Method for preparing ball grid array substrates via use of a laser
First Claim
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1. A method for using a molding system having a substrate cleaning device comprising:
- introducing a substrate having a surface in the molding system;
preheating the substrate;
forming a resist layer;
baking the substrate; and
removing contaminants from the substrate using a laser.
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Abstract
A method of using a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can be used to roughen the surface of a substrate to provide better adhesion when attaching the die to the substrate.
102 Citations
19 Claims
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1. A method for using a molding system having a substrate cleaning device comprising:
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introducing a substrate having a surface in the molding system;
preheating the substrate;
forming a resist layer;
baking the substrate; and
removing contaminants from the substrate using a laser. - View Dependent Claims (2, 3)
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4. A method for operating a system having a cleaning device for molding comprising:
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introducing a substrate having a surface for molding in the system;
preheating the substrate;
forming a resist layer;
baking the substrate; and
removing contaminants from the substrate using a laser. - View Dependent Claims (5, 6)
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7. A method for use in an automolding system comprising:
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providing a substrate cleaning device for the automolding system;
introducing a substrate having a surface in the automolding system;
preheating the substrate;
forming a resist layer;
baking the substrate; and
removing contaminants from the substrate using the cleaning device. - View Dependent Claims (8, 9, 10)
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11. A method for forming in a molding system comprising:
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providing the molding system with a substrate cleaning device;
introducing a substrate having a surface in the molding system;
preheating the substrate;
forming a resist layer;
baking the substrate; and
removing contaminants from the substrate using the substrate cleaning device. - View Dependent Claims (12, 13, 14, 15)
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16. A method for a system for molding comprising:
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providing a substrate cleaning device in the system for molding;
introducing a substrate having a surface for molding in the system;
preheating the substrate;
forming a resist layer;
baking the substrate; and
removing contaminants from the substrate using the substrate cleaning device. - View Dependent Claims (17, 18, 19)
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Specification