Printed circuit board and manufacturing method thereof
First Claim
1. A printed circuit board, comprising:
- an insulating layer; and
a conductive layer provided on one or both surfaces of said insulating layer and having a prescribed pattern, wherein the region excluding said conductive layer on the surface of said insulating layer having said conductive layer thereon is roughened.
2 Assignments
0 Petitions
Accused Products
Abstract
A multi-layer structure including a base insulating layer and a thin metal film layer (seed layer) is prepared. A plating resist layer is formed to have a prescribed pattern on the upper surface of the thin metal film layer. A metal plating layer is formed on the thin metal film layer exposed by electroplating. Then, the plating resist layer is removed, and the thin metal film layer in the region having the plating resist layer is removed. In this way, a conductive pattern including the thin metal film layer and the metal plating layer is formed. The upper surface of the base insulating layer in the region without the conductive pattern is subjected to roughening treatment. A cover insulating layer is formed on the upper surfaces of the base insulating layer and the conductive pattern. In this way, a printed circuit board is completed.
23 Citations
8 Claims
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1. A printed circuit board, comprising:
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an insulating layer; and
a conductive layer provided on one or both surfaces of said insulating layer and having a prescribed pattern, wherein the region excluding said conductive layer on the surface of said insulating layer having said conductive layer thereon is roughened. - View Dependent Claims (2, 3, 4, 5)
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6. A method of manufacturing a printed circuit board, comprising the steps of:
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forming a conductive layer having a prescribed pattern on one or both surfaces of an insulating layer; and
roughening the region excluding said conductive layer on the surface of said insulating layer having said conductive layer thereon. - View Dependent Claims (7, 8)
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Specification