Cross-fill pattern for metal fill levels, power supply filtering, and analog circuit shielding
First Claim
1. An integrated circuit including a metal fill pattern comprising:
- a first plurality of metal traces electrically connected to a power supply pad; and
a second plurality of metal traces electrically connected to a ground pad;
wherein said second plurality of metal traces are interdigitated between said first plurality of metal traces to form a purposeful inter-metal capacitance therebetween.
9 Assignments
0 Petitions
Accused Products
Abstract
A cross-fill metal fill pattern technique is provided such that portions of a metal fill pattern are patterned to accomplish a secondary function. For instance, in the exemplary embodiments, ever other trace or line of interdigitated fingers is routed to a ground, while the interceding traces or lines of interdigitated fingers are routed to a power supply. In this way, a capacitor function is formed across the power supply, providing additional decoupling for the power supply. Moreover, a suitably tight cross-fill metal fill pattern (i.e., higher density of metal) provides an electrical shielding function for electromagnetic radiation passing therethrough.
18 Citations
13 Claims
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1. An integrated circuit including a metal fill pattern comprising:
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a first plurality of metal traces electrically connected to a power supply pad; and
a second plurality of metal traces electrically connected to a ground pad;
wherein said second plurality of metal traces are interdigitated between said first plurality of metal traces to form a purposeful inter-metal capacitance therebetween. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13-18. -18. (canceled)
Specification