Inductor, resonant circuit, semiconductor integrated circuit, oscillator, and communication apparatus

• US 20060125589A1
• Filed: 12/08/2005
• Published: 06/15/2006
• Est. Priority Date: 12/10/2004
• Status: Active Grant

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Hamaguchi, Mutsumi, Tamata, Mitsuru
• Granted Patent: US 7,295,096 B2
• Time in Patent Office: Days
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H03B 5/1841 the frequency-determining element being a strip line resonator H03B5/1805, H03B5/1817, H03B5/1864 and H03B5/1882 take precedence

Abstract

An inductor of the present invention includes a plurality of insulating layers being stacked and coil patterns respectively provided on predetermined layers of the insulating layers. The coil patterns are provided on at least two of the insulating layers, and electrically connected to each other. With this arrangement, it is possible to improve Q of the inductor without increasing the size of the inductor.

Claims

1. An inductor, comprising:

a plurality of insulating layers being stacked; and

coil patterns being respectively provided on predetermined layers of the insulating layers,

at least two of the insulating layers having the respective coil patterns provided thereon, the coil patterns being electrically connected to each other.

2. The inductor according to claim 1, wherein the coil patterns are electrically connected to each other through a plurality of via holes.

3. The inductor according to claim 1, wherein a plurality of shielding via holes is provided so as to surround the coil patterns.

4. The inductor according to claim 3,

wherein the shielding via holes are provided in a plurality of rows around the coil patterns, and

wherein the shielding via holes in adjacent rows are arranged in a staggered manner.

5. A resonant circuit, comprising:

an inductor; and

a variable capacitance device being provided in parallel to the inductor,

the inductor including;

a plurality of insulating layers being stacked; and

coil patterns respectively provided on predetermined layers of the insulating layers,

at least two of the insulating layers having the respective coil patterns being provided thereon,

the coil patterns being electrically connected to each other.

6. The resonant circuit according to claim 5, wherein a full-surface GND pattern is provided below the bottom layer of the insulating layers of the inductor.

7. A semiconductor integrated circuit, comprising a resonant circuit,

the resonant circuit including:

an inductor; and

a variable capacitance device being provided in parallel to the inductor,

the inductor having;

a plurality of insulating layers being stacked; and

coil patterns respectively provided on predetermined layers of the insulating layers,

at least two of the insulating layers having the respective coil patterns being provided thereon, and

the coil patterns being electrically connected to each other.

8. An oscillator, comprising a resonant circuit,

the resonant circuit including:

an inductor; and

a variable capacitance device being provided in parallel to the inductor,

the inductor having;

a plurality of insulating layers being stacked; and

coil patterns respectively provided on predetermined layers of the insulating layers,

at least two of the insulating layers having the respective coil patterns being provided thereon, and

the coil patterns being electrically connected to each other.

9. A communication apparatus, comprising an oscillator,

the oscillator including a resonant circuit having:

an inductor; and

a variable capacitance device being provided in parallel to the inductor,

the inductor having;

a plurality of insulating layers being stacked; and

coil patterns respectively provided on predetermined layers of the insulating layers,

at least two of the insulating layers having the respective coil patterns being provided thereon, and

the coil patterns being electrically connected to each other.