MODULARIZED PROBE CARD FOR HIGH FREQUENCY PROBING

• US 20060125498A1
• Filed: 12/15/2004
• Published: 06/15/2006
• Est. Priority Date: 12/15/2004
• Status: Active Grant

• Current Assignee: ChipMOS TECHNOLOGIES (Bermuda) LTD. (Chipmos)
• Original Assignee: ChipMOS TECHNOLOGIES (Bermuda) LTD. (Chipmos), Chipmos Technologies Incorporated (Chipmos)
• Inventors: Liu, An-Hong, Lee, Yao-Jung, Wang, Yeong-Her, Chao, Yeong-Ching
• Granted Patent: US 7,088,118 B2
• Time in Patent Office: Days
• US Class Current: 324/756.30
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: G01R 31/2822 of microwave or radiofrequency circuits of attenuation, gain, e.g. using network analyzers G01R27/28
• CPC Class Codes: G01R 31/2889 Interfaces, e.g. between probe and tester G01R31/31905 and G01R1/07364 take precedence

Abstract

A modularized probe head for high frequency probing is provided. The probe head mainly includes a probe head, a mounting board and an interposer between the probe head and the mounting board. The probe head has a plurality of cavities on its back surface. A plurality of decoupling components are installed inside the cavities and are electrically coupled to the ground/power circuitry of the probe head via by-pass circuitry. The interposer has a bottom surface corresponding to the back surface of the probe head, and includes a plurality of contact ends on the bottom surface. Some of the contact ends electrically contact the decoupling components and electrically coupled to the ground plane of the mounting board.

Claims

1-8. -8. (canceled)

9. A modularized probe card comprising:

a probe head having a probing surface, a back surface and a plurality of cavities on the back surface;

a plurality of probes fabricated on the probing surface of the probe head;

a plurality of decoupling components installed in the cavities and electrically connected to the corresponding probes;

a mounting board having multi-layer circuitries; and

an interposer installed between the probe head and the mounting board, wherein the interposer has a plurality of the first contact ends on a bottom surface thereof, the bottom surfaces of the interposer is aligned to the back surface of the probe head such that the first contact ends electrically contact the corresponding decoupling components,

wherein the first contact ends include flexible bumps, wherein each flexible bump includes a dielectric body and at least a metal pin around the flexible bumps.

10. The modularize probe head according to claim 9, wherein one ends of the metal pins are bonded to the electrical vias of the interposer, the other ends of the metal pins are formed above the flexible dielectric bumps.

11-16. -16. (canceled)