×

Non-contacting sensor multichip module with integral heat-sinks

  • US 20060116846A1
  • Filed: 10/06/2005
  • Published: 06/01/2006
  • Est. Priority Date: 10/04/2001
  • Status: Active Grant
First Claim
Patent Images

1-57. -57. (canceled)

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×