Ultrasonic head

• US 20060113351A1
• Filed: 04/14/2005
• Published: 06/01/2006
• Est. Priority Date: 11/30/2004
• Status: Abandoned Application

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Kasuga, Toshinori, Ozaki, Yukio
• Application Number:
  US11/105,437
• Publication Number:
  US 20060113351A1
• Time in Patent Office: Days
• US Class Current: 228/2.100
• CPC Class Codes: B23K 20/106 Features related to sonotrodes
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: H01L 2224/0554 External layer
• CPC Class Codes: H01L 2224/0555 Shape
• CPC Class Codes: H01L 2224/0556 Disposition
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/351 Thermal stress

Abstract

An ultrasonic head 10a, which is used in an ultrasonic bonder for bonding an LSI chip and a substrate by using the ultrasonic vibration, includes: a protrusion 13a constituting a resonating apparatus 15 for contacting with the LSI chip and carrying out the ultrasonic vibration; a thermal conductive elastic body 17a placed on a surface of a main shaft 12 constituting the resonating apparatus 15; and a heater 16a which is placed on a surface of the thermal conductive elastic body 17a and produces a heat and gives the heat through the thermal conductive elastic body 17a and the main shaft 12 and protrusion 13a constituting the resonating apparatus 15 to a vicinity of a bonding portion between the LSI chip and the substrate.

Claims

1. A resonating apparatus in an ultrasonic bonder bonding a first target and a second target by using an ultrasonic vibration, comprising:

a resonating unit contacting with at least the first target and carrying out an ultrasonic vibration;

a thermal conductive elastic body placed on a surface of the resonating unit; and

a heater body which is placed on a surface of the thermal conductive elastic body and produces a heat and gives the heat to a vicinity of a bonding portion between the first target and the second target through the thermal conductive elastic body and the resonating unit.

2. The resonating apparatus according to claim 1, wherein the thermal conductive elastic body is filled on a predetermined surface of the resonating unit and constitutes a plate-shaped body, and

the heater body is plate-shaped and placed on a surface opposite to a contact surface with the resonating unit in the thermal conductive elastic body.

3. The resonating apparatus according to claim 1, wherein the thermal conductive elastic body is filled on an inner circumferential surface of a hole formed in the resonating unit and constitutes a cylinder, and

the heater body is bar-shaped and placed inside the cylinder of the thermal conductive elastic body.

4. The resonating apparatus according to claim 1, wherein the heater body or a radiation member into which the heater body is incorporated is shaped so as to cover the resonating unit.

6. The resonating apparatus according to claim 1, wherein the thermal conductive elastic body is silicon gel or silicon rubber.

5. A resonating apparatus in an ultrasonic bonder bonding a first target and a second target by using an ultrasonic vibration, comprising:

a resonating unit contacting with at least the first target and vibrating; and

a heater body which is molded integrally with the resonating unit on a surface of the resonating unit and produces a heat and gives the heat to a vicinity of a bonding portion between the first target and the second target through the thermal conductive elastic body and the resonating unit.

7. An ultrasonic head in an ultrasonic bonder bonding a first target and a second target by using an ultrasonic vibration, comprising:

an ultrasonic vibrator;

a resonating unit contacting with the first target and carrying out an ultrasonic vibration, and connected to the ultrasonic vibrator;

a thermal conductive elastic body placed on a surface of the resonating unit; and

a heater body which is placed on a surface of the thermal conductive elastic body and produces a heat and gives the heat to a vicinity of a bonding portion between the first target and the second target through the thermal conductive elastic body and the resonating unit.

8. The ultrasonic head according to claim 7, wherein the thermal conductive elastic body is plate-shaped and placed on a predetermined surface of the resonating unit, and

the heater body is plate-shaped and placed on a surface opposite to a contact surface with the resonating unit in the thermal conductive elastic body.

9. The ultrasonic head according to claim 7, wherein the thermal conductive elastic body is placed on an inner circumferential surface of a hole formed in the resonating unit and has a cylindrical shape, and

the heater body is bar-shaped and placed inside the cylinder of the thermal conductive elastic body.

10. The ultrasonic head according to claim 7, wherein the heater body or a radiation member into which the heater body is incorporated is shaped so as to cover the resonating unit.

12. The ultrasonic head according to claim 7, wherein the thermal conductive elastic body is silicon gel or silicon rubber.

11. An ultrasonic head in an ultrasonic bonder bonding a first target and a second target by using an ultrasonic vibration, comprising:

an ultrasonic vibrator;

a resonating unit contacting with the first target and vibrating, and connected to the ultrasonic vibrator; and

a heater body which is molded integrally with the resonating unit on a surface of the resonating unit and produces a heat and gives the heat to a vicinity of a bonding portion between the first target and the second target through the thermal conductive elastic body and the resonating unit.

13. An ultrasonic bonder bonding a first target and a second target by using an ultrasonic vibration, comprising:

a ultrasonic vibrator;

a resonating unit contacting with at least one of the first target and the second target and carrying out an ultrasonic vibration, and connected to the ultrasonic vibrator;

a thermal conductive elastic body placed on a surface of the resonating unit;

a heater body which is placed on a surface of the thermal conductive elastic body and produces a heat and gives the heat to a vicinity of a bonding portion between the first target and the second target through the thermal conductive elastic body and the resonating unit; and

a pressing mechanism in which the resonating unit presses a protrusion of a surface opposite to at least one of the first target and the second target to at least one of the first target and the second target.

14. The resonating apparatus according to claim 13, wherein the thermal conductive elastic body is plate-shaped and placed on a predetermined surface of the resonating unit, and

the heater body is plate-shaped and placed on a surface opposite to a contact surface with the resonating unit in the thermal conductive elastic body.

15. The resonating apparatus according to claim 13, wherein the thermal conductive elastic body is placed on an inner circumferential surface of a hole formed in the resonating unit and has a cylindrical shape, and

the heater body is bar-shaped and placed inside the cylinder of the thermal conductive elastic body.

16. The resonating apparatus according to claim 13, wherein the heater body or a radiation member into which the heater body is incorporated is shaped so as to cover the resonating unit.

18. The ultrasonic bonder according to claim 13, wherein the thermal conductive elastic body is silicon gel or silicon rubber.

17. An ultrasonic bonder bonding a first target and a second target by using an ultrasonic vibration, comprising:

an ultrasonic vibrator;

a resonating unit contacting with at least the first target and vibrating, and connected to the ultrasonic vibrator;

a heater body which is molded integrally with the resonating unit on a surface of the thermal conductive elastic body and produces a heat and gives the heat to a vicinity of a bonding portion between the first target and the second target through the thermal conductive elastic body and the resonating unit; and

a pressing mechanism in which the resonating unit presses a protrusion of a surface opposite to at least one of the first target and the second target to at least one of the first target and the second target.