Metallic structures incorporating bioactive materials and methods for creating the same

• US 20060121180A1
• Filed: 01/20/2006
• Published: 06/08/2006
• Est. Priority Date: 09/19/2001
• Status: Abandoned Application

• Current Assignee: Medlogics Device Corporation
• Original Assignee: Medlogics Device Corporation
• Inventors: Gertner, Michael E., Schlesinger, Mordechay
• Application Number:
  US11/336,047
• Publication Number:
  US 20060121180A1
• Time in Patent Office: Days
• US Class Current: 427/2.100
• CPC Class Codes: A61F 2/82 Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents stent-grafts for tubular structures of the body other than blood vessels A61F2/04; stent-grafts for blood vessels A61F2/07; instruments specially adapted for placement or removal of stents or stent-grafts A61F2/95; for closing wounds, or holding wounds closed A61B17/04 - A61B17/115; dilators A61M29/00
• CPC Class Codes: A61F 2250/0067 Means for introducing or releasing pharmaceutical products into the body
• CPC Class Codes: A61L 2300/416 Anti-neoplastic or anti-proliferative or anti-restenosis or anti-angiogenic agents, e.g. paclitaxel, sirolimus
• CPC Class Codes: A61L 2300/434 of enzymes
• CPC Class Codes: A61L 2300/606 Coatings
• CPC Class Codes: A61L 27/30 Inorganic materials
• CPC Class Codes: A61L 27/42 having an inorganic matrix
• CPC Class Codes: A61L 27/54 Biologically active materials, e.g. therapeutic substances A61L27/227 takes precedence
• CPC Class Codes: A61L 31/082 Inorganic materials
• CPC Class Codes: A61L 31/088 Other specific inorganic materials not covered by A61L31/084 or A61L31/086
• CPC Class Codes: A61L 31/121 having an inorganic matrix
• CPC Class Codes: A61L 31/146 Porous materials, e.g. foams or sponges
• CPC Class Codes: A61L 31/16 Biologically active materials, e.g. therapeutic substances A61L31/047 takes precedence
• CPC Class Codes: A61P 11/06 Antiasthmatics
• CPC Class Codes: A61P 19/10 for osteoporosis
• CPC Class Codes: A61P 25/08 Antiepileptics; Anticonvulsants
• CPC Class Codes: A61P 25/16 Anti-Parkinson drugs
• CPC Class Codes: A61P 25/18 Antipsychotics, i.e. neuroleptics; Drugs for mania or schizophrenia
• CPC Class Codes: A61P 25/24 Antidepressants
• CPC Class Codes: A61P 29/00 Non-central analgesic, antipyretic or antiinflammatory agents, e.g. antirheumatic agents; Non-steroidal antiinflammatory drugs [NSAID]
• CPC Class Codes: A61P 3/10 : for hyperglycaemia, e.g. antidiabetics
• CPC Class Codes: A61P 31/00 : Antiinfectives, i.e. antibiotics, antiseptics, chemotherapeutics
• CPC Class Codes: A61P 35/00 : Antineoplastic agents
• CPC Class Codes: A61P 43/00 : Drugs for specific purposes, not provided for in groups A61P1/00-A61P41/00
• CPC Class Codes: A61P 7/02 : Antithrombotic agents; Anticoagulants; Platelet aggregation inhibitors
• CPC Class Codes: A61P 9/00 : Drugs for disorders of the cardiovascular system
• CPC Class Codes: B82Y 30/00 : Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: C23C 18/165 : Multilayered product layered product B32B
• CPC Class Codes: C23C 18/1657 : Electroless forming, i.e. substrate removed or destroyed at the end of the process
• CPC Class Codes: C23C 18/1662 : Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
• CPC Class Codes: C23C 18/1831 : Use of metal, e.g. activation, sensitisation with noble metals
• CPC Class Codes: C25D 15/00 : Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
• CPC Class Codes: C25D 5/022 : using masking means
• CPC Class Codes: C25D 5/48 : After-treatment of electroplated surfaces
• CPC Class Codes: C25D 5/617 : Crystalline layers
• CPC Class Codes: C25D 5/619 : Amorphous layers
• CPC Class Codes: C25D 5/623 : Porosity of the layers

Abstract

One embodiment of the invention is directed to a method comprising providing an electrochemical solution comprising metal ions and a bioactive material such as bioactive molecules, and then contacting the electrochemical solution and a substrate. A bioactive composite structure is formed on the substrate using an electrochemical process, where the bioactive composite structure includes a metal matrix and the bioactive material within the metal matrix.

Claims

1. A method for forming a bioactive agent-eluting implantable medical device comprising:

forming a metallic matrix wherein said metallic matrix further comprises at least one bioactive agent, and

wherein said metallic matrix is formed without using a sintering processes.

2. The method according to claim 1 wherein said at least one bioactive agent is co-deposited with said metallic matrix.

3. The method according to claim 1 wherein said metallic matrix is electro-formed on a sacrificial substrate.

4. The method according to claim 3 wherein said at least one bioactive agent is co-deposited with said metallic matrix on a sacrificial substrate and then removing said sacrificial substrate.

5. The method according to claim 1 wherein said metal matrix is formed as a coating on at least a portion of at least one surface of said implantable medical device and said at least one bioactive agent is loaded into said coating after said coating is formed.

6. The method according to claim 5 wherein said at least one bioactive agent is applied to at least a portion of at least one surface of said implantable medical device before said coating is formed.

7. The method according to claim 5 wherein said coating and said at least one bioactive agent are co-deposited on said at least a portion of at least one surface of said implantable medical device.

8. The method according to claim 1 wherein said metal matrix comprises forming at least one first metal and at least one second matrix over said at least one first metal matrix.

9. The method according to claim 8 wherein said at least one second metal matrix is formed using an electroplating process.

10. The method according to claim 8 wherein said at least one second metal matrix comprises a metal or metal alloy different than said at least one first metal matrix.