Suction nozzle, and component mounting method and apparatus using the same

• US 20060119118A1
• Filed: 01/19/2006
• Published: 06/08/2006
• Est. Priority Date: 10/29/1999
• Status: Abandoned Application

• Current Assignee: Kanji Hata, Kazuaki Kosaka, Masahiro Morimoto, Shiro Oji
• Original Assignee: Kanji Hata, Kazuaki Kosaka, Masahiro Morimoto, Shiro Oji
• Inventors: Hata, Kanji, Kosaka, Kazuaki, Oji, Shiro, Morimoto, Masahiro
• Application Number:
  US11/335,054
• Publication Number:
  US 20060119118A1
• Time in Patent Office: Days
• US Class Current: 294/64.100
• CPC Class Codes: H05K 13/0409 Sucking devices
• CPC Class Codes: Y10T 29/49131 by utilizing optical sighting device
• CPC Class Codes: Y10T 29/53178 Chip component
• CPC Class Codes: Y10T 29/53191 Means to apply vacuum directly to position or hold work part

Abstract

In a suction nozzle (20), a sucking surface (60) is made larger in area than a to-be-sucked surface of a component (55) and is configured arbitrarily so long as a width (G1) between mutually-opposed sides parallel to a longer side (110) of the component to be sucked is smaller than a width (G2) in a direction parallel to a shorter side (111) of the component to be sucked. The suction nozzle sucks a component at its sucking surface, with a longitudinal axis (O) of the sucking surface (60) kept inclined with respect to a direction (J) in which the component is supplied.

Claims

1-12. -12. (canceled)

13. A component mounting method comprising:

successively feeding components (55) from a component supply portion (2) to a predetermined position, the components being arranged in juxtaposition in a minor-axis direction thereof; and

sucking the components at the predetermined position by a suction nozzle (20) designed so that a sucking surface (60) for sucking the component by abutting on a to-be-sucked surface of the component is made larger in area than the to-be-sucked surface and is configured arbitrarily so long as a width (G1) in a direction parallel to a longer side (110) of the component is smaller than a width (G2) in a direction parallel to a shorter side (111) of the component; and

mounting the sucked components on a substrate.

14. (canceled)

15. A component mounting apparatus comprising:

a component supply portion (2) for successively feeding components arranged in juxtaposition in a minor-axis direction thereof;

a suction nozzle (20) which is designed so that a sucking surface (60) for sucking the component by abutting on a to-be-sucked surface of the component is made larger in area than the to-be-sucked surface, and is configured arbitrarily so long as a width (G1) in a direction parallel to a longer side (110) of the component is smaller than a width (G2) in a direction parallel to a shorter side (111) of the component; and

component mounting means for sucking the component at the supply position by way of the suction nozzle and for mounting the sucked component on a substrate by moving the suction nozzle.

16. (canceled)