Semiconductor device and method for manufacturing the same

• US 20060125037A1
• Filed: 02/14/2006
• Published: 06/15/2006
• Est. Priority Date: 07/17/2002
• Status: Active Grant

• Current Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Original Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Inventors: Misawa, Takeshi
• Granted Patent: US 7,384,812 B2
• Time in Patent Office: Days
• US Class Current: 257/432
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 27/14609 Pixel-elements with integrated switching, control, storage or amplification elements scanning details of imagers (circuitry of solid-state image sensors H04N25/00); circuitry of imagers H04N25/70
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14621 Colour filter arrangements
• CPC Class Codes: H01L 27/14623 Optical shielding
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14643 Photodiode arrays; MOS imagers
• CPC Class Codes: H01L 27/14806 Structural or functional details thereof
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

The semiconductor device according to this invention is chacterized by a package structure of a semiconductor substrate 100 equipped with a photoelectric converting portion, wherein a light-shading means 104 is arranged in an area corresponding to at least the photoelectric converting portion on the side of the rear surface of the semiconductor substrate.

Claims

1. A method for manufacturing a semiconductor device comprising the steps of:

a forming step for forming a plurality of semiconductor devices on the front surface of a semiconductor substrate;

a bonding step for bonding a wiring board on the rear surface of said semiconductor substrate;

a separating step for separating a bonding structure, obtained by bonding, into semiconductor devices; and

a grinding step for forming a rough surface on the rear surface of the semiconductor substrate to reflect light away from the rear surface.

2. A method for manufacturing a semiconductor device comprising the steps of:

a forming step for forming a plurality of semiconductor devices on the front surface of a semiconductor substrate;

a bonding step for bonding a wiring board on the rear surface of said semiconductor substrate using light-shading adhesive provided between the wiring board and the semiconductor substrate and the light-shading adhesive suppressing light reflected from the rear surface of the semiconductor substrate from reaching the semiconductor device; and

a separating step for separating a bonding structure obtained by bonding, into said semiconductor devices.