Microfabricated devices for wireless data and power transfer

• US 20060121639A1
• Filed: 11/10/2005
• Published: 06/08/2006
• Est. Priority Date: 11/10/2004
• Status: Active Grant

• Current Assignee: California Institute of Technology
• Original Assignee: California Institute of Technology
• Inventors: Tai, Yu-Chong, Weiland, James D., Li, Wen, Humayun, Mark, Rodger, Damien C.
• Granted Patent: US 7,684,868 B2
• Time in Patent Office: Days
• US Class Current: 438/49
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 2007/068 using printed circuit coils
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H01F 5/06 Insulation of windings
• CPC Class Codes: H01F 7/06 Electromagnets; Actuators including electromagnets electric coils H01F5/00; devices for holding workpieces using electric force B23Q3/15; load-engaging elements for lifting articles electromagnetically B66C1/06; electromagnetic couplings F16D27/00; magnetic brakes F16D63/002; electromagnetically operated valves F16K11/24, F16K31/00; analysing materials by magnetic means G01N27/72, G01N27/80; electromagnets for winding mechanical clocks G04C1/02; electromagnetic relays H01H51/00; windings for salient poles of dynamo-electric machines H02K3/18; electromagnets for telegraphic communication H04L; for arc lamps H05B31/28
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68345 used as a support during the manufacture of self supporting substrates
• CPC Class Codes: H04B 5/00 Near-field transmission systems, e.g. inductive or capacitive transmission systems
• CPC Class Codes: H04B 5/266 One coil at each side, e.g. with primary and secondary coils
• CPC Class Codes: H04B 5/72 for local intradevice communication
• CPC Class Codes: H04B 5/79 for data transfer in combination with power transfer

Abstract

This invention relates to the design and fabrication of micro electromechanical systems (MEMS) for applications in such varied fields as the biomedical, micro-fluidics and chemical analysis fields.

Claims

1. A device comprising:

a) a polymeric material comprising the following properties;

i) a dielectric constant of about 2 to 4 at 60 Hz;

ii) an elongation break at about 10% to 300%;

iii) a water absorption rate of about 0.01% to 0.10% per 24 hrs;

b) the polymeric material of a) optionally including the following properties;

iv) a tensile strength of about 30 MPa to 80 MPa;

v) a gas permeability coefficient of about 0.50 to 2000 cm³-mil/100 in 24 hr at 1 atm at 23°

C.; and

c) a conductive material that;

i) generates an electromotive force when contacted with a modulated magnetic field;

or

ii) generates a magnetic field when contacted with an electromotive force,

wherein the conductive material is encapsulated in the polymeric material.

2. The device of claim 1, wherein the device is suitable for association with a biological system.

3. The device of claim 1, wherein the gas is oxygen, nitrogen, carbon dioxide, hydrogen sulfide, sulphur dioxide or chlorine.

4. The device of claim 1, wherein the polymeric material has a moisture vapor transmission rate of less than 2.0 g-mil/100 in 24 hr at 90% relative humidity and 37°

C.

5. The device of claim 1, wherein the gas permeability coefficient for oxygen is less than 40 cm³-mil/100 in 24 hr at 1 atm and at 23°

C.

6. The device of claim 1, wherein the device has a thickness from about 0.05 micron to about 50 microns.

7. The device of claim 6, wherein the device has a thickness from about 0.1 micron to about 10 microns.

8. The device of claim 1, wherein the polymeric material comprises at least one of a parylene, an acrylic, a siloxane, xylene, an alkene, styrene, an organosilane, an organosilazane, an organosilicone, a PDMS (poly-di-methyl-siloxane) or a polyimide.

9. The device of claim 8, wherein the parylene is parylene N, parylene C, parylene D, parylene A, parylene AM, parylene F, parylene HT, or combinations thereof.

10. The device of claim 1, wherein the conductive material receives power and/or data from an external source by inductively coupled radio-frequency (RF) telemetry.

11. The device of claim 1, wherein the conductive material comprises at least one of a platinum, platinum grey, platinum black, gold, iridium, titanium, chromium, copper, aluminum, iridium oxide, chromium oxide, silver oxide, indium zinc oxide, indium tin oxide, silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, aluminum oxynitride, zinc oxide, indium oxide, tin oxide, cadmium tin oxide, cadmium oxide, magnesium oxide, and combinations thereof.

12. The device of claim 1 comprising multiple layers of the polymeric material.

13. The device of claim 1 comprising multiple layers of the conductive material.

14. The device of claim 1, wherein the device is a coil.

15. The device of claim 14, wherein the coil is an intraocular or extraocular coil.

16. The device of claim 14, wherein the device is contoured to conform to a region of implantation in a biological environment.

18. A system comprising:

a) a first element comprising a device of claim 1 or claim 17;

b) a second element inductively linked to the first element, the second element comprising;

i) a mechanism for generating a magnetic field that contacts the first element; and

ii) a mechanism for generating radio frequency (RF) telemetry that contacts the first element;

c) an electrode having a first end operably linked to the first element and a second end operably linked to an array.

19. The system of claim 18, wherein the first element is implanted in a biological system.

20. The system of claim 19, wherein the biological system is an eye.

21. The system of claim 18, wherein the device is a coil that receives data and power from the second element.

22. The system of claim 18, wherein the coil is an intraocular or extraocular coil.

23. The system of claim 18, wherein the first element comprises an integrated circuit.

24. The system of claim 18, wherein the second element is external to the biological system.

25. The system of claim 18, wherein the second element is a transmitter comprising a coil.

26. The system of claim 18, wherein the array is a retinal array.

27. The system of claim 18, wherein the first element optionally includes an amplifier.

28. The system of claim 26, wherein the retinal array is associated with nerve tissue.

29. The system of claim 28, wherein the nerve tissue comprises retinal tissue.

17. A device comprising a plurality of layers of successively deposited material, wherein the deposition of each layer of material comprises:

a) deposition of at least a first polymeric material that provides chemical resistance and provides a barrier to moisture and oxygen;

b) deposition of at least a second conductive material that supports wireless data and power transmission, wherein the conductive material is completely or partially encapsulated in the polymeric material; and

c) selectively patterning the conductive material, and optionally selectively patterning the polymeric material;

wherein a structure resulting from the deposition and patterning provides at least one structure that can function as a radio-frequency coil.

30. A method for manufacturing a multilayer microdevice, the method comprising:

a) forming at least one layer of polymeric material on a solid substrate that may include one or more previously deposited layers of one or more materials, wherein the polymeric material provides chemical resistance and provides a barrier to moisture and oxygen;

b) forming at least one layer of conductive material on a solid substrate that may include one or more previously deposited layers of one or more materials, wherein the conductive material supports wireless data and power transmission;

c) selectively patterning the conductive material, and optionally selectively patterning the polymeric material;

d) repeating the operation of a), b) and c) one or more times to build up a three-dimensional structure from a plurality layers; and

e) removing the solid substrate,

wherein the conductive material is completely or partially encapsulated in the polymeric material and wherein the multilayer microdevice is mechanically flexible.

31. The method of claim 30, wherein the polymeric material comprises the following properties:

a) a dielectric constant of about 2 to 4 at 60 Hz;

b) an elongation break at about 10% to 300%; and

c) a water absorption rate of about 0.01% to 0.10% per 24 hrs.

32. The method of claim 30, wherein the polymeric material comprises the following properties:

a) a tensile strength of about 30 MPa to 80 MPa; and

b) a gas permeability coefficient of about 0.50 to 2000 cm³-mil/100 in 24 hr at 1 atm at 23°

C.

33. The method of claim 30, wherein the conductive material generates an electromotive force when contacted with a modulated magnetic field.

34. The method of claim 30, wherein the conductive material generates a magnetic field when contacted with an electromotive force.

35. The method of claim 30, wherein the solid substrate is comprised of silicon, glass, steel, quartz, soda lime or Teflon, or derivatives thereof.

36. The method of claim 35, wherein the silicon is low expansion titanium silicate.

37. The method of claim 30, wherein the polymeric material comprises at least one of a parylene, an acrylic, a siloxane, xylene, an alkene, styrene, an organosilane, an organosilazane, an organosilicone, a PDMS (poly-di-methyl-siloxane) or a polyimide.

38. The method of claim 37, wherein the parylene is parylene N, parylene C, parylene D, parylene A, parylene AM, parylene F, parylene HT, or combinations thereof.

39. The method of claim 30, wherein the polymeric material layer is formed by one of plasma deposition, physical vapor deposition, polymer monolithic layer deposition, or spin coating.

40. The method of claim 30, wherein the conductive material comprises at least one of a conductive polymer, a metal, a silicon derivative, or combinations thereof.

41. The method of claim 40, wherein the conductive material comprises at least one of a platinum, platinum grey, platinum black, gold, iridium, titanium, chromium, copper, aluminum, iridium oxide, chromium oxide, silver oxide, indium zinc oxide, indium tin oxide, silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, aluminum oxynitride, zinc oxide, indium oxide, tin oxide, cadmium tin oxide, cadmium oxide, magnesium oxide, and combinations thereof.

42. The method of claim 30, wherein the conductive material is formed by one of plasma deposition, physical vapor deposition, sputtering, or electroplating.

43. The method of claim 42, wherein the plasma deposition is plasma enhanced chemical vapor deposition, expanding thermal plasma, microwave plasma, inductively coupled plasma, or high density plasma chemical vapor deposition.

44. The method of claim 30, wherein the polymeric material is patterned by a plasma liquid reagent, a gaseous reagent, laser ablation, or blade cutting.

45. The method of claim 30, wherein the conductive material is patterned by a liquid reagent or a gaseous reagent.

46. The method of claim 44 or claim 45, wherein the gaseous reagent is plasma.

47. The method of claim 30, further comprising heat treating the multilayer microdevice to conform to a region of implantation in a biological environment.

48. The method of claim 30, wherein the method comprises metal-etch fabrication.

49. The method of claim 30, wherein the method comprises lift-off fabrication.

51. The method of claim 50, further comprising, prior to removal of the solid substrate:

a) depositing a third resist layer on the second layer of polymeric material, patterning the resist, and transferring the pattern to the second layer of polymeric material;

b) depositing a second layer of conductive material on the second layer of polymeric material, wherein the conductive material generates an electromotive force when contacted with a modulated magnetic field, or generates;

c) depositing a fourth resist layer on the conductive material, wherein the fourth resist layer is patterned;

d) transferring the pattern to the second layer of conductive material, wherein a patterned conductive material is formed;

e) depositing a third layer of polymeric material comprising the properties set forth in claim 49, part c) on the patterned conductive material; and

f) removing the solid substrate.

55. A device manufactured by the method of claim 30 or claim 50.

50. A method for manufacturing a microdevice, the method comprising:

a) providing a solid substrate;

b) optionally depositing a first resist layer on the substrate;

c) depositing a first layer of polymeric material on the solid substrate or the first resist layer, the polymeric comprising the following properties;

i) a dielectric constant of about 2 to 4 at 60 Hz;

ii) an elongation break at about 10% to 300%;

iii) a water absorption rate of about 0.01% to 0.10% per 24 hrs;

iv) a tensile strength of about 30 MPa to 80 MPa;

v) a gas permeability coefficient of about 0.50 to 2000 cm³-mil/100 in 24 hr at 1 atm at 23°

C.; and

d) depositing a first layer of conductive material on the first layer of polymeric material, wherein the conductive material;

i) generates an electromotive force when contacted with a modulated magnetic field;

or

ii) generates a magnetic field when contacted with an electromotive force;

e) depositing a second resist layer on the conductive material, wherein the second resist layer is patterned;

f) transferring the pattern to the first layer of conductive material, wherein a patterned conductive material is formed;

g) depositing a second layer of polymeric material comprising the properties set forth in part c) on the patterned conductive material; and

h) removing the solid substrate.

52. The method of claim 50, wherein the resist layer is patterned by a liquid reagent or a gaseous reagent.

53. The method of claim 52, wherein the gaseous reagent is plasma.

54. The method of claim 50, further comprising heat treating the microdevice to conform to a region of implantation in a biological environment.