Non-contacting sensor multichip module with integral heat-sinks

• US 20060116846A1
• Filed: 10/06/2005
• Published: 06/01/2006
• Est. Priority Date: 10/04/2001
• Status: Active Grant

• Current Assignee: Bourns Incorporated
• Original Assignee: SSI Technologies, Inc. (Amphenol Corporation)
• Inventors: Tola, Jeffry
• Granted Patent: US 7,300,203 B2
• Time in Patent Office: Days
• US Class Current: 702/132
• CPC Class Codes: G01K 1/14 Supports; Fastening devices; Arrangements for mounting thermometers in particular locations

Abstract

A sensor assembly having a housing including a first portion and a second portion. One of the portions of the housing includes a plurality of walls. The walls at least partially define a chamber. The assembly also includes a hinge connected to the first portion and to the second portion. The second portion is pivotable about the hinge from an open position with respect to the first portion to a closed position with respect to the first portion. The assembly also includes a sensor positioned within the chamber and substantially encircled by the plurality of walls. The sensor is partially enclosed by the first portion and second portion when the second portion is in the closed position.

Claims

1-57. -57. (canceled)

58. A sensor assembly comprising:

a housing comprising a plurality of walls substantially entirely enclosing an internal chamber, the plurality of walls including a first wall comprising thermally-conductive material defining a heat sink, the first wall having an internal surface and an external surface;

a sensor element located within the chamber; and

an integrated circuit coupled to the sensor element and the first wall of the housing, wherein the integrated circuit is in heat-conductive communication with the internal surface of the first wall,

wherein the material of the first wall is responsive to heat generated by the integrated circuit by conducting heat away from the integrated circuit and toward the external surface of the first wall to limit heat buildup proximate the integrated circuit.

59. The sensor assembly as claimed in claim 58, wherein the first wall comprises metal.

60. The sensor assembly as claimed in claim 58, wherein:

the heat sink is a first heat sink;

the plurality of walls further comprises a second wall opposite the first wall and between which the integrated circuit is located;

the second wall comprises thermally-conductive material defining a second heat sink.

61. The sensor assembly as claimed in claim 58, wherein the plurality of walls further comprises a second wall opposite the first wall, the sensor assembly further comprising an aperture defined in one of the first and second walls and adapted to receive an electrical connector for programming the integrated circuit.

62. The sensor assembly as claimed in claim 58, wherein the first wall is substantially planar.

63. The sensor assembly as claimed in claim 58, wherein the integrated circuit is mounted to the first wall.

64. The sensor assembly as claimed in claim 58, wherein the first wall is shaped to include a fin extending outwardly from the housing.

65. The sensor assembly as claimed in claim 58, wherein the plurality of walls includes a plurality of integrally-formed plastic walls molded to the first wall.

66. The sensor assembly as claimed in claim 65, wherein the plurality of integrally-formed plastic walls partially defines the internal chamber.

67. The sensor assembly as claimed in claim 60, wherein the plurality of walls includes a plurality of integrally-formed plastic walls located between the first and second walls and molded to at least one of the first and second walls.

68. The sensor assembly as claimed in claim 67, wherein the plurality of integrally-formed plastic walls partially defines the internal chamber.

69. A sensor assembly, comprising:

a sensor element;

a chamber defined by a plurality of walls enclosing the sensor element, the plurality of walls including a first wall of thermally conductive material defining a heat sink and having an internal surface substantially facing the chamber and an external surface substantially facing away from the chamber;

an integrated circuit coupled to the sensor element, the integrated circuit further coupled to the internal surface of the first wall to conduct heat from the integrated circuit, away from the sensor element, through the internal surface of the first wall, and to the external surface of the first wall.

70. The sensor assembly as claimed in claim 69, wherein the first wall comprises metal.

71. The sensor assembly as claimed in claim 69, wherein:

the heat sink is a first heat sink;

the plurality of walls further comprises a second wall opposite the first wall and between which the integrated circuit is located;

the second wall comprises thermally-conductive material defining a second heat sink.

72. The sensor assembly as claimed in claim 69, wherein the plurality of walls further comprises a second wall opposite the first wall, the sensor assembly further comprising an aperture defined in one of the first and second walls and adapted to receive an electrical connector for programming the integrated circuit.

73. The sensor assembly as claimed in claim 69, wherein the first wall is substantially planar.

74. The sensor assembly as claimed in claim 69, wherein the integrated circuit is mounted to the first wall.

75. The sensor assembly as claimed in claim 69, wherein the first wall is shaped to include a fin extending outwardly with respect to the chamber.

76. The sensor assembly as claimed in claim 69, wherein the plurality of walls includes a plurality of integrally-formed plastic walls molded to the first wall.

77. The sensor assembly as claimed in claim 76, wherein the plurality of integrally-formed plastic walls partially defines the chamber.

78. The sensor assembly as claimed in claim 71, wherein the plurality of walls includes a plurality of integrally-formed plastic walls located between the first and second walls and molded to at least one of the first and second walls.

79. The sensor assembly as claimed in claim 78, wherein the plurality of integrally-formed plastic walls partially defines the chamber.

80. A sensor assembly, comprising:

first and second stacked housings, each of the first and second stacked housings having a plurality of walls comprising;

a first wall;

a second wall opposite the first wall; and

a sensor element located between the first and second walls and enclosed within the plurality of walls; and

an integrated circuit located between the first and second walls of the first housing, mounted to the first wall of the first housing, coupled to the sensor element of the first housing, and enclosed within the plurality of walls of the first housing.

wherein the first wall of the first housing comprises heat-conductive material defining a first heat sink; and

the first wall of the first housing is adjacent the second wall of the second housing.

81. The sensor assembly as claimed in claim 80, wherein the first wall of the first housing comprises metal.

82. The sensor assembly as claimed in claim 80, wherein the first and second stacked housings have substantially the same structure.

83. The sensor assembly as claimed in claim 80, wherein the first and second housings are connected by at least one electrical connector extending through an aperture in at least one of the first wall of the first housing and the second wall of the second housing.

84. The sensor assembly as claimed in claim 80, wherein the first wall of each housing is substantially planar.

85. The sensor assembly as claimed in claim 80, wherein the first wall of the first housing is shaped to include a fin extending outwardly from the first housing.