Method to facilitate the printing of electronic components

• US 20060121182A1
• Filed: 12/03/2004
• Published: 06/08/2006
• Est. Priority Date: 12/03/2004
• Status: Abandoned Application

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Zhang, Jie, Kalyanasundaram, Krishna, Gamota, Daniel R., Brazis, Paul W.
• Application Number:
  US11/004,080
• Publication Number:
  US 20060121182A1
• Time in Patent Office: Days
• US Class Current: 427/58
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 2203/163 Monitoring a manufacturing process
• CPC Class Codes: H05K 3/0005 for designing circuits by computer
• CPC Class Codes: H05K 3/12 using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
• CPC Class Codes: H05K 3/1216 by screen printing or stencil printing
• CPC Class Codes: H05K 3/1241 by ink-jet printing or drawing by dispensing

Abstract

Data regarding printing instructions for an active electronic component are provided (11). These printing instructions will typically comprise instructions regarding the location, geometry, size, orientation, and functional inks used for various component layers as correspond to the electronic component, and are without reference to a specific printing system. This data is then modified (12) as a function of one or more operational proclivities of a particular high throughput additive printing system to provide modified instructions that, when employed to effect the printing of the active electronic component, will improve the resultant yield as compared to the unmodified data.

Claims

1. A method to facilitate provision of an active substantially fully printed electronic component on a printing substrate using a particular high throughput additive printing system, the method comprising:

providing data comprising instructions regarding location, geometry, size, orientation, and functional ink content of various active electronic component layers to be printed on the printing substrate without reference to a specific printing system;

modifying the data as a function, at least in part, of operational proclivities of the particular high throughput additive printing system to provide modified instructions regarding at least one of location, geometry, size, orientation, and functional ink content to thereby improve yield of the active electronic component.

2. The method of claim 1 wherein providing data comprising instructions regarding location, geometry, size, orientation, and functional ink content of various active electronic component layers further comprises providing instructions regarding location, geometry, size, orientation, and functional ink content of various active electronic component layers as comprise a plurality of active electronic components.

3. The method of claim 2 wherein providing data comprising instructions regarding location, geometry, size, orientation, and functional ink content of various active electronic component layers as comprise a plurality of active electronic components further comprises providing data comprising instructions regarding location, geometry, size, orientation, and functional ink content of various active electronic component layers as comprise a plurality of active electronic components that, as a group, comprise an electronic circuit.

4. The method of claim 1 wherein the operational proclivities comprise at least one of:

ink curing latency variations;

print resolution variations;

print interface accuracy variations;

print registration variations;

ink deposition density variations.

ink fluid property variation

ink functional property variation

5. The method of claim 1 wherein modifying the data further comprises adding additional instructions to the data.

6. The method of claim 5 wherein adding additional instructions to the data further comprises adding instructions regarding inclusion of at least one test strip to be printed on the printing substrate.

7. The method of claim 1 wherein modifying the data further comprises modifying an instruction comprising at least one of a printing and an electronic design compatible format.

8. The method of claim 7 wherein modifying an instruction comprising at least one of a printing and an electronic design compatible format further comprises modifying an instruction as regards at least one of:

PostScript data;

portable document format data;

raster image process data;

Gerber data;

tagged image file format data;

bitmap data;

raster image data.

9. The method of claim 1 wherein modifying the data further comprises changing an instruction regarding a specific location to print a specific one of the active electronic component layers on the printing substrate.

10. The method of claim 1 wherein modifying the data further comprises changing an instruction regarding a specific size to print a specific one of the active electronic component layers on the printing substrate.

11. The method of claim 1 wherein modifying the data further comprises changing an instruction regarding a specific geometry to use when printing a specific one of the active electronic component layers on the printing substrate.

12. The method of claim 1 wherein modifying the data further comprises adding instructions regarding inclusion of specified non-electrically functional graphic elements on the printing substrate.

13. The method of claim 12 wherein the specified non-electrically functional graphic elements further comprise alphanumeric graphic elements.

14. The method of claim 1 and further comprising:

using the modified instructions with the particular high throughput additive printing system to print the active electronic component on the printing substrate.

15. The method of claim 14 and further comprising:

conducting a quality test as corresponds to the active electronic component using at least one printed element that corresponds to a modification of the data as a function, at least in part, of the operational proclivities of the particular high throughput additive printing system.

16. The method of claim 14 further comprising:

selling the active electronic component on the printing substrate.

17. The method of claim 1 wherein the printing substrate comprise a flexible printing substrate.

18. The method of claim 17 wherein the flexible printing substrate comprises one of:

a pulp-based substrate;

a polyester substrate;

a polycarbonate substrate.

19. The method of claim 1 wherein the particular high throughput additive printing system comprises one of:

a flexo printing system;

a gravure printing system;

a screen printing system;

a lithography printing system;

a micro-contact printing system;

a nano-imprint lithography printing system;

a liquid coating printing system;

a microdispensing printing system;

a jetting printing system;

a spray coating printing system.

20. The method of claim 19 wherein the particular high throughput additive printing system comprises at least two of:

a flexo printing system;

a gravure printing system;

a screen printing system;

an offset printing system.