Variable watt density thermoelectrics

• US 20060124165A1
• Filed: 12/09/2004
• Published: 06/15/2006
• Est. Priority Date: 12/09/2004
• Status: Abandoned Application

• Current Assignee: Marlow Industries, Inc. (Coherent Corp.)
• Original Assignee: Marlow Industries, Inc. (Coherent Corp.)
• Inventors: Moczygemba, Joshua E., Bierschenk, James L., Aydelott, Tracy H.
• Application Number:
  US11/008,025
• Publication Number:
  US 20060124165A1
• Time in Patent Office: Days
• US Class Current: 136/212
• CPC Class Codes: H10N 10/01 Manufacture or treatment
• CPC Class Codes: H10N 10/13 characterised by the heat-exchanging means at the junction
• CPC Class Codes: H10N 10/17 characterised by the structure or configuration of the cell or thermocouple forming the device

Abstract

A thermoelectric device is provided that includes a top plate with surface including a first and second portion. A first plurality of thermoelectric elements are coupled to the first portion, and a second plurality of thermoelectric elements are coupled to the second portion. A base plate is coupled to the first and second plurality of thermoelectric elements. The first and second plurality of thermoelectric elements are operable to transfer thermal energy from the top plate to the base plate when an electrical current is passed through the first and second plurality of thermoelectric elements. The second plurality of thermoelectric elements receives a higher electrical current density than the first plurality of thermoelectric elements, and the second plurality of thermoelectric elements transfer more thermal energy per unit area of the top plate than the first plurality of thermoelectric elements.

Claims

1. A thermoelectric device, comprising:

a top plate;

wherein a surface of the top plate includes a first portion and a second portion;

a first plurality of thermoelectric elements coupled to the first portion of the top plate;

a second plurality of thermoelectric elements coupled to the second portion of the top plate;

a base plate coupled to the first and second plurality of thermoelectric elements;

wherein the first and second plurality of thermoelectric elements are operable to transfer thermal energy from the top plate to the base plate when an electrical current is passed through the first and second plurality of thermoelectric elements;

wherein the second plurality of thermoelectric elements receives a higher electrical current density than the first plurality of thermoelectric elements; and

wherein the second plurality of thermoelectric elements transfer more thermal energy per unit area of the top plate than the first plurality of thermoelectric elements.

2. The thermoelectric device of claim 1, wherein:

the top plate is coupled to a device to be cooled; and

wherein the second portion of the top plate is adjacent to a portion of the device to be cooled that is expected to emit more heat than other portions of the device to be cooled.

3. The thermoelectric device of claim 2, wherein the device to be cooled is a central processing unit (CPU).

4. The thermoelectric device of claim 1, wherein:

each of the second plurality of thermoelectric elements are electrically coupled to other ones of the second plurality of thermoelectric elements;

each of the first plurality of thermoelectric elements are electrically coupled to other ones of the first plurality of thermoelectric elements; and

none of the first plurality of thermoelectric elements are electrically coupled to ones of the second plurality of thermoelectric elements.

5. The thermoelectric device of claim 1, wherein:

each of the second plurality of thermoelectric elements are electrically coupled in series to other ones of the second plurality of thermoelectric elements;

the first plurality of thermoelectric elements is divided into at least first and second rows of thermoelectric elements;

each of the thermoelectric elements in the first row are electrically coupled in series to other ones of the thermoelectric elements in the first row;

each of the thermoelectric elements in the second row are electrically coupled in series to other ones of the thermoelectric elements in the second row; and

the first row and the second row are electrically coupled in parallel.

6. The thermoelectric device of claim 1, wherein:

each of the second plurality of thermoelectric elements are electrically coupled in series to other ones of the second plurality of thermoelectric elements;

the first plurality of thermoelectric elements is divided into at least first and second groups of thermoelectric elements; and

the first group and the second group are electrically coupled in parallel.

7. The thermoelectric device of claim 1, wherein:

the second section of the top plate is approximately centered on the top plate; and

the first section of the top plate surrounds the second section of the top plate.

8. The thermoelectric device of claim 1, wherein each of the second plurality of thermoelectric elements are spaced closer to other ones of the second plurality of thermoelectric elements than each of the first plurality of thermoelectric elements are spaced to other ones of the first plurality of thermoelectric elements.

9. The thermoelectric device of claim 1, wherein the first plurality of thermoelectric elements have a smaller average cross section than the second plurality of thermoelectric elements.

10. The thermoelectric device of claim 1, wherein the second plurality of thermoelectric elements include higher ZT performance materials that the first plurality of thermoelectric elements.

11. The thermoelectric device of claim 1, wherein the second plurality of thermoelectric elements have a shorter average height than the first plurality of thermoelectric elements.

12. The thermoelectric device of claim 11, further comprising:

a plurality of blocks of thermally conductive and electrically conductive material coupled to the second plurality of thermoelectric elements; and

wherein each one of the second plurality of thermoelectric elements is coupled to one of the plurality of blocks.

13. The thermoelectric device of claim 12, wherein each of the plurality of blocks includes metal selected from the group consisting of copper (Cu), nickel (Ni), molybdenum (Mo), and aluminum (Al).

14. The thermoelectric device of claim 12, wherein each of the combinations of ones of the second plurality of thermoelectric elements with ones of the plurality of blocks are approximately the same height as each of the first plurality of thermoelectric elements.

15. The thermoelectric device of claim 11, further comprising:

a first plurality of electrical interconnects electrically coupling the first plurality of thermoelectric elements;

a second plurality of electrical interconnects electrically coupling the second plurality of thermoelectric elements; and

wherein the second plurality of electrical interconnects have a taller average height than the first plurality of electrical interconnects.

16. The thermoelectric device of claim 1, further comprising:

a first plurality of blocks of thermally conductive and electrically conductive material coupled to the first plurality of thermoelectric elements;

wherein each one of the first plurality of thermoelectric elements is coupled to one of the first plurality of blocks;

a second plurality of blocks of thermally conductive and electrically conductive material coupled to the second plurality of thermoelectric elements; and

wherein each one of the second plurality of thermoelectric elements is coupled to one of the second plurality of blocks.

17. A thermoelectric device, comprising:

a top plate operable to be coupled to a central processing unit (CPU);

wherein a surface of the top plate includes a first portion and a second portion;

wherein the second section of the top plate is approximately centered on the top plate;

wherein the first section of the top plate surrounds the second section of the top plate;

a first plurality of thermoelectric elements coupled to the first portion of the top plate;

a second plurality of thermoelectric elements coupled to the second portion of the top plate;

wherein each of the second plurality of thermoelectric elements include a first block of thermoelectric material coupled to a second block of thermally conductive and electrically conductive material;

wherein each of the first and second plurality of thermoelectric elements are approximately the same height as other ones of the first and second plurality of thermoelectric elements;

a base plate coupled to the first and second plurality of thermoelectric elements;

wherein each of the second plurality of thermoelectric elements are electrically coupled in series to other ones of the second plurality of thermoelectric elements;

wherein the first plurality of thermoelectric elements are divided into at least first and second rows of thermoelectric elements;

wherein each of the thermoelectric elements in the first row are electrically coupled in series to other ones of the thermoelectric elements in the first row;

wherein each of the thermoelectric elements in the second row are electrically coupled in series to other ones of the thermoelectric elements in the second row;

wherein the first row and the second row are electrically coupled in parallel;

wherein the second plurality of thermoelectric elements receives a greater amount of electrical current than the first plurality of thermoelectric elements;

wherein the first and second plurality of thermoelectric elements are operable to transfer thermal energy from the top plate to the base plate; and

wherein the second plurality of thermoelectric elements transfer more thermal energy per unit area of the top plate than the first plurality of thermoelectric elements.

18. A method, comprising:

coupling a first plurality of thermoelectric elements to a first portion of a top plate;

coupling a second plurality of thermoelectric elements to a second portion of the top plate;

coupling a base plate to the first and second plurality of thermoelectric elements;

wherein the first and second plurality of thermoelectric elements are operable to transfer thermal energy from the top plate to the base plate when an electrical current is passed through the first and second plurality of thermoelectric elements;

wherein the second plurality of thermoelectric elements receives a higher electrical current density than the first plurality of thermoelectric elements; and

wherein the second plurality of thermoelectric elements transfer more thermal energy per unit area of the top plate than the first plurality of thermoelectric elements.

19. The method of claim 18, further comprising coupling the top plate to a device to be cooled;

and

wherein the second portion of the top plate is adjacent to a portion of the device to be cooled that is expected to emit more heat than other portions of the device to be cooled.

20. The method of claim 19, wherein the device to be cooled is a central processing unit (CPU).

21. The method of claim 18, further comprising:

electrically coupling each of the second plurality of thermoelectric elements to other ones of the second plurality of thermoelectric elements;

electrically coupling each of the first plurality of thermoelectric elements to other ones of the first plurality of thermoelectric elements; and

wherein none of the first plurality of thermoelectric elements are electrically coupled to ones of the second plurality of thermoelectric elements.

22. The method of claim 18, further comprising:

electrically coupling in series each of the second plurality of thermoelectric elements to other ones of the second plurality of thermoelectric elements;

dividing the first plurality of thermoelectric elements into at least first and second rows of thermoelectric elements;

electrically coupling in series each of the thermoelectric elements in the first row to other ones of the thermoelectric elements in the first row;

electrically coupling in series each of the thermoelectric elements in the second row to other ones of the thermoelectric elements in the second row; and

electrically coupling in parallel the first row and the second row.

23. The method of claim 18, further comprising:

electrically coupling in series each of the second plurality of thermoelectric elements to other ones of the second plurality of thermoelectric elements;

dividing the first plurality of thermoelectric elements into at least first and second groups of thermoelectric elements; and

electrically coupling in parallel the first group and the second group.

24. The method of claim 18, wherein:

the second section of the top plate is approximately centered on the top plate; and

the first section of the top plate surrounds the second section of the top plate.

25. The method of claim 18, further comprising spacing each of the second plurality of thermoelectric elements closer to other ones of the second plurality of thermoelectric elements than each of the first plurality of thermoelectric elements are spaced to other ones of the first plurality of thermoelectric elements.

26. The method of claim 18, wherein the first plurality of thermoelectric elements have a smaller average cross section than the second plurality of thermoelectric elements.

27. The method of claim 18, wherein the second plurality of thermoelectric elements include higher ZT performance materials that the first plurality of thermoelectric elements.

28. The method of claim 18, wherein the second plurality of thermoelectric elements have a shorter average height than the first plurality of thermoelectric elements.

29. The method of claim 28, further comprising:

coupling a plurality of blocks of thermally conductive and electrically conductive material to the second plurality of thermoelectric elements; and

wherein each one of the second plurality of thermoelectric elements is coupled to one of the plurality of blocks.

30. The method of claim 29, wherein each of the plurality of blocks includes metal selected from the group consisting of copper (Cu), nickel (Ni), molybdenum (Mo), and aluminum (Al).

31. The method of claim 29, wherein each of the combinations of ones of the second plurality of thermoelectric elements with ones of the plurality of blocks are approximately the same height as each of the first plurality of thermoelectric elements.

32. The thermoelectric device of claim 28, further comprising:

electrically coupling the first plurality of thermoelectric elements with a first plurality of electrical interconnects;

electrically coupling the second plurality of thermoelectric elements with a second plurality of electrical interconnects; and

wherein the second plurality of electrical interconnects have a taller average height than the first plurality of electrical interconnects.

33. The thermoelectric device of claim 18, further comprising:

coupling a first plurality of blocks of thermally conductive and electrically conductive material to the first plurality of thermoelectric elements;

wherein each one of the first plurality of thermoelectric elements is coupled to one of the first plurality of blocks;

coupling a second plurality of blocks of thermally conductive and electrically conductive material to the second plurality of thermoelectric elements; and

wherein each one of the second plurality of thermoelectric elements is coupled to one of the second plurality of blocks.