Production of an optoelectronic component that is enclosed in plastic, and corresponding methods

• US 20060124915A1
• Filed: 05/19/2004
• Published: 06/15/2006
• Est. Priority Date: 05/19/2003
• Status: Abandoned Application

• Current Assignee: X-FAB Semiconductor Foundries AG (X-FAB Silicon Foundries SE)
• Original Assignee: X-FAB Semiconductor Foundries AG (X-FAB Silicon Foundries SE)
• Inventors: Knechtel, Roy, Buettner, Siegfried
• Application Number:
  US10/556,980
• Publication Number:
  US 20060124915A1
• Time in Patent Office: Days
• US Class Current: 257/4
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

The invention relates to a simplified method for assembling optoelectronic components that are enclosed in plastic and the construction thereof. The individual component unit contains a semiconductor chip (11) and an optical window (10). A hermetic inclusion of at least the optically active of the semiconductor chip via the window ensues in the wafer-slicing process, i.e. before separation. A (window) wafer provided with recesses (7) and occupied, in areas, by a joining layer is joined to the pre-prepared semiconductor wafer (1) via the joining layer that seals the optically active areas. Before separation, the contact areas and the separating areas of the separation are exposed by a severing (8) that is precise with regard to the recesses. An inspection measuring of the component units can ensue when the wafers are joined.

Claims

1. A process for the production of an optoelectronic component enclosed in plastic and consisting of a semiconductor chip with optically active structures, which may also be present in connection with integrated circuits and an optically transparent window (10) located above it, the optically sensitive part (1) being hermetically sealed against the outer atmosphere by the optical window, which comprises the following production steps:

(a) preparing a plane-parallel sheet that is optically transparent in the relevant wavelength range and adapted to the size of the semiconductor wafer by

(A) making of indentations which are adapted to the element size of the semiconductor chips as regards their dimensions and arrangements in the bottom side of the sheet which is to be connected later on, which serve for the later exposing of the contact areas and separation paths when singling the chips, and

(B) applying a connection layer onto the bottom side of the sheet in such a structured manner that, after the subsequent connection, it spares the area of the optically active structure and encloses it in an annular fashion, but spares it and the subsequent contact areas and separation paths of singling; and

/or

(b) connecting the sheet of optically transparent material with the semiconductor wafer which contains the optically active structures and circuits in a finished condition by means of the connecting layer with the aid of adjusting means for the mutual alignment/covering of the structures present on both sheets; and

/or

(c) slicing (8) of the optically transparent sheet from the upper side by means of a processing in those areas in which this sheet comprises indentations (7) on the bottom side for the purpose of slicing; and

/or

(d) eliminating the separated parts of the optically transparent sheet above the contact areas and the separating traces of the semiconductor wafer; and

/or

(e) control measurements of the individual elements by means of terminals of the contacts in the contact areas; and

/or

(f) singling of the semiconductor wafer; and

/or

(g) further processing (in a known fashion) by means of providing the component unit on a carrier (13), wire bonding for the production of the outer terminals (13a) and enclosing of the component unit with plastic (14).

2. The process for the production of an optoelectronic component enclosed in plastic according to claim 1, wherein the making of the indentations and the providing of the connection layer is implemented in the reverse order with respect to the optically transparent sheet.

3. The process for the production of an optoelectronic component enclosed in plastic according to claim 1, wherein the making of the indentations (7) of the optically transparent sheet is carried out by means of cutting off by grinding.

4. The process for the production of an optoelectronic component enclosed in plastic according to claim 1, wherein the making of the indentations of the optically transparent disk is carried out by means of etching.

5. The process for the production of an optoelectronic component enclosed in plastic according to claim 1, wherein the providing of the connection layer (6) on the optically transparent sheet (5) is implemented homogeneously and then the structuring is carried out.

6. The process for the production of an optoelectronic component enclosed in plastic according to claim 1, wherein the providing of the connection layer on the optically transparent sheet is carried out in a structured fashion, e.g. by means of printing.

7. The process for the production of an optoelectronic component enclosed in plastic according to claim 1, wherein the optically transparent sheet (5) consists of quartz.

8. The process for the production of an optoelectronic component enclosed in plastic according to claim 1, wherein the optically transparent sheet consists of glass.

9. The process for the production of an optoelectronic component enclosed in plastic according to claim 1, wherein the optically transparent sheet consists of a semiconductor material.

10. The process for the production of an optoelectronic component enclosed in plastic according to claim 1, wherein the connection of the two sheets is carried out by means of sheet bonding.

11. The process for the production of an optoelectronic component enclosed in plastic according to claim 1, wherein the connection of the two sheets is carried out by means of a glass solder.

12. The process for the production of an optoelectronic component enclosed in plastic according to claim 1, wherein the connection of the two sheets is carried out by means of a plastic material.

13. The process for the production of an optoelectronic component enclosed in plastic according to claim 1, wherein the slicing of the optically transparent sheet is carried out by means of cutting off by grinding.

14. The process for the production of an optoelectronic component enclosed in plastic according to claim 1, wherein the slicing of the optically transparent sheet is implemented by means of laser irradiation.

15. The process for the production of an optoelectronic component enclosed in plastic according to claim 1, wherein, upon the sealing of the component unit, in which the optical window (10) is embedded in the surface of the plastic housing, with plastic, the lateral faces of the optical window are used for stopping the plastic injection molding composition.

16. An optoelectronic component, enclosed in plastic and producible according to a process according to claim 1 and one or several of the dependant claims.

20. The process according to claim 1 or claim 17, wherein the lateral end faces of the window (1) are roughened.

21. The process according to claim 1 or claim 17, wherein at least one surface of the sheet (10) is polished in particular as a plane-parallel sheet.

17. A process for producing one or several electronic components that are sealed and/or enclosed in plastic from a semiconductor chip (11) with at least one optically active structure (2) and an optically transparent window (10) that is affixed above it by means of a structured connection layer (6) and that hermetically seals the optically active structure (2),

wherein the semiconductor chip (11) is affixed on a metallic carrier strip (13) by means of an adhesive (12);

wherein, upon the sealing in plastic, the optical window is embedded in the surface of the plastic housing and the lateral faces of the optically transparent window (10) stop the spreading of the plastic material (14);

wherein, prior to the sealing with plastic to form a “

plastic sealing”

, an optical sheet (5) which is larger than the optical window (10) is connected (6) with several semiconductor chips (11) in a semiconductor wafer (1), the optical sheet (5) has indentations (7) on its bottom side that is the connection side to the semiconductor wafer (1);

after the connection, the optical sheet (5) is sliced or separated from its upper side until at least several of the indentations (7) are reached;

wherein at least one section of the optical sheet (5) is sliced or separated in order to expose at least one contact area (4) for the electrical contacting and at least one separation area for singling.

18. The process according to claim 17, wherein the slicing, severing or separating is implemented by means of sawing.

19. The process according to claim 17, wherein the slicing (8) is carried out up to the depth of the indentations (7) which must be separated and the respective separation point is above the respective indentation.