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Printed circuit board and manufacturing method thereof

  • US 20060113669A1
  • Filed: 11/16/2005
  • Published: 06/01/2006
  • Est. Priority Date: 11/26/2004
  • Status: Active Grant
First Claim
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1. A printed circuit board, comprising:

  • an insulating layer; and

    a conductive layer provided on one or both surfaces of said insulating layer and having a prescribed pattern, wherein the region excluding said conductive layer on the surface of said insulating layer having said conductive layer thereon is roughened.

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