RFID tag design with circuitry for wafer level testing
First Claim
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1. An apparatus, comprising:
- an RFID tag comprising a receive signal path from one or more primary inputs to a controller, said receive signal path to process an electrical receive signal originating from said inputs as a consequence of said inputs having received a wireless signal, a second signal path flowing into said receive signal path from a die edge of said RFID tag, said second signal path to transport an electrical test signal that emulates said receive signal while said RFID tag is being tested on wafer, said receive signal path flowing through both a first input of a logic circuit and said logic circuit'"'"'s output, said logic circuit having a second input coupled to said second signal path.
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Abstract
Technologies suitable for on-wafer testing in the ubiquitous computing era are disclosed. Among the inventive features disclosed are: 1) clustering of wafer test probe landing area sites for parallel test sequencing; 2) on wafer test wiring that runs along the wafer'"'"'s scribe regions; 3) on-wafer test wiring that can be scribed and yet thwart the spread of contamination into the product die; 4) an RFID tag design that allows for on-wafer testing without imposing substantial semiconductor surface area penalty; 5) an RFID tag design that includes built-in self test (BIST) circuitry for the RFID tag'"'"'s non-volatile memory.
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Citations
46 Claims
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1. An apparatus, comprising:
an RFID tag comprising a receive signal path from one or more primary inputs to a controller, said receive signal path to process an electrical receive signal originating from said inputs as a consequence of said inputs having received a wireless signal, a second signal path flowing into said receive signal path from a die edge of said RFID tag, said second signal path to transport an electrical test signal that emulates said receive signal while said RFID tag is being tested on wafer, said receive signal path flowing through both a first input of a logic circuit and said logic circuit'"'"'s output, said logic circuit having a second input coupled to said second signal path. - View Dependent Claims (2, 3, 4, 5, 6, 7, 11, 12)
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8. An apparatus, comprising:
an RFID tag comprising a receive signal path that flows from one or more primary inputs, said receive signal path to process an electrical receive signal originating from said inputs as a consequence of said inputs having received a wireless signal, said RFID tag further comprising a rectifier coupled to said inputs, a node where a supply voltage for said RFID tag is to appear residing downstream from an output of said rectifier, a diode'"'"'s cathode coupled to said node, said diode'"'"'s anode coupled to wiring that provides said RFID tag'"'"'s supply voltage while said RFID tag is being tested on wafer. - View Dependent Claims (9, 10)
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13. An apparatus, comprising:
an RFID tag comprising a receive signal path that flows from one or more primary inputs, said receive signal path to process an electrical receive signal originating from said inputs as a consequence of said inputs having received a wireless signal, said RFID tag also comprising a test signal path (possibly including active circuits) to transport a test signal while said RFID tag is being tested on wafer, said test signal path tracing from, or back to, an open circuit residing within the semiconductor substrate of said RFID tag, said open circuit caused by the scribing of said wafer. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21)
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22. An apparatus, comprising:
an RFID tag comprising a receive signal path from one or more primary inputs to a controller, said receive signal path to process an electrical receive signal originating from said inputs as a consequence of said inputs having received a wireless signal, said RFID tag also comprising a response signal path that flows from said controller through an impedance controller to said inputs, said response signal path to communicate to a system that sends said wireless signal, a third signal path flowing from said response signal path to a die edge of said RFID tag, said third signal path to transport a response signal while said RFID tag is being tested on wafer. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29, 30)
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31. A method, comprising:
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applying a supply voltage to an RFID tag that has not yet been diced from its wafer, said supply voltage applied to said RFID tag at a die edge of said RFID tag, a channel of a multiplexer of said RFID tag being enabled as a consequence of said applying; and
,propagating a test signal through said multiplexer channel as part of testing said RFID tag on wafer. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46)
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Specification