Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same

• US 20060124953A1
• Filed: 12/14/2004
• Published: 06/15/2006
• Est. Priority Date: 12/14/2004
• Status: Abandoned Application

• Current Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Slater, David B. Jr., Negley, Gerald H.
• Application Number:
  US11/011,748
• Publication Number:
  US 20060124953A1
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

A mounting substrate for a semiconductor light emitting device includes a solid metal block having first and second opposing metal faces. The first metal face includes a cavity that is configured to mount at least one semiconductor light emitting device therein, and to reflect light that is emitted by at least one semiconductor light emitting device that is mounted therein away from the cavity. One or more semiconductor light emitting devices are mounted in the cavity. A cap having an aperture is configured to matingly attach to the solid metal block adjacent the first metal face such that the aperture is aligned to the cavity. Reflective coatings, conductive traces, insulating layers, pedestals, through holes, lenses, flexible films, optical elements, phosphor, integrated circuits, optical coupling media, recesses and/or meniscus control regions also may be provided in the package. Related packaging methods also may be provided.

Claims

1. A mounting substrate for a semiconductor light emitting device comprising:

a solid metal block including first and second opposing metal faces;

the first metal face including therein a cavity that is configured to mount at least one semiconductor light emitting device therein and to reflect light that is emitted by at least one semiconductor light emitting device that is mounted therein away from the cavity; and

a cap including an aperture that extends therethrough, the cap being configured to matingly attach to the solid metal block adjacent the first metal face such that the aperture is aligned to the cavity.

2. A mounting substrate according to claim 1 further comprising:

a plurality of heat sink fins in the second metal face.

3. A mounting substrate according to claim 1 further comprising a reflective coating in the cavity and in the aperture.

4. A mounting substrate according to claim 1 further comprising a first conductive trace on the first metal face and a second conductive trace in the cavity that are configured to connect to at least one semiconductor light emitting device that is mounted in the cavity.

5. A mounting substrate according to claim 1 wherein the first metal face further includes a pedestal therein and wherein the cavity is in the pedestal.

6. A mounting substrate according to claim 1 in combination with at least one semiconductor light emitting device that is mounted in the cavity.

7. A mounting substrate according to claim 6 in further combination with a lens that extends across the aperture.

8. A mounting substrate according to claim 6 wherein the at least one semiconductor light emitting device comprises at least one light emitting diode.

9. A mounting substrate according to claim 6 in combination with an optical coupling media in the cavity and in the aperture.

10. A mounting substrate according to claim 4 wherein the aperture includes therein a recess that is configured to expose the first conductive trace on the first face.

11. A mounting substrate according to claim 9 wherein the cover plate includes at least one meniscus control region therein that is configured to control a meniscus of the optical coupling media in the cavity.

12. A mounting substrate for semiconductor light emitting devices comprising:

a solid metal block including first and second opposing metal faces;

the first metal face including therein a plurality of cavities, a respective one of which is configured to mount at least one semiconductor light emitting device therein and to reflect light that is emitted by the at least one semiconductor light emitting device that is mounted therein away from the respective cavity; and

a cap including a plurality of apertures that extend therethrough, the cap being configured to matingly attach to the solid metal block adjacent the first metal face such that a respective aperture is aligned to a respective cavity.

13. A mounting substrate according to claim 12 further comprising:

a plurality of heat sink fins in the second metal face.

14. A mounting substrate according to claim 12 further comprising a reflective coating in the plurality of cavities and in the plurality of apertures.

15. A mounting substrate according to claim 12 further comprising first conductive metal traces on the first metal face and second conductive traces in the plurality of cavities that are configured to connect to at least one semiconductor light emitting device that is mounted in the respective cavity.

16. A mounting substrate according to claim 12 wherein the first metal face further includes a plurality of pedestals therein and wherein a respective one of the plurality of cavities is in a respective one of the plurality of pedestals.

17. A mounting substrate according to claim 12 in combination with at least one semiconductor light emitting device that is mounted in a respective cavity.

18. A mounting substrate according to claim 17 in further combination with a plurality of lenses, a respective one of which extends across a respective one of the apertures.

19. A mounting substrate according to claim 17 wherein the semiconductor light emitting devices comprise light emitting diodes.

20. A mounting substrate according to claim 17 in combination with an optical coupling media in the cavities and in the apertures.

21. A mounting substrate according to claim 15 wherein a respective aperture includes therein a respective recess that is configured to expose the respective first conductive traces on the first face.

22. A mounting substrate according to claim 17 wherein the cover plate includes a plurality of meniscus control regions therein that are configured to control a meniscus of the optical coupling media in the respective cavity.

23. A semiconductor light emitting device packaging method comprising:

fabricating a solid metal block including first and second opposing metal faces, the first metal face including therein a plurality of cavities, a respective one of which is configured to mount at least one semiconductor light emitting device therein and to reflect light that is emitted by the at least one semiconductor light emitting device that is mounted therein away from the respective cavity;

forming an insulating layer on the first metal face;

forming a conductive layer on the insulating layer that is patterned to provide a reflective coating in the plurality of cavities, first conductive traces on the first face and second conductive traces in the plurality of cavities that are configured to connect to a plurality of semiconductor light emitting devices that are mounted in the cavities;

mounting at least one semiconductor light emitting device in a respective cavity, and electrically connected to the first and second conductive traces; and

matingly attaching to the solid metal block adjacent the first metal face, a cap including a plurality of apertures that extend therethrough, such that a respective aperture is aligned to a respective cavity.

24. A method according to claim 23 wherein mounting is preceded by:

fabricating a reflective coating in the plurality of cavities.

25. A method according to claim 23 wherein matingly attaching is followed by:

placing an optical coupling media in the cavities and in the apertures.

26. A method according to claim 25 wherein placing an optical coupling media is followed by:

placing a respective lens across a respective one of the apertures.

27. A semiconductor light emitting device package comprising:

a solid metal block including first and second opposing metal faces, the first metal face including therein a plurality of cavities, a respective one of which is configured to mount at least one semiconductor light emitting device therein and to reflect light that is emitted by the at least one semiconductor light emitting device that is mounted therein away from the respective cavity;

an insulating layer on the first metal face;

at least one semiconductor light emitting device in a respective cavity;

a conductive layer on the insulating layer that is patterned to provide a reflective coating in the plurality of cavities, first conductive traces on the first face and second conductive traces in the plurality of cavities that electrically connect to the at least one semiconductor light emitting device in the respective cavity; and

a cap that is matingly attached to the solid metal block adjacent the first face, the cap including a plurality of apertures that extend therethrough that are affixed such that a respective aperture is aligned to a respective cavity.

28. A package according to claim 27 further comprising optical coupling media in the cavities and in the apertures.

29. A package according to claim 28 further comprising:

a plurality of lenses, a respective one of which extends across a respective one of the apertures.