Radio frequency identification (RFID) tag for an item having a conductive layer included or attached

• US 20060109130A1
• Filed: 01/10/2005
• Published: 05/25/2006
• Est. Priority Date: 11/22/2004
• Status: Abandoned Application

• Current Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Original Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Inventors: Carrender, Curt, Hattick, John Bernhard, Hassman, Gregory Van
• Application Number:
  US11/032,944
• Publication Number:
  US 20060109130A1
• Time in Patent Office: Days
• US Class Current: 340/572.700
• CPC Class Codes: G06K 19/045 the record carrier being of the non-contact type, e.g. RFID, and being specially adapted for attachment to a disc, e.g. a CD or DVD
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 2224/7665 Means for transporting the components to be connected
• CPC Class Codes: H01L 2224/82039 using a laser
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01057 Lanthanum [La]
• CPC Class Codes: H01L 2924/01058 Cerium [Ce]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/10158 at the passive surface
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15155 the shape of the recess being other than a cuboid
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01Q 1/2225 : used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 9/28 : Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines waveguide horns or mouths H01Q13/00; slot antennas H01Q13/00

Abstract

An RFID device. The device comprises a conductive layer formed on a first substrate. An opening line (or two or more opening lines) is formed in the conductive layer to make the conductive layer a part of an antenna structure. An integrated circuit chip is placed over at least a portion the opening line and coupled to the conductive layer. The integrated circuit chip is electrically connected to the conductive layer.

Claims

1. A device comprising:

a conductive layer formed on a first substrate;

an opening line formed in the conductive layer to make the conductive layer part of an antenna structure;

an integrated circuit chip placed over at least a portion the opening line and is electrically interconnected to the conductive layer.

2. The device of claim 1 wherein the integrated circuit chip is a Radio Frequency Identification (RFID) chip.

3. The device of claim 1 wherein the opening line formed in the conductive layer makes the conductive layer an antenna for an RFID device.

4. The device of claim 3 further comprises a second opening line formed in the conductive layer, the second opening line providing resonance for the RFID device.

5. The device of claim 1 further comprising a conductive interconnect that extends from the integrated circuit chip, wherein the conductive interconnect electrically connects the integrated circuit chip to the conductive layer.

6. The device of claim 5 wherein the conductive interconnect has a configuration selected from a group consisting of loop, circular, straight, curved, folded, and dipole.

7. The device of claim 1 wherein the integrated circuit chip further comprising:

one or more contact pads, the conductive layer is coupled to the contact pads and extended therefrom.

8. The device of claim 1 wherein the integrated circuit chip is deposited in a second substrate having a receptor configured to receive the integrated circuit chip and wherein the second substrate is adhered to the conductive layer in a manner to allow the integrated circuit chip to electrically interconnect to the conductive layer.

9. The device of claim 8 wherein the integrated circuit chip is deposited in the second substrate using a fluidic-self-assembly (FSA) process.

10. The device of claim 8 wherein the integrated circuit chip is recessed below a surface of the second substrate.

11. The device of claim 8 wherein the integrated circuit chip is configured with a predetermined shape and size and the receptor is configured with a complimentary shape and size to the integrated circuit chip.

12. The device of claim 1 wherein the device comprises a Blister Pack, a cap, a sealing, and an object that can incorporates the conductive layer.

13. A method comprising:

creating an opening line in a conductive layer formed on a first substrate, the opening line enabling the conductive layer to act as a part of an antenna for an RFID device; and

coupling a RFID integrated circuit chip to the conductive layer, wherein the RFID integrated circuit chip is placed over a portion of the opening line and is electrically interconnected to the conductive layer.

14. The method of claim 13 further comprising:

placing a cap layer over the conductive layer and the RFID integrated circuit chip.

15. The method of claim 13 further comprising:

recessing the integrated circuit chip into a second substrate; and

coupling the second substrate to the conductive layer such that the integrated circuit chip is interconnected to the conductive layer.

16. The method of claim 15 wherein the recessing the integrated circuit chip into the second substrate further comprises depositing the integrated circuit chip into a receptor created in the second substrate using a fluidic-self-assembly (FSA) process.

17. The method of claim 15 wherein the integrated circuit chip is recessed below a surface of the second substrate.

18. The method of claim 13 further comprises creating a second opening line in the conductive layer, the second opening line providing resonance for the RFID device.

19. A method comprising:

assembling an RFID tag, the RFID tag having an RFID integrated circuit chip coupled thereto;

providing a conductive layer having an opening line formed therein, the opening line enabling the conductive layer to function as a part of an antenna for an RFID device;

coupling the RFID tag to the conductive layer wherein the RFID integrated circuit chip is placed over a portion of the opening line, the RFID tag and the conductive layer forming the RFID device; and

placing the conductive layer having the RFID tag coupled thereto to an item.

20. The method as in claim 19 wherein the method is carried out by a web process.

21. The method as in claim 19 wherein the item is anyone of a Blister Pack, a bottle, and a bottle cap.

22. The method as in claim 19 further comprises, providing an RFID reader to communicate with the RFID device.

23. The method as in claim 19 further comprises a second opening line formed in the conductive layer, the second opening line providing resonance for the RFID device.

45. The apparatus of claim 21 wherein the integrated circuit is recessed within a substrate.

46. The apparatus of claim 21 further comprising a conductive loop electrically interconnected to the antenna structure and the integrated circuit, the conductive loop being at least a part of a resonator.

24. An apparatus, comprising:

a conductive loop having a gap between a first end of the conductive loop and a second end of the conductive loop;

an integrated circuit assembly disposed across the gap and electrically coupled to the conductive loop at the first end of the conductive loop and the second end of the conductive loop; and

an antenna structure comprising;

a first antenna element coupled to the conductive loop and the integrated circuit assembly at a first side of the gap; and

a second antenna element coupled to the conductive loop and the integrated circuit assembly at a second side of the gap, wherein

the first antenna element and the second antenna element are mutually coupled.

25. The apparatus of claim 24, wherein the first antenna element and the second antenna element are capacitively coupled.

26. The apparatus of claim 25, wherein the first antenna element includes a first end, the second antenna element includes a second end, and wherein the first end is coupled to the second end.

27. The apparatus of claim 25, wherein the first antenna element includes an inner edge, the second antenna element includes an outer edge, and wherein the inner edge of the first antenna element is coupled to the outer edge of the second antenna element.

28. The apparatus of claim 25, wherein the first antenna element includes a front surface, the second antenna element includes a back surface, and wherein the front surface of the first antenna element is coupled to the back surface of the second antenna element.

29. The apparatus of claim 24, wherein the conductive loop, the first antenna element and the second antenna element are coplanar.

30. The apparatus of claim 29, wherein a geometry of each of the first antenna element and the second antenna element are selected to control a characteristic impedance of the antenna structure.

31. The apparatus of claim 29, wherein a gap between the first antenna element and the second antenna element is selected to control a terminal impedance of the antenna structure.

32. The apparatus of claim 29, further comprising a dielectric substrate material, wherein the conductive loop, the first antenna element and the second antenna element are formed on a surface of the dielectric substrate material.

33. The apparatus of claim 32, wherein the maximum lateral dimension of the antenna structure is less than two inches.

34. The apparatus of claim 32, wherein the conductive loop, the first antenna element and the second antenna element are formed by one of screen printing, vapor-phase deposition and photo-etching.

35. The apparatus of claim 32, wherein an other surface of the dielectric substrate material comprises an adhesive layer, wherein the integrated circuit assembly, the conductive loop, the antenna structure and the dielectric substrate material comprise an RFID label.

36. The apparatus of claim 24, wherein the integrated circuit assembly comprises an RFID strap assembly.

37. The apparatus of claim 36, wherein the integrated circuit assembly comprises an RFID device.

38. The apparatus of claim 37, wherein the RFID device comprises a passive RFID device.

39. An apparatus, comprising:

a conductive loop having a gap between a first end of the conductive loop and a second end of the conductive loop;

an integrated circuit assembly disposed across the gap and electrically coupled to the conductive loop at the first end of the conductive loop and the second end of the conductive loop;

a first antenna element coupled to the conductive loop and the integrated circuit assembly at a first side of the gap; and

a second antenna element coupled to the conductive loop and the integrated circuit assembly at a second side of the gap, wherein

the first antenna element and the second antenna element are adapted to conform to the circumference of an object, wherein the first antenna element and the second antenna element are mutually coupled.

40. The apparatus of claim 39, wherein the object comprises a pharmaceutical item.

41. The apparatus of claim 40, wherein the pharmaceutical item comprises one of a vial, a bottle and a syringe.

42. An apparatus, comprising:

a first conductive loop having a gap;

an integrated circuit electrically coupled to the first conductive loop across the gap;

at least two antenna elements coupled to the integrated circuit, the antenna elements configured in two dimensions to form a second conductive loop with a gap, wherein the antenna elements are mutually coupled.

43. An apparatus, comprising:

a first conductive loop having a gap;

an integrated circuit electrically coupled to the first conductive loop across the gap;

at least two antenna elements coupled to the integrated circuit, the antenna elements configured in three dimensions to form a second conductive loop with a gap, wherein the antenna elements are mutually coupled.

44. An apparatus comprising:

an antenna structure having a first antenna element and a second antenna element;

an integrated circuit electrically connected between said first and second antenna elements,

the antenna structure arranged in a three dimensional shape such that the first antenna element and the second antenna element are coupled to each other.