductive layer.

17. The device of claim 1 wherein the device comprises a CD, CD-ROM, CD-R, CD-RW, CD-I, DVD, DVD-ROM, DVD-R, and DVD-RAM.

18. The device of claim 1 further comprising:

one or more balancing components placed on the device so as to balance weight on the device.

52. The device of claim 3 wherein the device comprises a CD, CD-ROM, CD-R, CD-RW, CD-I, DVD, DVD-ROM, DVD-R, and DVD-RAM.

19. A device comprising:

a first substrate having a metalization layer formed on the first substrate, a cap layer covering at least all of the metalization layer, at least a portion of the first substrate is not covered by the metalization layer;

a label placed over the first substrate;

an integrated circuit chip coupled to the label, the integrated circuit chip being placed in proximity and in non-physical contact with the metalization layer; and

a conductive layer attached to the integrated circuit chip, the conductive layer having at least a portion placed in a non-physical contact with the metalization layer, wherein the integrated circuit chip is capacitively coupled to the metalization layer through the conductive layer and the metalization layer.

20. The device of claim 19 wherein the conductive layer is formed on the label and coupled to the integrated circuit chip.

21. The device of claim 19 wherein the conductive layer is formed on the first substrate and coupled to the integrated circuit chip.

22. The device of claim 19 wherein the integrated circuit chip is a Radio Frequency Identification (RFID) chip.

23. The device of claim 19 wherein the conductive layer extends from the integrated circuit chip.

24. The device of claim 19 wherein the conductive layer touches a portion of the metalization layer.

25. The device of claim 19 wherein the integrated circuit chip is an RFID chip and the metalization layer functions as an antenna for an RFID transponder.

26. The device of claim 19 wherein the integrated circuit chip further comprising:

one or more contact pads, the conductive layer is coupled to the contact pads and extended therefrom.

27. The device of claim 19 wherein the integrated circuit chip is deposited in a second substrate having a receptor configured to receive the integrated circuit chip and wherein the second substrate is adhered to the label.

28. The device of claim 27 wherein the integrated circuit chip is deposited in the second substrate using a fluidic-self-assembly (FSA) process.

29. The device of claim 27 wherein the integrated circuit chip is recessed below a surface of the second substrate.

30. The device of claim 27 wherein the integrated circuit chip is configured with a predetermined shape and size and the receptor is configured with a complimentary shape and size to the integrated circuit chip.

31. The device of claim 27 wherein the second substrate is adhered to the label and wherein the second substrate has a portion that overlaps an area that comprises the metalization layer.

32. The device of claim 26 wherein the conductive layer is formed on the second substrate and placed in partial contact with the metalization layer.

33. The device of claim 19 wherein the conductive layer having a configuration selected from a group consisting of loop, circular, straight, curved, folded, and dipole.

34. The device of claim 19 wherein the conductive layer provides an extension for the integrated circuit chip to capacitively couple to the metalization layer.

35. The device of claim 19 wherein the conductive layer is formed placed partially on the label.

36. The device of claim 19 further comprising:

a non-conductive layer formed on top of the substrate, wherein the metalization layer is formed on top of the non-conductive layer.

37. The device of claim 19 wherein the device comprises a CD, CD-ROM, CD-R, CD-RW, CD-I, DVD, DVD-ROM, DVD-R, and DVD-RAM.

38. The device of claim 19 further comprising:

one or more balancing components placed on the device so as to balance weight on the device.

39. A device comprising:

a first substrate having a metalization layer formed on the substrate, a cap layer covering at least all of the metalization layer, at least a central portion of the first substrate is not covered by the metalization layer; and

a center ring substrate placed over the central portion, the center ring substrate comprising an integrated circuit chip disposed therein, a conductive layer attached to the integrated circuit chip, and one or more weight balancing components,

the integrated circuit chip is placed such that the integrated circuit chip is in proximity and in non-physical contact with the metalization layer,

the conductive layer having at least a portion placed in a non-physical contact with the metalization layer, and

wherein the integrated circuit chip is capacitively coupled to the metalization layer through the conductive layer and the metalization layer.

40. The device of claim 39 wherein the integrated circuit chip is a Radio Frequency Identification (RFID) chip.

41. The device of claim 39 wherein the conductive layer extends from the integrated circuit chip.

42. The device of claim 39 wherein the conductive layer partially touches a portion of the metalization layer.

43. The device of claim 39 wherein the integrated circuit chip is an RFID chip and the metalization layer functions as an antenna for an RFID transponder.

44. The device of claim 39 wherein the integrated circuit chip further comprising:

one or more contact pads, the conductive layer is coupled to the contact pads and extended therefrom.

45. The device of claim 39 wherein the center ring substrate includes a receptor configured to receive the integrated circuit chip deposited therein.

46. The device of claim 45 wherein the integrated circuit chip is deposited in the center ring substrate using a fluidic-self-assembly (FSA) process.

47. The device of claim 45 wherein the integrated circuit chip is recessed below a surface of the center ring substrate.

48. The device of claim 45 wherein the integrated circuit chip is configured with a predetermined shape and size and the receptor is configured with a complimentary shape and size to the integrated circuit chip.

49. The device of claim 45 further comprises a label adhered to the device, wherein the center ring substrate is adhered to a label.

50. The device of claim 39 wherein the conductive layer having a configuration selected from a group consisting of loop, circular, straight, curved, folded, and dipole.

51. The device of claim 39 wherein the conductive layer provides an extension for the integrated circuit chip to capacitively couple to the metalization layer.

53. A method comprising:

obtaining an electronic device, the electronic device comprising a first substrate having a metalization layer formed on the substrate, a cap layer covering at least all of the metalization layer, at least a portion of the first substrate is not covered by the metalization layer;

providing an RFID transponder, the RFID transponder includes identification information for the electronic device; and

providing an RFID reader receptive of the RFID transponder;

wherein the RFID transponder is incorporated into the electronic device and wherein the RFID transponder is configured to utilize the metalization layer as an antenna for the RFID transponder.

54. The method of claim 53 wherein the RFID transponder includes an integrated circuit chip coupled to the first substrate and placed in proximity and in non-physical contact with the metalization layer;

a conductive layer attached to the integrated circuit chip, the conductive layer having at least a portion placed in a non-physical contact with the metalization layer;

wherein the integrated circuit chip is capacitively coupled to the metalization layer through the conductive layer and the metalization layer.

55. The method of claim 54 wherein the integrated circuit chip is deposited in a second substrate having a receptor configured to receive the integrated circuit chip and wherein the second substrate is adhered to the first substrate.

56. The method of claim 55 wherein the integrated circuit chip is deposited in the second substrate using a fluidic-self-assembly (FSA) process.

57. The method of claim 56 wherein the integrated circuit chip is recessed below a surface of the second substrate.

58. The method of claim 57 wherein the integrated circuit chip is configured with a predetermined shape and size and the receptor is configured with a complimentary shape and size to the integrated circuit chip.

59. The method of claim 58 wherein the second substrate has a portion that overlaps an area that comprises the metalization layer.

60. The method of claim 59 wherein the conductive layer is formed on the second substrate and placed in partial contact with the metalization layer.

61. The method of claim 53 wherein the RFID transponder includes a cap layer covering at least all of the metalization layer, at least a portion of the first substrate not covered by the metalization layer, and a label placed over the first substrate, the integrated circuit chip is coupled to the label and being placed in proximity and in non-physical contact with the metalization layer;

the integrated circuit chip further connecting to a conductive layer, the conductive layer having at least a portion placed in a non-physical contact with the metalization layer, and the integrated circuit chip is capacitively coupled to the metalization layer through the conductive layer and the metalization layer.

62. The method of claim 61 wherein the integrated circuit chip is deposited in a second substrate having a receptor configured to receive the integrated circuit chip and wherein the second substrate is adhered to the label.

63. The method of claim 62 wherein the integrated circuit chip is deposited in the second substrate using a fluidic-self-assembly (FSA) process.

64. The method of claim 62 wherein the integrated circuit chip is recessed below a surface of the second substrate.

65. The method of claim 62 wherein the integrated circuit chip is configured with a predetermined shape and size and the receptor is configured with a complimentary shape and size to the integrated circuit chip.

66. The method of claim 62 wherein the second substrate is adhered to the label and wherein the second substrate has a portion that overlaps an area that comprises the metalization layer.

67. The method of claim 62 wherein the conductive layer is formed on the second substrate and placed in partial contact with the metalization layer.

68. The method of claim 53 wherein the RFID transponder includes at least a central portion of the substrate is not covered by the metalization layer;

and a center ring substrate placed over the central portion, the center ring substrate comprising an integrated circuit chip disposed therein, a conductive layer attached to the integrated circuit chip, and one or more weight balancing components, the integrated circuit chip is placed such that the integrated circuit chip is in proximity and in non-physical contact with the metalization layer, the conductive layer having at least a portion placed in a non-physical contact with the metalization layer; and

wherein the integrated circuit chip is capacitively coupled to the metalization layer through the conductive layer and the metalization layer.

69. The method of claim 68 wherein the center ring substrate includes a receptor configured to receive the integrated circuit chip deposited therein.

74. The method of claim 53 wherein tagging includes at least one of identifying, authenticating, recognizing, inventorying, checking-in, checking-out, tracking, locating, and sensing the electronic device.

75. The method of claim 53 wherein the electronic device comprises a CD, CD-ROM, CD-R, CD-RW, CD-I, DVD, DVD-ROM, DVD-R, and DVD-RAM.

70. The method of claim 70 wherein the integrated circuit chip is deposited in the center ring substrate using a fluidic-self-assembly (FSA) process.

71. The method of claim 70 wherein the integrated circuit chip is recessed below a surface of the center ring substrate.

72. The method of claim 70 wherein the integrated circuit chip is configured with a predetermined shape and size and the receptor is configured with a complimentary shape and size to the integrated circuit chip.

73. The method of claim 70 further comprises a label adhered to the device, wherein the center ring substrate is adhered to a label.

76. An apparatus comprising:

a machine readable storage medium disposed in a first substrate;

a radio frequency identification (RFID) integrated circuit (IC) coupled to the first substrate, the RFID IC identifying a content of the machine readable storage medium.

77. An apparatus as in claim 76 wherein the RFID IC is disposed in a recessed receptor region in a second substrate which is attached to the first substrate.

78. An apparatus as in claim 76 wherein the RFID IC is disposed in a recessed receptor in the first substrate.

79. An apparatus as in claim 76 wherein the content is at least one of:

(a) executable computer program instructions;

or (b) audio content;

or (c) audiovisual content.

80. An apparatus as in claim 79 wherein the audio content comprises music and wherein the audiovisual content comprises a movie.

81. An apparatus as in claim 76 wherein the RFID IC comprises a value which is used to protect the content from being successfully copied.

82. An apparatus as in claim 76 wherein the RFID IC is adhered to the first substrate.

83. An apparatus as in claim 76 further comprising:

a metalization layer formed on the first substrate, a cap layer covering at least all of the metalization layer, at least a portion of the first substrate is not covered by the meatlaization layer

the RFID IC is in a non-physical contact with the metalization layer and is capacitively coupled to the metalization layer.

84. An apparatus as in claim 83 further comprising:

a conductive layer attached to the RFID IC, the conductive layer having at least a portion placed in a non-physical contact with the metalization layer, wherein the conductive layer capacitively couples the RFID IC to the metalization layer.

85. An apparatus as in claim 84 wherein the conductive layer extends from the RFID IC.

86. An apparatus as in claim 85 wherein the metalization layer functions as an antenna for an RFID transponder.

87. An apparatus as in claim 76 wherein the RFID IC is disposed in a second substrate, wherein the second substrate is coupled to the first substrate.

88. An apparatus as in claim 87 wherein the RFID IC is disposed on the second substrate using an FSA process.