Compression and cold weld sealing methods and devices
First Claim
1. A method of hermetically sealing at least two substrates together, the method comprising:
- providing a first substrate having at least one first joint structure which comprises a first joining surface, which surface comprises a first metal;
providing a second substrate having at least one second joint structure which comprises a second joining surface, which surface comprises a second metal; and
compressing together the at least one first joint structure and the at least one second joint structure to locally deform and shear the joining surfaces at one or more interfaces in an amount effective to form a metal-to-metal bond between the first metal and second metal of the joining surfaces.
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Accused Products
Abstract
Compression cold welding methods, joint structures, and hermetically sealed containment devices are provided. The method includes providing a first substrate having at least one first joint structure which comprises a first joining surface, which surface comprises a first metal; providing a second substrate having at least one second joint structure which comprises a second joining surface, which surface comprises a second metal; and compressing together the at least one first joint structure and the at least one second joint structure to locally deform and shear the joining surfaces at one or more interfaces in an amount effective to form a metal-to-metal bond between the first metal and second metal of the joining surfaces. Overlaps at the joining surfaces are effective to displace surface contaminants and facilitate intimate contact between the joining surfaces without heat input. Hermetically sealed devices can contain drug formulations, biosensors, or MEMS devices.
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Citations
50 Claims
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1. A method of hermetically sealing at least two substrates together, the method comprising:
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providing a first substrate having at least one first joint structure which comprises a first joining surface, which surface comprises a first metal;
providing a second substrate having at least one second joint structure which comprises a second joining surface, which surface comprises a second metal; and
compressing together the at least one first joint structure and the at least one second joint structure to locally deform and shear the joining surfaces at one or more interfaces in an amount effective to form a metal-to-metal bond between the first metal and second metal of the joining surfaces. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
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30. A method of hermetically sealing at least two substrates together, the method comprising:
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providing a first substrate having at least one first joint structure which comprises a first joining surface, which surface comprises a first compliant polymer, which has been metallized with a thin layer of a metal;
providing a second substrate having at least one second joint structure which comprises a second joining surface, which surface comprises a second compliant polymer, which has been metallized with a thin layer of a metal;
compressing together the at least one first joint structure and the at least one second joint structure to locally deform the joining surfaces at one or more interfaces in an amount effective to form a bond between the first and second the joining surfaces.
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32. A containment device comprising:
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a first substrate having a front side and a back side, and including at least one first joint structure which comprises a first joining surface, which surface is a first metal;
a second substrate having at least one second joint structure which comprises a second joining surface, which surface is a second metal;
a hermetic seal formed between and joining the first substrate and the second substrate, wherein the hermetic seal is made by compression cold welding the first joining surface to the second joining surface at one or more interfaces; and
at least one containment space being defined between the first substrate and the second substrate within the hermetic seal such that the containment space is hermetically sealed an exterior environment. - View Dependent Claims (31, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47)
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48. An implantable medical device for the controlled exposure or release of contents located in hermetically sealed reservoirs comprising:
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a first substrate;
a plurality of discrete reservoirs disposed in the first substrate, the reservoirs having first openings and second openings distal the first openings;
reservoir contents located inside the reservoirs, wherein the reservoir contents comprises a drug or a biosensor;
a plurality of discrete reservoir caps closing the first openings;
means for selectively disintegrating the reservoir caps; and
a second substrate and a hermetic joint sealing and closing the second openings, wherein the hermetic joint is made by compression cold-welding. - View Dependent Claims (49)
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50. A method of forming an electrical via connection comprising:
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providing a first non-conductive substrate having an aperture therethrough, wherein the interior surface of said first substrate defining said aperture comprises a layer of a first electrically conductive material;
providing a second non-conductive substrate having a projecting member extending from a surface of said second substrate, wherein said member is formed of or coated with a second electrically conductive material; and
compressing the projecting member of said second substrate into the aperture of said first substrate, to locally deform and shear the first and/or second electrically conductive layers, in an amount effective to form a bond and electrical connection between the first and second electrically conductive layers.
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Specification