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Cross-fill pattern for metal fill levels, power supply filtering, and analog circuit shielding

  • US 20060124972A1
  • Filed: 01/26/2006
  • Published: 06/15/2006
  • Est. Priority Date: 01/30/2004
  • Status: Active Grant
First Claim
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1. An integrated circuit including a metal fill pattern comprising:

  • a first plurality of metal traces electrically connected to a power supply pad; and

    a second plurality of metal traces electrically connected to a ground pad;

    wherein said second plurality of metal traces are interdigitated between said first plurality of metal traces to form a purposeful inter-metal capacitance therebetween.

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