Thin gallium nitride light emitting diode device

• US 20060124941A1
• Filed: 12/12/2005
• Published: 06/15/2006
• Est. Priority Date: 12/13/2004
• Status: Abandoned Application

• Current Assignee: Hanbeam Co., Ltd.
• Original Assignee: Hanbeam Co., Ltd.
• Inventors: Choi, Min Ho, Kang, Jong Hoon, Oh, Byung Du, Lee, Jae Seung, Shin, Bu Gon, Yu, Min A.
• Application Number:
  US11/298,505
• Publication Number:
  US 20060124941A1
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/0554 External layer
• CPC Class Codes: H01L 2224/0555 Shape
• CPC Class Codes: H01L 2224/0556 Disposition
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/06131 being uniform, i.e. having a uniform pitch across the array
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/08 with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence

Abstract

Disclosed is a light emitting diode (LED) device that comprises a crystal structure of a sapphire substrate-free gallium nitride (GaN) LED, wherein the crystal structure is mounted on a first surface of a sub-mount substrate in the form of a unit chip, and the first surface of the sub-mount substrate has a surface area greater than the surface area of a region in which the unit chip is bonded. Preforms for manufacturing the LED device and a method for manufacturing the LED device are also disclosed. The sapphire substrate, on which the crystal structure of the light emitting diode has grown, is processed into a unit chip before being removed. Thus, any crack in the crystal structure of the light emitting diode that may occur during the removal of the sapphire substrate can be prevented. Therefore, a thin light emitting diode device can be manufactured in a mass production system.

Claims

1. A light emitting diode (LED) device that comprises a crystal structure of a sapphire substrate-free gallium nitride (GaN) LED, wherein the crystal structure is mounted on a first surface of a sub-mount substrate in the form of a unit LED chip, and the first surface of the sub-mount substrate has a surface area greater than the surface area of a region in which the unit chip is bonded.

2. The light emitting diode device according to claim 1, which is obtained by the steps of:

a first step of splitting the sapphire substrate, on which the crystal structure of the GaN LED has grown, into unit LED chips;

a second step of bonding at least one unit chip to the sub-mount substrate; and

a third step of removing the sapphire substrate from the unit chip.

3. The light emitting diode device according to claim 2, which is obtained by bonding at least two unit chips, spaced apart from each other, to the sub-mount substrate in the second step, and cutting the sub-mount substrate between two adjacent unit chips after the third step, so that each sub-mount substrate has at least one unit chip.

4. The light emitting diode device according to claim 2, which is obtained by bonding a single unit chip to the sub-mount substrate in the second step, wherein the first surface of the sub-mount substrate has an area greater than the surface area of the region in which the unit chip is bonded.

5. The light emitting diode device according to claim 1, wherein the unit LED chip has a size of 0.2×

0.2˜

5×

5 mm².

6. The light emitting diode device according to claim 2, wherein the sub-mount substrate is a wafer with a diameter of 1˜

6 inches.

7. The light emitting diode device according to claim 1, wherein the sub-mount substrate having the unit chip is mounted on a lead frame.

8. The light emitting diode device according to claim 1, wherein a metal layer is formed on the first surface of the sub-mount substrate, and the metal layer is exposed on the surface of the sub-mount substrate extending from a circumference of the region in which the unit chip is bonded.

9. The light emitting diode device according to claim 8, wherein the exposed metal layer serves as a reflection layer with a high light reflection ratio.

10. The light emitting diode device according to claim 8, wherein the exposed metal layer is subjected to wire bonding.

11. The light emitting diode device according to claim 8, wherein the metal layer is formed of at least one metal selected from the group consisting of Pt, Rh, Ru and Au, or alloys thereof.

12. The light emitting diode device according to claim 1, wherein the sub-mount substrate is comprised of a conductive material, and is connected directly to a p-ohmic contact electrode and a metal pad for heat sink area of a lead frame.

13. The light emitting diode device according to claim 2, wherein the sapphire substrate, on which the crystal structure of the light emitting diode has grown, is subjected to dry etching in a portion to be present as edges of the unit chip, before splitting the sapphire substrate, so as to provide flat lateral surfaces to the crystal structure of the light emitting diode present in the unit chip.

14. The light emitting diode device according to claim 2, wherein surface roughening is formed on the surface of the crystal structure of the LED, exposed upon the removal of the sapphire substrate, by way of dry or wet etching treatment.

15. The light emitting diode device according to claim 2, wherein a molding portion is formed on the GaN semiconductor layer on the surface of the crystal structure of the light emitting diode, exposed upon the removal of the sapphire substrate, the molding portion being formed by coating the GaN semiconductor layer with a mixture containing a molding material and a material transparent to visible light, whose refractive index is substantially equal to refractive index of the GaN semiconductor layer, and then with the molding material.

16. The light emitting diode device according to claim 15, wherein the surface of the crystal structure of the light emitting diode, exposed upon the removal of the sapphire substrate, is an n-type GaN semiconductor layer, and the material transparent to visible light, whose refractive index is equal to refractive index of the n-type GaN semiconductor layer, is TiO₂ powder.

17. The light emitting diode device according to claim 2, wherein the surface of the crystal structure of the light emitting diode, exposed upon the removal of the sapphire substrate, is an n-type GaN semiconductor layer, and the n-ohmic contact on the n-type GaN semiconductor layer is formed from at least one ohmic contact area for wire bonding pad or from a combination of at least one ohmic contact area for wire bonding pad with an ohmic contact strip line.

18. A first preform for manufacturing a light emitting diode device that comprises a sapphire substrate, on which a crystal structure of a GaN light emitting diode has grown, mounted on a sub-mount substrate in the form of at least two unit chips.

19. The first preform for manufacturing a light emitting diode device according to claim 18, wherein a pattern that displays a position, in which the unit chip is bonded, or a pattern that displays a position, in which the sub-mount substrate is split into the unit chip, is formed on the sub-mount substrate.

20. The first preform for manufacturing a light emitting diode device according to claim 18, wherein at least two unit chips are bonded periodically to a single sub-mount substrate, while being spaced apart at a predetermined interval between two adjacent unit chips.

21. The first preform for manufacturing a light emitting diode device according to claim 18, wherein adjacent unit chips have an interval controlled to prevent each unit chip being placed over an edge of a region to be subjected to irradiation of laser beams, when removing the sapphire substrate with laser.

22. The first preform for manufacturing a light emitting diode device according to claim 18, wherein a metal layer is formed on the first surface of the sub-mount substrate having the sapphire substrate, on which a crystal structure of a GaN light emitting diode has grown, mounted in the form of unit chips.

23. A second preform for manufacturing a light emitting diode device, which is obtained from the first preform for manufacturing a light emitting diode device according to claims 18, which comprises a sapphire substrate, on which the crystal structure of a GaN light emitting diode has grown, mounted on a sub-mount substrate in the form of at least two unit chips, by removing the sapphire substrate.

24. A third preform for manufacturing a light emitting diode device, which is obtained from the first preform for manufacturing a light emitting diode device according to claim 18, which comprises a sapphire substrate, on which the crystal structure of a GaN light emitting diode has grown, mounted on a sub-mount substrate in the form of at least two unit chips, by removing the sapphire substrate, and then by cutting the sub-mount substrate in a position between two adjacent unit chips.

25. A method for manufacturing a light emitting diode device by allowing a crystal structure of a gallium nitride light emitting diode to grow on a sapphire substrate, which comprises the steps of:

splitting the sapphire substrate, on which the crystal structure of the light emitting diode has grown, into a unit chip; and

removing the sapphire substrate from the unit chip.

26. The method for manufacturing a light emitting diode according to claim 25, which further comprises, before the step of removing the sapphire substrate, a step of bonding at least one unit chip to a sub-mount substrate after splitting the sapphire substrate, on which the crystal structure of the light emitting diode has grown, into a unit chip.

27. The method for manufacturing a light emitting diode according to claim 26, wherein at least two unit chips are bonded to the sub-mount substrate in the unit chip bonding step, and the method further comprises a step of cutting the sub-mount substrate in such a manner that the sub-mount substrate has at least one unit chip, after the step of removing the sapphire substrate.

28. The method for manufacturing a light emitting diode according to claim 27, wherein at least two unit chips, bonded to a single sub-mount substrate, are arranged periodically, while being spaced apart at a predetermined interval between adjacent two unit chips, when bonding at least two unit chips to the sub-mount substrate.

29. The method for manufacturing a light emitting diode according to claim 25, wherein the sapphire substrate is removed by way of laser in the step of removing the sapphire substrate.

30. The method for manufacturing a light emitting diode according to claim 26, wherein at least one unit chip is bonded to the sub-mount substrate in such a manner that adjacent unit chips have a interval controlled to prevent each unit chip being placed over an edge of a region to be subjected to irradiation of laser beams, when removing the sapphire substrate with laser.

31. The method for manufacturing a light emitting diode according to claim 29, wherein the laser has a wavelength ranging from 200 nm to 365 nm.

32. The method for manufacturing a light emitting diode according to claim 25, wherein the crystal structure of the light emitting diode is allowed to grow on the sapphire substrate having a metal buffer layer formed thereon, and the sapphire substrate is removed by dissolving the metal buffer layer in the step of removing the sapphire substrate.

33. The method for manufacturing a light emitting diode according to claim 26, wherein at least two unit chips, spaced apart from each other at a predetermined interval, are bonded to the sub-mount substrate, and the sub-mount substrate is cut in a position between two adjacent unit chips, or only one unit chip is bonded to a sub-mount substrate larger than the surface area of the region in which the unit chip is bonded, and a surface of the sub-mount substrate extending from the circumference of the region, in which the unit chip is bonded, is subjected to wire bonding.

34. The method for manufacturing a light emitting diode according to claim 26, wherein at least one unit chip is bonded to the sub-mount substrate having a metal layer formed thereon.