Semiconductor device and manufacturing method thereof
First Claim
1. A semiconductor device comprising:
- a semiconductor layer over a substrate, the semiconductor layer comprising;
a channel forming region;
a first impurity region forming a source region or a drain region containing a single conductivity type impurity element; and
a second impurity region forming an LDD region contacting the channel forming region, an insulating film in contact with the semiconductor layer;
a gate electrode having a tapered portion in contact with the insulating film;
wherein a portion of the second impurity region is overlapped with the gate electrode, wherein a thickness of a portion of the insulating film overlapped with the gate electrode is thicker than a thickness of the other portion of the insulating film.
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Abstract
In a semiconductor device, typically an active matrix display device, the structure of TFTs arranged in the respective circuits are made suitable in accordance with the function of the circuit, and along with improving the operating characteristics and the reliability of the semiconductor device, the manufacturing cost is reduced and the yield is increased by reducing the number of process steps. A semiconductor device has a semiconductor layer, an insulating film formed contacting the semiconductor layer, and a gate electrode having a tapered portion on the insulating film, in the semiconductor device, the semiconductor layer has a channel forming region, a first impurity region for forming a source region or a drain region and containing a single conductivity type impurity element, and a second impurity region for forming an LDD region contacting the channel forming region, a portion of the second impurity region is formed overlapping a gate electrode, and the concentration of the single conductivity type impurity element contained in the second impurity region becomes larger with distance from the channel forming region.
62 Citations
24 Claims
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1. A semiconductor device comprising:
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a semiconductor layer over a substrate, the semiconductor layer comprising;
a channel forming region;
a first impurity region forming a source region or a drain region containing a single conductivity type impurity element; and
a second impurity region forming an LDD region contacting the channel forming region, an insulating film in contact with the semiconductor layer;
a gate electrode having a tapered portion in contact with the insulating film;
wherein a portion of the second impurity region is overlapped with the gate electrode, wherein a thickness of a portion of the insulating film overlapped with the gate electrode is thicker than a thickness of the other portion of the insulating film. - View Dependent Claims (7, 13)
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2. A semiconductor device comprising:
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a semiconductor layer over a substrate, the semiconductor layer comprising;
a channel forming region;
a first impurity region forming a source region or a drain region containing a single conductivity type impurity element; and
a second impurity region forming an LDD region contacting the channel forming region, an insulating film in contact with the semiconductor layer;
a gate electrode having a tapered portion in contact with the insulating film;
a wiring comprising a first layer, a second layer over the first layer and a third layer over the second layer, and in contact with the semiconductor layer;
a pixel electrode on the third layer;
wherein a portion of the second impurity region is overlapped with the gate electrode, and wherein a thickness of a portion of the insulating film overlapped with the gate electrode is thicker than a thickness of the other portion of the insulating film. - View Dependent Claims (8, 14, 19, 22)
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3. A semiconductor device comprising:
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a semiconductor layer over a substrate, the semiconductor layer comprising;
a channel forming region;
a first impurity region forming a source region or a drain region containing a single conductivity type impurity element; and
a second impurity region forming an LDD region contacting the channel forming region, first and second gate electrodes, each having a tapered portion, in contact with the insulating film, wherein a thickness of a portion of the insulating film overlapped with the first or second gate electrode is thicker than a thickness of the other portion of the insulating film. - View Dependent Claims (9, 15)
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4. A semiconductor device comprising:
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a semiconductor layer over a substrate, the semiconductor layer comprising;
a channel forming region;
a first impurity region forming a source region or a drain region containing a single conductivity type impurity element; and
a second impurity region forming an LDD region contacting the channel forming region, first and second gate electrodes, each having a tapered portion, in contact with the insulating film;
wherein the second impurity region is provided between the first and second gate electrodes, and wherein a thickness of a portion of the insulating film overlapped with the first or second gate electrode is thicker than a thickness of the other portion of the insulating film. - View Dependent Claims (10, 16)
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5. A semiconductor device comprising:
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a semiconductor layer over a substrate, the semiconductor layer comprising;
a channel forming region;
a first impurity region forming a source region or a drain region containing a single conductivity type impurity element; and
a second impurity region forming an LDD region contacting the channel forming region, first and second gate electrodes, each having a tapered portion, in contact with the insulating film, a wiring comprising a first layer, a second layer over the first layer and a third layer over the second layer, and in contact with the semiconductor layer; and
a pixel electrode on the third layer, wherein a thickness of a portion of the insulating film overlapped with the first or second gate electrode is thicker than a thickness of the other portion of the insulating film. - View Dependent Claims (11, 17, 20, 23)
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6. A semiconductor device comprising:
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a semiconductor layer over a substrate, the semiconductor layer comprising;
a channel forming region;
a first impurity region forming a source region or a drain region containing a single conductivity type impurity element; and
a second impurity region forming an LDD region contacting the channel forming region, first and second gate electrodes, each having a tapered portion, in contact with the insulating film;
a wiring comprising a first layer, a second layer over the first layer and a third layer over the second layer, and in contact with the semiconductor layer; and
a pixel electrode on the third layer, wherein the second impurity region is provided between the first and second gate electrodes, and wherein a thickness of a portion of the insulating film overlapped with the first or second gate electrode is thicker than a thickness of the other portion of the insulating film. - View Dependent Claims (12, 18, 21, 24)
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Specification