Pneumatic tire having accommodation tool of electronic component

• US 20060123899A1
• Filed: 12/13/2005
• Published: 06/15/2006
• Est. Priority Date: 12/14/2004
• Status: Active Grant

• Current Assignee: Omron Corporation, Sumitomo Rubber Industries Limited
• Original Assignee: Omron Corporation, Sumitomo Rubber Industries Limited
• Inventors: Kijima, Masaru, Kawai, Wakahiro, Nakao, Yukio
• Granted Patent: US 7,430,906 B2
• Time in Patent Office: Days
• US Class Current: 73/146
• CPC Class Codes: B60C 23/0493 for attachment on the tyre

Abstract

A pneumatic tire (1) has a tire cavity surface (HS) to which an accommodation tool (11) for accommodating an electronic component is bonded. The accommodation tool (11) includes an accommodation space (10) for accommodating an electronic component (W) therein, and includes a bonding region (11Sb) which is bonded to the tire cavity surface (HS) and which is provided on one end of a back surface (11S) directed to the tire cavity surface (HS). Only the bonding region (11Sb) is bonded to the tire cavity surface (HS), thereby making it possible to separate a portion of a non-bonding region (11Sa) on the side of the other end of the back surface (11S) from the tire cavity surface (HS).

Claims

1. A pneumatic tire having a tire cavity surface to which an accommodation tool for accommodating an electronic component is bonded, wherein

the accommodation tool includes an accommodation space for accommodating an electronic component therein, and includes a bonding region which is bonded to the tire cavity surface and which is provided on one end of a back surface directed to the tire cavity surface,

only the bonding region is bonded to the tire cavity surface, thereby making it possible to separate a portion of a non-bonding region on the side of the other end of the back surface from the tire cavity surface.

2. The pneumatic tire having the accommodation tool for accommodating the electronic component according to claim 1, wherein the accommodation space is formed in a portion of the non-bonding region.

3. The pneumatic tire having the accommodation tool for accommodating the electronic component according to claim 1, wherein the bonding region of the accommodation tool is bonded to a bead portion.

4. The pneumatic tire having the accommodation tool for accommodating the electronic component according to claim 1, wherein the bonding region is formed on the side of a side facing a tire rotation center line.

5. The pneumatic tire having the accommodation tool for accommodating the electronic component according to claim 1, wherein the electronic component is sealed in the accommodation space of the accommodation tool.

6. The pneumatic tire having the accommodation tool for accommodating the electronic component according to claim 1, wherein the accommodation tool is formed into a bag-like shape having an opening through which the electronic component is brought into and out from the accommodation space.

7. The pneumatic tire having the accommodation tool for accommodating the electronic component according to claim 6, wherein the opening is opened such as to face the tire rotation center line.

8. The pneumatic tire having the accommodation tool for accommodating the electronic component according to claim 1, wherein the accommodation tool comprises a rubber back sheet directed to the tire cavity surface, and a rubber front sheet superposed on the back sheet, a peripheral edge of the back sheet and a peripheral edge of the front sheet are bonded to each other, thereby forming the accommodation space.

9. The pneumatic tire having the accommodation tool for accommodating the electronic component according to claim 1, wherein the back surface of the accommodation tool or the tire cavity surface is provided with a non-adhering layer for forming the non-bonding region.