Light emitting diode chip with large heat dispensing and illuminating area

• US 20060113555A1
• Filed: 11/23/2005
• Published: 06/01/2006
• Est. Priority Date: 12/01/2004
• Status: Abandoned Application

• Current Assignee: Chiu-Chung Yang
• Original Assignee: Chiu-Chung Yang
• Inventors: Yang, Chiu-Chung
• Application Number:
  US11/285,799
• Publication Number:
  US 20060113555A1
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/05111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/05124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/05144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05611 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05639 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/38 : with a particular shape
• CPC Class Codes: H01L 33/405 : Reflective materials
• CPC Class Codes: H01L 33/486 : adapted for surface mounting
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting diode chip has a large area of electricity conducting material applied to each of the P pole and the N pole and the etching process does not reduce the illuminating area so that the areas of illumination and reflection are increased and the efficiency for dispensing heat is increased. The light emitting diode chip needs no encapsulation and includes functions as those flip chips and SMD.

Claims

1. A chip comprising:

a P pole and an N pole, each of the a P pole and an N pole having a large area of electricity conductive material connected thereto, an etching area to the area of the electricity conductive material being reduced and the electricity conductive material reflecting light, the chip having function of SMD and flip chip without encapsulation.

2. The chip as claimed in claim 1, wherein the electricity conductive material is gold, silver, copper, aluminum, tin or alloy.