Method and device for wafer scale packaging of optical devices using a scribe and break process
First Claim
1. A method for separating one or more chips from bonded wafer scale substrate structures, the method comprising:
- providing a first substrate comprising at least one integrated circuit chip thereon, the one integrated circuit chip comprising a cell region and a peripheral region, the peripheral region comprising a bonding pad region, the bonding pad region comprising one or more bonding pads and an antistiction region surrounding each of the one or more bonding pads;
coupling a second substrate comprising at least one or more deflection devices thereon to the first substrate;
exposing at least one or more bonding pads on the first substrate;
coupling a transparent member overlying the second substrate while forming a cavity region to allow the one or more deflection devices to move within a portion of the cavity region to form a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member;
forming a first scribe line on a first portion of the transparent member while maintaining a vicinity of the first scribe line associated with a first portion of the first substrate free from the first scribe line;
forming a second scribe line on a second portion of the transparent member and a second portion of the first substrate, the first portion of the first substrate and the second portion of the first substrate having the antistiction region formed between the first portion and the second portion;
causing a portion of the transparent member to be removed via the first scribe line and the second scribe line and exposing the antistiction region and the one or more bonding pads on the first substrate.
1 Assignment
0 Petitions
Accused Products
Abstract
A multilayered integrated optical and circuit device. The device has a first substrate comprising at least one integrated circuit chip thereon, which has a cell region and a peripheral region. Preferably, the peripheral region has a bonding pad region, which has one or more bonding pads and an antistiction region surrounding each of the one or more bonding pads. The device has a second substrate with at least one or more deflection devices thereon coupled to the first substrate. At least one or more bonding pads are exposed on the first substrate. The device has a transparent member overlying the second substrate while forming a cavity region to allow the one or more deflection devices to move within a portion of the cavity region to form a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member. The one or more bonding pads and the antistiction region are exposed while the one or more deflection devices is maintained within the portion of the cavity region.
32 Citations
34 Claims
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1. A method for separating one or more chips from bonded wafer scale substrate structures, the method comprising:
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providing a first substrate comprising at least one integrated circuit chip thereon, the one integrated circuit chip comprising a cell region and a peripheral region, the peripheral region comprising a bonding pad region, the bonding pad region comprising one or more bonding pads and an antistiction region surrounding each of the one or more bonding pads;
coupling a second substrate comprising at least one or more deflection devices thereon to the first substrate;
exposing at least one or more bonding pads on the first substrate;
coupling a transparent member overlying the second substrate while forming a cavity region to allow the one or more deflection devices to move within a portion of the cavity region to form a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member;
forming a first scribe line on a first portion of the transparent member while maintaining a vicinity of the first scribe line associated with a first portion of the first substrate free from the first scribe line;
forming a second scribe line on a second portion of the transparent member and a second portion of the first substrate, the first portion of the first substrate and the second portion of the first substrate having the antistiction region formed between the first portion and the second portion;
causing a portion of the transparent member to be removed via the first scribe line and the second scribe line and exposing the antistiction region and the one or more bonding pads on the first substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A multilayered integrated optical and circuit device, the device comprising:
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a first substrate comprising at least one integrated circuit chip thereon, the one integrated circuit chip comprising a cell region and a peripheral region, the peripheral region comprising a bonding pad region, the bonding pad region comprising one or more bonding pads and an antistiction region surrounding each of the one or more bonding pads;
a second substrate comprising at least one or more deflection devices thereon coupled to the first substrate and exposing at least one or more bonding pads on the first substrate;
a transparent member overlying the second substrate while forming a cavity region to allow the one or more deflection devices to move within a portion of the cavity region to form a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member;
wherein the one or more bonding pads and the antistiction region are exposed while the one or more deflection devices is maintained within the portion of the cavity region. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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20. A method for separating one or more chips from multilayered substrate structures, the method comprising:
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providing a first substrate, the first substrate comprising one or more bonding pads and a peripheral region;
bonding a second substrate to the first substrate while maintaining a gap between a portion of the first substrate and a portion of the second substrate in the peripheral region, the gap preventing attachment of the portion of the first substrate to the portion of the second substrate; and
removing a portion of the second substrate to expose the one or more bonding pads and the peripheral region. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27)
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28. A method for separating one or more chips from multilayered substrate structures, the method comprising:
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providing a first substrate, the first substrate comprising a one or more bonding pads and a peripheral region, the peripheral region comprising an antistiction region;
bonding a second substrate to the first substrate while preventing attachment of a portion of the first substrate to a portion of the second substrate using the antistiction region;
removing a portion of the second substrate to expose the one or more bonding pads and the peripheral region. - View Dependent Claims (29, 30, 31, 32, 33, 34)
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Specification